Patents by Inventor Darren Rogers
Darren Rogers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10548223Abstract: A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.Type: GrantFiled: January 24, 2019Date of Patent: January 28, 2020Assignee: Skyworks Solutions, Inc.Inventors: Darren Roger Frenette, George Khoury, Leslie Paul Wallis, Lori Ann DeOrio
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Patent number: 10535637Abstract: Methods to form stacked circuit assemblies include mounting a first wireless device component to a first surface of a substrate and placing a second wireless device component over the first wireless device component such that the first wireless device component is disposed between the second wireless device component and the first surface of the substrate such that a first overhanging portion of the second wireless device component extends beyond a periphery of the first wireless device component. The first wireless device component is in communication with the second wireless device component and second wireless device component is in communication with the substrate.Type: GrantFiled: April 8, 2019Date of Patent: January 14, 2020Assignee: Skyworks Solutions, Inc.Inventors: Darren Roger Frenette, George Khoury, Lori Ann DeOrio
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Patent number: 10530050Abstract: Selectively shielded radio frequency modules are disclosed. A radio frequency module can include a package substrate, a radio frequency component on the package substrate, a multi-layer antenna, a radio frequency shielding structure configured to provide shielding between the multi-layer antenna and the radio frequency component. The radio frequency shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.Type: GrantFiled: March 1, 2019Date of Patent: January 7, 2020Assignee: Skyworks Solutions, Inc.Inventors: Hoang Mong Nguyen, Anthony James LoBianco, Gregory Edward Babcock, Darren Roger Frenette, George Khoury, René Rodríguez
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Patent number: 10515924Abstract: Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.Type: GrantFiled: March 9, 2018Date of Patent: December 24, 2019Assignee: Skyworks Solutions, Inc.Inventors: Gregory Edward Babcock, Lori Ann DeOrio, Darren Roger Frenette, George Khoury, Anthony James LoBianco, Hoang Mong Nguyen, Leslie Paul Wallis
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Publication number: 20190341687Abstract: Aspects of this disclosure relate to methods of selectively shielded radio frequency modules. A radio frequency module can be provided with a radio frequency component and an antenna. A shielding layer can be formed over a portion of the radio frequency module such that the radio frequency component is shielded by the shielding layer and the antenna is unshielded by the shielding layer.Type: ApplicationFiled: April 30, 2019Publication date: November 7, 2019Inventors: Hoang Mong Nguyen, Anthony James LoBianco, Gregory Edward Babcock, Darren Roger Frenette, George Khoury
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Publication number: 20190343000Abstract: A packaged module for use in a wireless communication device has a substrate supporting a crystal assembly and a first die that implements at least a portion of a radio frequency baseband subsystem. The crystal assembly, positioned between the first die and the substrate, includes a crystal, an input terminal configured to receive a first signal, an output terminal configured to output a second signal, a conductive pillar, and an enclosure configured to enclose the crystal, where the conductive pillar is formed at least partially within a side of the enclosure and extends from a top surface to a bottom surface of the enclosure. The conductive pillar conducts a third signal distinct from the first and second signals.Type: ApplicationFiled: June 10, 2019Publication date: November 7, 2019Inventors: Darren Roger Frenette, George Khoury, Leslie Paul Wallis, Lori Ann DeOrio
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Patent number: 10446524Abstract: A packaged module for use in a wireless communication device has a substrate supporting a crystal and a first die that includes at least a microprocessor and one or more of radio frequency transmitter circuitry and radio frequency receiver circuitry. The first die is disposed between the crystal and the substrate. An overmold encloses the first die and the crystal. The substrate also supports a second die that includes at least a power amplifier for amplifying a radio frequency input signal, where the second die is disposed on an opposite side of the substrate from the first die and the crystal.Type: GrantFiled: July 27, 2018Date of Patent: October 15, 2019Assignee: Skyworks Solutions, Inc.Inventors: Darren Roger Frenette, George Khoury, Leslie Paul Wallis
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Publication number: 20190237433Abstract: Methods to form stacked circuit assemblies include mounting a first wireless device component to a first surface of a substrate and placing a second wireless device component over the first wireless device component such that the first wireless device component is disposed between the second wireless device component and the first surface of the substrate such that a first overhanging portion of the second wireless device component extends beyond a periphery of the first wireless device component. The first wireless device component is in communication with the second wireless device component and second wireless device component is in communication with the substrate.Type: ApplicationFiled: April 8, 2019Publication date: August 1, 2019Inventors: Darren Roger Frenette, George Khoury, Lori Ann DeOrio
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Publication number: 20190230794Abstract: A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.Type: ApplicationFiled: January 24, 2019Publication date: July 25, 2019Inventors: Darren Roger Frenette, George Khoury, Leslie Paul Wallis, Lori Ann DeOrio
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Patent number: 10362678Abstract: A packaged module for use in a wireless communication device has a substrate supporting a crystal assembly and a first die that implements at least a portion of a radio frequency baseband subsystem. The crystal assembly, positioned between the first die and the substrate, includes a crystal, an input terminal configured to receive a first signal, an output terminal configured to output a second signal, a conductive pillar, and an enclosure configured to enclose the crystal, where the conductive pillar is formed at least partially within a side of the enclosure and extends from a top surface to a bottom surface of the enclosure. The conductive pillar conducts a third signal distinct from the first and second signals.Type: GrantFiled: April 17, 2017Date of Patent: July 23, 2019Assignee: Skyworks Solutions, Inc.Inventors: Darren Roger Frenette, George Khoury, Leslie Paul Wallis, Lori Ann DeOrio
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Patent number: 10336247Abstract: Apparatus and associated methods include automatically activating and/or deactivating a vehicle's standard brake lights in response to signals indicative of the vehicle's speed. The signals indicative of a vehicle's speed are received from a vehicle communications bus. In some embodiments, a deceleration value is calculated based on a series of signals indicative of a vehicle's speed received from the vehicle communications bus. The calculated deceleration value is compared with a first predetermined deceleration threshold. If the calculated deceleration value is greater than the first predetermined deceleration threshold, a brake light activation signal is generated. When the vehicle no longer is decelerating or the computed deceleration value falls below a second predetermined deceleration threshold, a brake light deactivation signal is generated. The automatic activation/deactivation of a vehicle's standard brake light may advantageously provide improved safety to following vehicles and drivers.Type: GrantFiled: June 26, 2017Date of Patent: July 2, 2019Assignee: Deceleration Technologies, LLCInventors: Scott Thomas Ault, Darren Roger Olafson, Brad Driscoll
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Publication number: 20190198990Abstract: Aspects of this disclosure relate to selectively shielded radio frequency modules. A radio frequency module can include a package substrate, a radio frequency component on the package substrate, a multi-layer antenna, a radio frequency shielding structure configured to provide shielding between the multi-layer antenna and the radio frequency component. The radio frequency shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.Type: ApplicationFiled: March 1, 2019Publication date: June 27, 2019Inventors: Hoang Mong Nguyen, Anthony James LoBianco, Gregory Edward Babcock, Darren Roger Frenette, George Khoury, René Rodríguez
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Patent number: 10320071Abstract: Aspects of this disclosure relate to methods of selectively shielded radio frequency modules. A radio frequency module can be provided with a radio frequency component and an antenna. A shielding layer can be formed over a portion of the radio frequency module such that the radio frequency component is shielded by the shielding layer and the antenna is unshielded by the shielding layer.Type: GrantFiled: April 18, 2017Date of Patent: June 11, 2019Assignee: Skyworks Solutions, Inc.Inventors: Hoang Mong Nguyen, Anthony James LoBianco, Gregory Edward Babcock, Darren Roger Frenette, George Khoury
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Patent number: 10297576Abstract: A packaged module for a radio frequency wireless device has a substrate supporting a first wireless device component and a second wireless device component where the first wireless device component is between the second wireless device component and a first surface of the substrate. At least a first overhanging portion of the second wireless device component extends beyond at least a portion of the periphery of the first wireless device component.Type: GrantFiled: April 17, 2017Date of Patent: May 21, 2019Assignee: Skyworks Solutions, Inc.Inventors: Darren Roger Frenette, George Khoury, Lori Ann DeOrio
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Patent number: 10283859Abstract: Aspects of this disclosure relate to selectively shielded radio frequency modules. A radio frequency module can include a package substrate, a radio frequency shielding structure extending above the package substrate, a radio frequency component over the package substrate and in an interior of the radio frequency shielding structure, and an antenna on the package substrate external to the radio frequency shielding structure. The shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.Type: GrantFiled: April 18, 2017Date of Patent: May 7, 2019Assignee: Skyworks Solutions, Inc.Inventors: Hoang Mong Nguyen, Anthony James LoBianco, Gregory Edward Babcock, Darren Roger Frenette, George Khoury
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Patent number: 10276521Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such front end system includes a low noise amplifier in a receive path and a multi-mode power amplifier circuit in a transmit path. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.Type: GrantFiled: December 28, 2017Date of Patent: April 30, 2019Assignee: Skyworks Solutions, Inc.Inventors: Gregory Edward Babcock, Lori Ann DeOrio, Darren Roger Frenette, George Khoury, Anthony James LoBianco, Hoang Mong Nguyen, Yasser Khairat Soliman, Leslie Paul Wallis, René Rodríguez
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Patent number: 10269769Abstract: A packaged module for use in a wireless communication device has a substrate supporting a first integrated circuit die that implements at least a portion of a radio frequency baseband subsystem and a second integrated circuit die that implements at least a portion of a radio frequency front end including a radio frequency power amplifier. The substrate is disposed between the first integrated circuit die and the second integrated circuit die. An overmold encloses one of the first integrated circuit die and the second integrated circuit die.Type: GrantFiled: April 17, 2017Date of Patent: April 23, 2019Assignee: Skyworks Solutions, Inc.Inventors: Darren Roger Frenette, George Khoury, Lori Ann DeOrio
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Patent number: 10256535Abstract: Selectively shielded radio frequency modules are disclosed. A radio frequency module can include a package substrate, a radio frequency component on the package substrate, a multi-layer antenna, a radio frequency shielding structure configured to provide shielding between the multi-layer antenna and the radio frequency component. The radio frequency shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.Type: GrantFiled: April 18, 2017Date of Patent: April 9, 2019Assignee: Skyworks Solutions, Inc.Inventors: Hoang Mong Nguyen, Anthony James LoBianco, Gregory Edward Babcock, Darren Roger Frenette, George Khoury, René Rodriguez
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Patent number: 10231341Abstract: A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.Type: GrantFiled: February 6, 2018Date of Patent: March 12, 2019Assignee: Skyworks Solutions, Inc.Inventors: Darren Roger Frenette, George Khoury, Leslie Paul Wallis, Lori Ann DeOrio
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Publication number: 20190043837Abstract: A packaged module for use in a wireless communication device has a substrate supporting a crystal and a first die that includes at least a microprocessor and one or more of radio frequency transmitter circuitry and radio frequency receiver circuitry. The first die is disposed between the crystal and the substrate. An overmold encloses the first die and the crystal. The substrate also supports a second die that includes at least a power amplifier for amplifying a radio frequency input signal, where the second die is disposed on an opposite side of the substrate from the first die and the crystal.Type: ApplicationFiled: July 27, 2018Publication date: February 7, 2019Inventors: Darren Roger Frenette, George Khoury, Leslie Paul Wallis