Abstract: The optical-transceiver module includes an optical transmitter and an optical receiver. The optical transceiver module also includes an internal serial bus and a plurality of addressable components electrically coupled to the internal serial bus. Each of the addressable components included a serial interface for communicating with the internal serial bus, and a memory. Each addressable component also includes a unique address or chip select logic coupled to a controller via a chip select line. This allows data to be addressed to specific addressable components. The addressable components may include a laser driver, a laser bias controller, a power controller, a pre-amplifier, a post-amplifier, a laser wavelength controller, a main controller, a electrothermal cooler, an analog-to-digital converter, a digital-to analog converter, an APD bias controller, or any combination of the aforementioned components.

Abstract: Methods of manufacturing lead frame connectors for use in connecting optical sub-assemblies to printed circuit boards in optical transceiver modules are disclosed. The lead frame connectors are formed by first stamping a selected configuration of conductors in a conductive ribbon. Each of the conductors can then be secured in a fixed position with respect to each other. A casing having a first part and a second part can then be molded about the conductors such that each of the conductors forms an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The conductors can be bent into any desired position to allow the electrical contacts to be connected to the optical sub assembly and the contact points to be connected to the printed circuit board.

Abstract: A multi-channel optoelectronic device is configured to establish a redundant status link with a remote device. The optoelectronic device can transmit N transmit optical signals to the remote device over a plurality of transmit channels and receive N receive optical signals from the remote device over a plurality of receive channels. The optoelectronic device includes one or more spare transmit and receive channels. When used with a remote device having spare transmit and receive channels, each device can establish a status link with the other and use the status link to switch out transmit and/or receive channels to identify and permanently switch out the worst transmit and/or receive channels. Alternately, the device can interoperate with a non-status-link enabled remote device by determining that the remote device is not status-link enabled, transitioning to a low transmit power mode, and transmitting and receiving over a plurality of default transmit and receive channels.

Abstract: An edge connector suitable for attachment with a printed circuit board. The edge connector comprises a body composed of a plastic resin, the body defining a first end that is configured to operably attach to a portion of a printed circuit board and a second end configured to operably connect to a slot in a host device and a plurality of conductive traces and contact pads defined on a portion of a surface of the body, the traces being configured to electrically connect with corresponding traces defined on the printed circuit board.

Abstract: An integrated cable configured to communicate over much of its length using one or more optical fibers includes an electrical connector at least one end. The electrical connector at a first end of the integrated cable and an optoelectronic device coupled to or included in the other end of the integrated cable may utilize a bidirectional status link to transmit status data to each other. If the status data indicates that optical signals transmitted over the optical channels between the two devices are not potentially exposed to view, the two devices may operate above nominal eye safety limits. Otherwise, the two devices may operate at or below nominal eye safety limits. If the second optoelectronic device is not status-link enabled, the first optoelectronic device may operate at or below nominal eye safety limits.

Abstract: An embodiment disclosed herein relates to a communications module. The communications module includes a body composed of a plastic resin and a plurality of conductive traces and contact pads defined on a portion of a surface of the body. The module also includes at least one substantially vertical ridge defined on the body surface, and at least one pocket defined on the body suitable for receiving an electronic component. The communications module may also include a body composed of a plastic resin and conductive features defined on a surface of the body configured to render the communications module operable without implementing a printed circuit board as part of the body. Additional embodiments relate to systems and methods for attaching one or more optical transmit assemblies to the communications module and for electrically connecting conductive traces in a temporary fashion on the surface of the body of the communications module.

Abstract: A robust and redundant status link is established by a first multi-channel optoelectronic device with a second multi-channel optoelectronic device in a multi-channel communication link. Transmitter bias currents are effectively modulated with a status link modulation signal representative of status data and subsequently modulated with primary data modulation signals. The resulting signals are transformed into optical signals and transmitted over the link as main communication links combined with a status link. At the second device, the optical signals are received and converted to electrical signals. The receipt of the optical signals creates multiple receiver bias currents, which may be monitored to detect the status link modulation signal. The second device may adjust various operating parameters in response to the information conveyed by the status link.

Abstract: Devices, systems and methods for thermal testing of optoelectronic modules are disclosed. The device includes a frame member, a thermoelectric cooler, a plate in thermal contact with the DUT, a heat sink in thermal contact with the frame, and a metallic clip for attaching the thermal testing device to the module (DUT). The clip secures the thermoelectric cooler to the DUT. The method includes the steps of providing a testing apparatus having a printed circuit board with a test circuit formed thereon. The test board also has an electrical interface disposed in electrical communication with the test circuit, and a thermal testing assembly. A temporary electrical connection is formed between the DUT device and the interface. The thermal testing assembly is used to maintain a test temperature of the DUT device. A data stream is transmitted through the DUT device and then evaluated for adherence to a defined specification.

Abstract: Integrated optical subassemblies (OSA) such as integrated transmit and receive optical subassemblies that may be implemented with an optical transceiver module that includes a molded body. The integrated OSA includes a mounting surface defined on a vertical portion of the molded body, a wall extending about the mounting surface, at least one optoelectronic device, such as a laser diode or a photodiode mounted on a transimpendence amplifier, positioned on the mounting surface, a plurality of bond pads included on the mounting surface in electrical connection with the at least one optoelectronic device, a plurality of conductive feedthroughs defined through the mounting surface, each feedthrough being in electrical communication with a corresponding one of the bond pads; and an optical fiber port that engages the wall extending about the mounting surface, wherein the optical fiber port is configured for receiving an optical fiber cable.

Abstract: Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a stamped and bent conductive lead structure that is encased in a plurality of insert injection molded plastic casings. The plastic casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.

Abstract: A low inductance structure for improving the integrity of data signals carried in an optical subassembly is disclosed. In one embodiment the optical subassembly comprises a housing containing a lens assembly and an optical isolator. The optical subassembly further includes an optoelectronic package having a base defining a mounting surface that cooperates with a cap to define a hermetic enclosure. First and second signal leads of the subassembly include ends that extend into the hermetic enclosure. A submount is disposed on the base mounting surface. A low inductance structure is integrally formed with the submount and includes a dielectric body interposed between the first and second leads. The body includes shaped edges and conductive pad structures in electrical communication with conductive traces disposed on the submount. Each pad structure is also in electrical communication with a respective one of the first and second signal leads via a plurality of wirebonds.

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.

Abstract: Devices, systems and methods for thermal testing of optoelectronic modules are disclosed. The device includes a frame member, a thermoelectric cooler, a plate in thermal contact with the DUT, a heat sink in thermal contact with the frame, and a metallic clip for attaching the thermal testing device to the module (DUT). The clip secures the thermoelectric cooler to the DUT. The method includes the steps of providing a testing apparatus having a printed circuit board with a test circuit formed thereon. The test board also has an electrical interface disposed in electrical communication with the test circuit, and a thermal testing assembly. A temporary electrical connection is formed between the DUT device and the interface. The thermal testing assembly is used to maintain a test temperature of the DUT device. A data stream is transmitted through the DUT device and then evaluated for adherence to a defined specification.

Abstract: Methods and processes are disclosed for calibrating optoelectronic devices, such as optoelectronic transceivers and optoelectronic receivers, based upon an avalanche photodiode breakdown voltage. In general, the method involves adjusting a reverse-bias voltage of the avalanche photodiode until avalanche breakdown of the avalanche photodiode occurs. An optimized APD reverse-bias voltage is then determined by reducing the reverse-bias voltage at which avalanche breakdown occurs by a predetermined offset voltage. This process is performed at a variety of different temperatures. Information concerning each temperature and the corresponding optimized APD reverse-bias voltage is stored in a memory of the optoelectronic device.

Abstract: A transmission mechanism for transmitting an electrical signal from the output stage of an electro-optic transducer driver to an electro-optic transducer. The transmission mechanism includes the electro-optic transducer, the electro-optic transducer driver and a termination resistor. A first node of the termination resistor is coupled to the first differential input terminal of the electro-optic transducer. A second node of the termination resistor is coupled to the first output node of the electro-optic transducer driver. In addition, a second differential input terminal of the electro-optic transducer is coupled to a second output node of the electro-optic transducer driver. Such connections provide for a first DC path from the first differential input terminal of the electro-optic transducer to the second electro-optic transducer driver output node and a second DC path from the first node of the termination resistor to first electro-optic transducer driver output node.

Abstract: A controller for controlling the reverse-bias voltage of an avalanche photodiode in a transceiver or receiver. The controller includes memory for storing information related to the avalanche photodiode, and analog to digital conversion circuitry for receiving an analog signal corresponding to the temperature of the avalanche photodiode, converting the received analog signal into a digital value, and storing the digital value in a predefined location within the memory. Control circuitry in the controller controls the operation of the avalanche photodiode and a temperature lookup table store in the memory. A serial interface enables a host device to read from and write to locations within the memory. The invention also controls the reverse-bias voltage of an avalanche photodiode in a transceiver or receiver.

Abstract: The method and apparatus for monitoring a photo-detector generates a highly compliant mirror current across a broad range of photo-detector current levels. The apparatus for monitoring includes: a pair of bipolar transistors and a first non-linear isolation element. The pair of transistors are connected in a mirror configuration with a sense transistor one of the pair of transistors sensing a photo-detector current and with a mirror transistor one of the pair of transistors mirroring the photo-detector current with a mirror current. The first non-linear isolation element has at least two terminals a first of which couples to the collector of the mirror transistor. The first non-linear isolation element exhibits a non-linear voltage drop between the at least two terminals in response to varying levels of the mirror current to improve compliance between the mirror current and the detector current. Methods and means for monitoring a photo-detector are also disclosed.

Abstract: The optical transceiver module includes an optical transmitter and an optical receiver. The optical transceiver module also includes an internal serial bus and a plurality of addressable components electrically coupled to the internal serial bus. Each of the addressable components included a serial interface for communicating with the internal serial bus, and a memory. Each addressable component also includes a unique address or chip select logic coupled to a controller via a chip select line. This allows data to be addressed to specific addressable components. The addressable components may include a laser driver, a laser bias controller, a power controller, a pre-amplifier, a post-amplifier, a laser wavelength controller, a main controller, a electrothermal cooler, an analog-to-digital converter, a digital-to analog converter, an APD bias controller, or any combination of the aforementioned components.

Abstract: An optical signal detector monitoring circuit can include a current divider current mirror (CDCM) and a current multiplier current mirror (CMCM). A mirror leg of the CDCM generates a current corresponding with a part of the CDCM's primary leg current. The CMCM's primary leg couples to the CDCM's mirror leg. The CMCM generates a mirror leg current corresponding with a multiple of its primary leg current. Another circuit can include a first current mirror having a primary current leg (PCL), coupled between an optical signal detector and one of an electrical source and an electrical sink, that exhibits a resistance corresponding with a part of the resistance of the first current mirror's mirror current leg (MCL). The circuit's second current mirror has a MCL that exhibits a resistance corresnonding with a part of the resistance of the second current mirror's PCL, which couples with the first current mirror's MCL.

Abstract: The method and apparatus for compensating a photo-detector allows both regulation and monitoring of the photo-detector to be performed with a common digital controller. The controller accepts input of monitored operational parameters including received signal strength and temperature. The controller provides as an output a bias control signal which regulates a positive the positive or negative side bias voltage power supply for the photo-detector. The controller maintains the bias voltage to the photo-detector at levels which optimize the gain and signal-to-noise ratios for the photo-detector thereby facilitating the decoding of the received signal over a broad range of signal strengths and temperatures. The controller includes a corresponding digital signal strength and temperature compensators the outputs of which summed with a summer to provide the bias control signal.