Abstract: An accelerometer system can include a sensor element comprising first and second proofmasses, the first proofmass accelerating in a first direction and the second proofmass accelerating in a second direction opposite the first direction in response to an external acceleration. A force rebalance controller applies control signals to at least one control element to provide a first force to accelerate the first proofmass toward a first null position and to at least one control element to provide a second force to accelerate the second proofmass toward a second null position. The force rebalance controller can also generate opposite polarity first and second output signals associated with respective displacements of the first and second proofmasses relative to the respective first and second null positions. An acceleration component calculates the external acceleration based on the first and second output signals.

Abstract: A method for optimizing direct wafer bond line width for reduction of parasitic capacitance in a MEMS device by reducing the width of a bond line between a first and a second wafer, exposing the MEMS device to a water vapor for a predetermined time period and at a first temperature capable of evaporating water, cooling the MEMS device at a second temperature capable of freezing the water, and operating the MEMS device at a third temperature capable of freezing the water to determine if there is discontinuity during operation.

Abstract: An accelerometer system can include a sensor element comprising first and second proofmasses, the first proofmass accelerating in a first direction and the second proofmass accelerating in a second direction opposite the first direction in response to an external acceleration. A force rebalance controller applies control signals to at least one control element to provide a first force to accelerate the first proofmass toward a first null position and to at least one control element to provide a second force to accelerate the second proofmass toward a second null position. The force rebalance controller can also generate opposite polarity first and second output signals associated with respective displacements of the first and second proofmasses relative to the respective first and second null positions. An acceleration component calculates the external acceleration based on the first and second output signals.

Abstract: A method for optimizing direct wafer bond line width for reduction of parasitic capacitance in a MEMS device by reducing the width of a bond line between a first and a second wafer, exposing the MEMS device to a water vapor for a predetermined time period and at a first temperature capable of evaporating water, cooling the MEMS device at a second temperature capable of freezing the water, and operating the MEMS device at a third temperature capable of freezing the water to determine if there is discontinuity during operation.

Abstract: A method for optimizing direct wafer bond line width for reduction of parasitic capacitance in a MEMS device by reducing the width of a bond line between a first and a second wafer, exposing the MEMS device to a water vapor for a predetermined time period and at a first temperature capable of evaporating water, cooling the MEMS device at a second temperature capable of freezing the water, and operating the MEMS device at a third temperature capable of freezing the water to determine if there is discontinuity during operation.

Abstract: A method for optimizing direct wafer bond line width for reduction of parasitic capacitance in a MEMS device by reducing the width of a bond line between a first and a second wafer, exposing the MEMS device to a water vapor for a predetermined time period and at a first temperature capable of evaporating water, cooling the MEMS device at a second temperature capable of freezing the water, and operating the MEMS device at a third temperature capable of freezing the water to determine if there is discontinuity during operation.

Abstract: An apparatus in one example comprises a die structure that comprises a middle layer, a first outside layer, and a second outside layer. The middle layer comprises a cavity that holds an alkali metal, and one of the first outside layer and the second outside layer comprises a channel that leads to the cavity. The middle layer, the first outside layer, and the second outside layer comprise dies from one or more wafer substrates.

Abstract: An apparatus in one example comprises a die structure that comprises a middle layer, a first outside layer, and a second outside layer. The middle layer comprises a cavity that holds an alkali metal, and one of the first outside layer and the second outside layer comprises a channel that leads to the cavity. The middle layer, the first outside layer, and the second outside layer comprise dies from one or more wafer substrates.