Patents by Inventor Darius K. Deak

Darius K. Deak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11945977
    Abstract: A hot melt adhesive comprises at least one polymer selected from the group consisting of polystyrene, polybutene, polyisobutene, linear low density polyethylene, polypropylene random copolymer, polypropylene, olefin block copolymer, polyolefins, styrene block copolymers, and ethyl vinyl acetate polymers; a tackifying resin; and at least one precisely end-capped polystyrene (PECPS). The use of the styrene-based oligomers and polymers with the precisely controlled end-groups in hot melt adhesive formulations to improve compatibility with polymers and block copolymers frequently used in such adhesives.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: April 2, 2024
    Assignee: Bostik, Inc.
    Inventors: Steven D. Gray, Darius K. Deak, Brian R. Minix, Edward P. Tomlinson
  • Patent number: 10563086
    Abstract: A low temperature heat seal coating solution which contains an amorphous or semi-crystalline polyester or co-polyester resin, tackifier, anti-blocking agent, and solvent. The coating solution can be applied to a packaging web such as a foil or film by converters using conventional methods such as gravure, rod, slot die, or printing process. The heal seal coating can be sealed to itself or another substrate to manufacture food packaging bags or pharmaceutical blister packaging. The heat seal temperature can be as low as 70° C. under conventional equipment and conditions in the industry.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: February 18, 2020
    Assignee: Bostik, Inc.
    Inventors: Darius K. Deak, Thomas L. Ruppert, Elaine Lo
  • Publication number: 20200010743
    Abstract: A hot melt adhesive comprises at least one polymer selected from the group consisting of polystyrene, polybutene, polyisobutene, linear low density polyethylene, polypropylene random copolymer, polypropylene, olefin block copolymer, polyolefins, styrene block copolymers, and ethyl vinyl acetate polymers; a tackifying resin; and at least one precisely end-capped polystyrene (PECPS). The use of the styrene-based oligomers and polymers with the precisely controlled end-groups in hot melt adhesive formulations to improve compatibility with polymers and block copolymers frequently used in such adhesives.
    Type: Application
    Filed: February 20, 2018
    Publication date: January 9, 2020
    Inventors: Steven D. GRAY, Darius K. DEAK, Brian R. MINIX, Edward P. TOMLINSON
  • Publication number: 20170198171
    Abstract: A low temperature heat seal coating solution which contains an amorphous or semi-crystalline polyester or co-polyester resin, tackifier, anti-blocking agent, and solvent. The coating solution can be applied to a packaging web such as a foil or film by converters using conventional methods such as gravure, rod, slot die, or printing process. The heal seal coating can be sealed to itself or another substrate to manufacture food packaging bags or pharmaceutical blister packaging. The heat seal temperature can be as low as 70° C. under conventional equipment and conditions in the industry.
    Type: Application
    Filed: March 27, 2017
    Publication date: July 13, 2017
    Inventors: Darius K. Deak, Thomas L. Ruppert, Elaine Lo
  • Patent number: 9624400
    Abstract: A low temperature heat seal coating solution which contains an amorphous or semi-crystalline polyester or co-polyester resin, tackifier, anti-blocking agent, and solvent. The coating solution can be applied to a packaging web such as a foil or film by converters using conventional methods such as gravure, rod, slot die, or printing process. The heal seal coating can be sealed to itself or another substrate to manufacture food packaging bags or pharmaceutical blister packaging. The heat seal temperature can be as low as 70° C. under conventional equipment and conditions in the industry.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: April 18, 2017
    Assignee: Bostik, Inc.
    Inventors: Darius K. Deak, Thomas Lee Ruppert, Elaine Lo
  • Publication number: 20150275032
    Abstract: A low temperature heat seal coating solution which contains an amorphous or semi-crystalline polyester or co-polyester resin, tackifier, anti-blocking agent, and solvent. The coating solution can be applied to a packaging web such as a foil or film by converters using conventional methods such as gravure, rod, slot die, or printing process. The heal seal coating can be sealed to itself or another substrate to manufacture food packaging bags or pharmaceutical blister packaging. The heat seal temperature can be as low as 70° C. under conventional equipment and conditions in the industry.
    Type: Application
    Filed: March 25, 2015
    Publication date: October 1, 2015
    Applicant: Bostik, Inc.
    Inventors: Darius K. Deak, Thomas Lee Ruppert, Elaine Lo
  • Publication number: 20110268909
    Abstract: A method for packaging plastic material using a film to surround the material, and more particularly to a method for packaging a copolyester, and the resulting package formed thereby. The method is preferably a coextrusion process for packaging an amorphous or semi-crystalline copolyester having a low glass transition temperature by extruding it through a die orifice, and coextruding a copolyester polymeric film having a high glass transition temperature to surround the low glass transition copolyester. The coated low glass transition copolyester may then be formed into individual packaged units having a finite size and shape.
    Type: Application
    Filed: December 22, 2010
    Publication date: November 3, 2011
    Applicant: BOSTIK, INC.
    Inventors: Darius K. Deak, Herve Philippe Burriez