Abstract: A hearing device and subassembly therefor includes a sleeve member configured for at least partial insertion into a user's ear canal, the sleeve member defining a cavity that receives and retains at least a portion of a sound-producing electroacoustic transducer. The sleeve member includes a cable interface, wherein an electrical interface of a sound-producing electroacoustic transducer received in the cavity is accessible via the cable interface. The device also includes on or more sensors integrated with the sleeve member and positioned to sense a biomarker or other condition when the sleeve member is at least partially inserted into the user's ear canal. The hearing device includes conductive traces integrated with the sleeve member, where at least one conductive trace is electrically connected to the sensor and electrically connectable via the cable interface.

Abstract: A micro-electromechanical system (MEMS) transducer assembly includes a transducer including a condenser microphone, an integrated circuit electrically connected to the transducer to receive an output voltage from the transducer, wherein the integrated circuit comprises a test signal generator configured to induce a test acoustic response in the transducer, and an evaluation circuit configured to compare the test acoustic response to a baseline acoustic response to identify a fault in the transducer.

Abstract: A microphone assembly includes a housing having a host device interface, a MEMS transducer disposed in the housing and configured to generate electrical signals in response to acoustic activity, an integrated circuit disposed in the housing and configured to process the electrical signals from the MEMS transducer and generate an output representative of the acoustic activity, a host communication path between the integrated circuit and contacts of the host device interface, and a secure communication path between the integrated circuit and an output interface. The secure communication path is isolated from the host communication path. The integrated circuit is configured to indicate a state of the microphone assembly at the output interface via the secure communication path in response to a command received at the microphone assembly.

Abstract: A micro-electromechanical system (MEMS) transducer assembly includes a transducer including a condenser microphone, an integrated circuit electrically connected to the transducer to receive an output voltage from the transducer, wherein the integrated circuit comprises a test signal generator configured to induce a test acoustic response in the transducer, and an evaluation circuit configured to compare the test acoustic response to a baseline acoustic response to identify a fault in the transducer.

Abstract: A hearing device and subassembly therefor includes a sleeve member configured for at least partial insertion into a user's ear canal, the sleeve member defining a cavity that receives and retains at least a portion of a sound-producing electroacoustic transducer. The sleeve member includes a cable interface, wherein an electrical interface of a sound-producing electroacoustic transducer received in the cavity is accessible via the cable interface. The device also includes on or more sensors integrated with the sleeve member and positioned to sense a biomarker or other condition when the sleeve member is at least partially inserted into the user's ear canal. The hearing device includes conductive traces integrated with the sleeve member, where at least one conductive trace is electrically connected to the sensor and electrically connectable via the cable interface.

Abstract: A transducer assembly comprises an acoustic transducer comprising a transducer substrate having a first aperture defined at a first location of the transducer substrate, an acoustic transducer diaphragm disposed on the transducer substrate over the first aperture, and an acoustic transducer back plate disposed on the transducer substrate axially spaced apart from the acoustic transducer diaphragm over the first aperture. The transducer assembly also includes a vibration transducer comprising the transducer substrate having a second aperture defined at a second location thereof, a vibration transducer diaphragm disposed on the transducer substrate over the second aperture, a vibration transducer back plate disposed on the transducer substrate axially spaced apart from the vibration transducer back plate over the second aperture, and an anchor coupled to one of the vibration transducer diaphragm or the vibration transducer back plate, the anchor disposed in the second aperture and suspended freely therewithin.

Abstract: An inductive device is provided, which includes a substrate, a layer having a plurality of conductive metal traces and a metal shield layer. The conductive trace has an input port, a first portion, a second portion, a third portion and an output port. The metal shield layer is disposed between the substrate and the conductive trace. Each of the plurality of conductive metal traces has a respective length and a respective width. Each of the plurality of conductive metal traces are separated from one another. Each of the plurality of conductive metal traces are disposed perpendicularly with the first portion and the third portion. The metal shield layer provides spaced shield traces substantially perpendicular with the conductive metal traces.

Abstract: An inductive device is provided, which includes a substrate, a layer having a plurality of conductive metal traces and a conductive trace. The conductive trace has an input port, a first portion, a second portion, a third portion and an output port. The metal shield layer is disposed between the substrate and the conductive trace. Each of the plurality of conductive metal traces has a respective length and a respective width. Each of the plurality of conductive metal traces are separated from one another. Each of the plurality of conductive metal traces are disposed perpendicularly with the first portion and the third portion.