Abstract: A medical device may include an elongated body, a balloon positioned at a distal portion of the elongated body, and one or more pressure-wave emitters positioned along a central longitudinal axis of the elongated body within the balloon. The one or more pressure-wave emitters may be configured to propagate pressure waves radially outward through the fluid to fragment a calcified lesion at the target treatment site. The at least one of the one or more pressure-wave emitters may comprise an electronic emitter including a first electrode and a second electrode. The first electrode and the second electrode may be arranged to define a spark gap between the first electrode and the second electrode, and the second electrode may comprise a portion of a hypotube.

Abstract: A medical device may include an elongated body, a balloon positioned at a distal portion of the elongated body, and one or more pressure-wave emitters positioned along a central longitudinal axis of the elongated body within the balloon. The one or more pressure-wave emitters may be configured to propagate pressure waves radially outward through the fluid to fragment a calcified lesion at the target treatment site. The at least one of the one or more pressure-wave emitters may comprise an electronic emitter including a first electrode and a second electrode. The first electrode and the second electrode may be arranged to define a spark gap between the first electrode and the second electrode, and the second electrode may comprise a portion of a hypotube.

Abstract: Mobile platforms and methods may provide for an integrated circuit such as a system on chip (SoC), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration.

Abstract: Mobile platforms and methods may provide for an integrated circuit such as a system on chip (SoC), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration.

Abstract: A keyboard is to be designed as a standardized keyboard having a certain length, width and thickness. The keyboard may be used interchangeably among different mobile computer systems. A keyboard cable associated with the keyboard may be designed such that it can accommodate an interface connector at any location relative to a bottom end of the keyboard. One or more control devices may also be used in conjunction with the keyboard. The control device may be designed with standardized dimensions, electrical interface, interface connector and cable length to enable it to accompany the keyboard among the different mobile computer systems.

Abstract: According to one embodiment, a system is disclosed. The system includes a chassis including a plurality of hardware components and a system board having a central processing unit (CPU). The system board is adaptable to be mounted with common interface features within the chassis with the CPU facing the bottom of the chassis or with the CPU facing away from the bottom of the chassis. Other embodiments may be described.

Abstract: According to one embodiment, a system is disclosed. The system includes a chassis including a printed circuit board (PCB) and a battery pack. The battery pack includes a connector to enable the battery pack to couple to a PCB which is mounted either above the centerline of the battery pack connector and on or below the centerline of the battery pack power connector.

Abstract: According to one embodiment, a system is disclosed. The system includes a chassis and a battery pack mounted within the chassis. The battery pack includes one or more battery cells and cooling components to enable thermal energy generated by the one or more battery cells to be conducted and dissipated from the battery pack.

Abstract: According to one embodiment, a computer system is disclosed. The computer system includes a baseboard, a device bay including a fuel cell mounted on the baseboard, and a power pack coupled to the baseboard. The power pack includes a fuel cartridge that delivers fuel to the fuel cell.

Abstract: A method and system are described for multi-stage cooling of a system, such as a computer system, and a high thermal dissipating object, such as a CPU, to minimize acoustic noise generated by the cooling system. The method includes causing at least one fan in a system to operate at high speeds during a first stage, and reducing the speed of at least one fan during an intermediary stage. The system includes a high thermal dissipating object, a heat sink connected to the high thermal dissipating object, a first fan to direct airflow on a main section of a heat sink during a first stage, and a second fan to direct airflow on an extended section of the heat sink. Optionally, a final stage may be entered into where all fans are shut off.

Abstract: An electronic cartridge which includes a cover. The cover is coupled to a substrate which has an integrated circuit package. A portion of the cover extends over and is spaced from a plurality of conductive pads located along an edge of the substrate. The conductive pads can be inserted into a card edge electrical connector that is mounted to a motherboard. The cover of the present invention protects the conductive pads while allowing the substrate to be plugged into a card edge connector.

Abstract: A computer chassis assembly that includes a heat pipe which thermally couples an electronic package to multiple fan units. The heat pipe provides a computer chassis that sufficiently cools internal heat generating components without placing the components in close proximity to the fans.

Abstract: A clothing hanger member of conventional shape has symmetrical right and left sides, each with its own end. Reel means is attached to the left end of the member and reels flexible cable into the reel means when the cable is not under tension. The free end of the cable is fitted with lock means that locks the cable into a loop and simultaneously locks a hanger means around a clothes bar to prevent theft. When the cable is passed through the sleeve of a sleeved garment and locked into a loop, the garment cannot be removed from the device without being cut, and the device cannot be removed from the bar, without interlocking the lock means.