Abstract: Sterile intravenous catheter securements and securement dressings that provide simpler, more effective, and lower risk intravenous catheter placement and securement in a patient are described. Catheter securement dressings may include one or more adhesive portions positioned and configured to maintain a position of a catheter assembly following catheterization. Catheter securement dressings may be secured to a patient with an adhesive portion, and the catheter assembly may then be placed into the patient through an access opening in the catheter securement dressing. Portions of catheter securement dressings may then by folded over and adhered to each other and portions of the catheter assembly to secure the catheter assembly to the patient.

Abstract: Sterile intravenous catheter securements and securement dressings that provide simpler, more effective, and lower risk intravenous catheter placement and securement in a patient are described. Catheter securement dressings may include one or more adhesive portions positioned and configured to maintain a position of a catheter assembly following catheterization. Catheter securement dressings may be secured to a patient with an adhesive portion, and the catheter assembly may then be placed into the patient through an access opening in the catheter securement dressing. Portions of catheter securement dressings may then by folded over and adhered to each other and portions of the catheter assembly to secure the catheter assembly to the patient.

Abstract: Sterile intravenous catheter securements and securement dressings that provide simpler, more effective, and lower risk intravenous catheter placement and securement in a patient are described. Catheter securement dressings may include one or more adhesive portions positioned and configured to maintain a position of a catheter assembly following catheterization. Catheter securement dressings may be secured to a patient with an adhesive portion, and the catheter assembly may then be placed into the patient through an access opening in the catheter securement dressing. Portions of catheter securement dressings may then by folded over and adhered to each other and portions of the catheter assembly to secure the catheter assembly to the patient.

Abstract: Intravenous catheter devices are provided which may include one or more adhesive portions which are positioned and configured to temporarily maintain a position of a catheter assembly following catheterization. A release liner covering and protecting the adhesive portions may be automatically removed to reveal the adhesive upon withdrawal of an introducer needle of the catheter assembly. The adhesive may be configured such that a clinician may insert the catheter assembly into the patient, adjust the catheter adapter of the catheter assembly to a desired position, withdraw the introducer needle, thereby removing a protective, non-adhesive release liner from the adhesive of the positioned catheter assembly, thereby temporarily fixing the position of the catheter assembly at the desired position by contacting the exposed adhesive to the skin of the patient.

Abstract: Devices and methods for holding a tray stack having a plurality of trays configured to carry and store microelectronic devices. Several devices in accordance with the present invention are particularly applicable to carrying a stack of JEDEC trays that have been loaded with a plurality of microelectronic devices. In one embodiment, the device is a tray retainer including a guide structure configured to allow the tray stack to move in a direction of a load/unload path, and to restrict lateral movement of the tray stack with respect to the load/unload path. The guide structure can have a first end, a second end, and an opening at least proximate to the second end. The guide structure, for example, can have first and second channel sections extending in the direction of the load/unload path. The second channel section can also face the first channel section. The tray retainer can also include a cross-member and a moveable retaining element.

Abstract: Devices and methods for holding a tray stack having a plurality of trays configured to carry and store microelectronic devices. Several devices in accordance with the present invention are particularly applicable to carrying a stack of JEDEC trays that have been loaded with a plurality of microelectronic devices. In one embodiment, the device is a tray retainer including a guide structure configured to allow the tray stack to move in a direction of a load/unload path, and to restrict lateral movement of the tray stack with respect to the load/unload path. The guide structure can have a first end, a second end, and an opening at least proximate to the second end. The guide structure, for example, can have first and second channel sections extending in the direction of the load/unload path. The second channel section can also face the first channel section. The tray retainer can also include a cross-member and a moveable retaining element.

Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component includes an array of spaced-apart dams, each of which is associated with and circumscribes an open contact volume associated with one of the contacts. A dielectric material may cover the portion of the microelectronic component active surface that is external to the dams and extend between the spaced-apart dams.

Abstract: Devices and methods for holding a tray stack having a plurality of trays configured to carry and store microelectronic devices. Several devices in accordance with the present invention are particularly applicable to carrying a stack of JEDEC trays that have been loaded with a plurality of microelectronic devices. In one embodiment, the device is a tray retainer including a guide structure configured to allow the tray stack to move in a direction of a load/unload path, and to restrict lateral movement of the tray stack with respect to the load/unload path. The guide structure can have a first end, a second end, and an opening at least proximate to the second end. The guide structure, for example, can have first and second channel sections extending in the direction of the load/unload path. The second channel section can also face the first channel section. The tray retainer can also include a cross-member and a moveable retaining element.

Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component includes an array of spaced-apart dams, each of which is associated with and circumscribes an open contact volume associated with one of the contacts. A dielectric material may cover the portion of the microelectronic component active surface that is external to the dams and extend between the spaced-apart dams.

Abstract: Devices and methods for holding a tray stack having a plurality of trays configured to carry and store microelectronic devices. Several devices in accordance with the present invention are particularly applicable to carrying a stack of JEDEC trays that have been loaded with a plurality of microelectronic devices. In one embodiment, the device is a tray retainer including a guide structure configured to allow the tray stack to move in a direction of a load/unload path, and to restrict lateral movement of the tray stack with respect to the load/unload path. The guide structure can have a first end, a second end, and an opening at least proximate to the second end. The guide structure, for example, can have first and second channel sections extending in the direction of the load/unload path. The second channel section can also face the first channel section. The tray retainer can also include a cross-member and a moveable retaining element.

Abstract: Method and apparatus for marking microelectronic devices, such as bare microelectronic dies and packaged devices, to enhance the identification and automatic handling of wafers, dies and packaged devices. In one embodiment, a microelectronic device comprises a microelectronic die having an integrated circuit, a hidden marking layer superimposed relative to the die, and a cover layer over the hidden marking layer. The hidden marking layer can be applied to a surface of the die and/or a surface of a package encasing at least a portion of the die such that in either situation the hidden marking layer is superimposed relative to the die. In one embodiment, the hidden marking layer is a material that (a) can be removed by a scribing energy (e.g., incinerated or otherwise consumed), and/or (b) is at least partially opaque to an exposure energy. The hidden marking layer can also have a depression defining an identification mark through which at least a portion of the exposure energy can penetrate.

Abstract: Method and apparatus for marking microelectronic devices, such as bare microelectronic dies and packaged devices, to enhance the identification and automatic handling of wafers, dies and packaged devices. In one embodiment, a microelectronic device includes a first exterior surface, a second exterior surface having a contact array with a plurality of contacts, and an integrated circuit coupled to the contacts. The microelectronic device can further include a marking medium applied to the first exterior surface of the device. In one embodiment, the marking medium includes a contrast film section having an underlying contrast film applied to the first exterior surface and an outer contrast film applied to the underlying contrast film. In another embodiment, the marking medium can include a contrast film section having only an outer contrast film applied to the first exterior surface of the device.

Abstract: Method and apparatus for marking microelectronic devices, such as bare microelectronic dies and packaged devices, to enhance the identification and automatic handling of wafers, dies and packaged devices. In one embodiment, a microelectronic device comprises a microelectronic die having an integrated circuit, a hidden marking layer superimposed relative to the die, and a cover layer over the hidden marking layer. The hidden marking layer can be applied to a surface of the die and/or a surface of a package encasing at least a portion of the die such that in either situation the hidden marking layer is superimposed relative to the die. In one embodiment, the hidden marking layer is a material that (a) can be removed by a scribing energy (e.g., incinerated or otherwise consumed), and/or (b) is at least partially opaque to an exposure energy. The hidden marking layer can also have a depression defining an identification mark through which at least a portion of the exposure energy can penetrate.

Abstract: Method and apparatus for marking microelectronic devices, such as bare microelectronic dies and packaged devices, to enhance the identification and automatic handling of wafers, dies and packaged devices. In one embodiment, a microelectronic device comprises a microelectronic die having an integrated circuit, a hidden marking layer superimposed relative to the die, and a cover layer over the hidden marking layer. The hidden marking layer can be applied to a surface of the die and/or a surface of a package encasing at least a portion of the die such that in either situation the hidden marking layer is superimposed relative to the die. In one embodiment, the hidden marking layer is a material that (a) can be removed by a scribing energy (e.g., incinerated or otherwise consumed), and/or (b) is at least partially opaque to an exposure energy. The hidden marking layer can also have a depression defining an identification mark through which at least a portion of the exposure energy can penetrate.

Abstract: Method and apparatus for marking microelectronic devices, such as bare microelectronic dies and packaged devices, to enhance the identification and automatic handling of wafers, dies and packaged devices. In one embodiment, a microelectronic device includes a first exterior surface, a second exterior surface having a contact array with a plurality of contacts, and an integrated circuit coupled to the contacts. The microelectronic device can further include a marking medium applied to the first exterior surface of the device. In one embodiment, the marking medium includes a contrast film section having an underlying contrast film applied to the first exterior surface and an outer contrast film applied to the underlying contrast film. In another embodiment, the marking medium can include a contrast film section having only an outer contrast film applied to the first exterior surface of the device.

Abstract: Devices and methods for holding a tray stack having a plurality of trays configured to carry and store microelectronic devices. Several devices in accordance with the present invention are particularly applicable to carrying a stack of JEDEC trays that have been loaded with a plurality of microelectronic devices. In one embodiment, the device is a tray retainer including a guide structure configured to allow the tray stack to move in a direction of a load/unload path, and to restrict lateral movement of the tray stack with respect to the load/unload path. The guide structure can have a first end, a second end, and an opening at least proximate to the second end. The guide structure, for example, can have first and second channel sections extending in the direction of the load/unload path. The second channel section can also face the first channel section. The tray retainer can also include a cross-member and a moveable retaining element.

Abstract: Method and apparatus for marking microelectronic devices, such as bare microelectronic dies and packaged devices, to enhance the identification and automatic handling of wafers, dies and packaged devices. In one embodiment, a microelectronic device includes a first exterior surface, a second exterior surface having a contact array with a plurality of contacts, and an integrated circuit coupled to the contacts. The microelectronic device can further include a marking medium applied to the first exterior surface of the device. In one embodiment, the marking medium includes a contrast film section having an underlying contrast film applied to the first exterior surface and an outer contrast film applied to the underlying contrast film. In another embodiment, the marking medium can include a contrast film section having only an outer contrast film applied to the first exterior surface of the device.

Abstract: Method and apparatus for marking microelectronic devices, such as bare microelectronic dies and packaged devices, to enhance the identification and automatic handling of wafers, dies and packaged devices. In one embodiment, a microelectronic device comprises a microelectronic die having an integrated circuit, a hidden marking layer superimposed relative to the die, and a cover layer over the hidden marking layer. The hidden marking layer can be applied to a surface of the die and/or a surface of a package encasing at least a portion of the die such that in either situation the hidden marking layer is superimposed relative to the die. In one embodiment, the hidden marking layer is a material that (a) can be removed by a scribing energy (e.g., incinerated or otherwise consumed), and/or (b) is at least partially opaque to an exposure energy. The hidden marking layer can also have a depression defining an identification mark through which at least a portion of the exposure energy can penetrate.

Abstract: Devices and methods for holding a tray stack having a plurality of trays configured to carry and store microelectronic devices. Several devices in accordance with the present invention are particularly applicable to carrying a stack of JEDEC trays that have been loaded with a plurality of microelectronic devices. In one embodiment, the device is a tray retainer including a guide structure configured to allow the tray stack to move in a direction of a load/unload path, and to restrict lateral movement of the tray stack with respect to the load/unload path. The guide structure can have a first end, a second end, and an opening at least proximate to the second end. The guide structure, for example, can have first and second channel sections extending in the direction of the load/unload path. The second channel section can also face the first channel section. The tray retainer can also include a cross-member and a moveable retaining element.

Abstract: Devices and methods for holding a tray stack having a plurality of trays configured to carry and store microelectronic devices. Several devices in accordance with the present invention are particularly applicable to carrying a stack of JEDEC trays that have been loaded with a plurality of microelectronic devices. In one embodiment, the device is a tray retainer including a guide structure configured to allow the tray stack to move in a direction of a load/unload path, and to restrict lateral movement of the tray stack with respect to the load/unload path. The guide structure can have a first end, a second end, and an opening at least proximate to the second end. The guide structure, for example, can have first and second channel sections extending in the direction of the load/unload path. The second channel section can also face the first channel section. The tray retainer can also include a cross-member and a moveable retaining element.