Patents by Inventor Dave Hunt

Dave Hunt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240073796
    Abstract: A circuit arrangement includes a preprocessing circuit configured to obtain context information related to a user location, a learning circuit configured to determine a predicted user movement based on context information related to a user location to obtain a predicted route and to determine predicted radio conditions along the predicted route, and a decision circuit configured to, based on the predicted radio conditions, identify one or more first areas expected to have a first type of radio conditions and one or more second areas expected to have a second type of radio conditions different from the first type of radio conditions and to control radio activity while traveling on the predicted route according to the one or more first areas and the one or more second areas.
    Type: Application
    Filed: September 7, 2023
    Publication date: February 29, 2024
    Inventors: Shahrnaz AZIZI, Biljana BADIC, John BROWNE, Dave CAVALCANTI, Hyung-Nam CHOI, Thorsten CLEVORN, Ajay GUPTA, Maruti GUPTA HYDE, Ralph HASHOLZNER, Nageen HIMAYAT, Simon HUNT, Ingolf KARLS, Thomas KENNEY, Yiting LIAO, Christopher MACNAMARA, Marta MARTINEZ TARRADELL, Markus Dominik MUECK, Venkatesan NALLAMPATTI EKAMBARAM, Niall POWER, Bernhard RAAF, Reinhold SCHNEIDER, Ashish SINGH, Sarabjot SINGH, Srikathyayani SRIKANTESWARA, Shilpa TALWAR, Feng XUE, Zhibin YU, Robert ZAUS, Stefan FRANZ, Uwe KLIEMANN, Christian DREWES, Juergen KREUCHAUF
  • Patent number: 11523500
    Abstract: The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: December 6, 2022
    Assignee: STMicroelectronics International N.V.
    Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Steve Bush, Faiz Sherman
  • Publication number: 20210343404
    Abstract: Described herein is an integrated health management system, and method that includes a pre-packaged tablet delivery apparatus configured to deliver pre-packaged tablets to a user. The delivery apparatus comprising an alignment guide, a processor modulated differential drive used for the directional control of the pre-packaged tablets, a sensor for sensing a location and an orientation of the pre-packaged tablet, a cutter mechanism, and cutter mechanism control logic. The sensed location and orientation of the pre-packaged tablet is used to modulate the differential drive. The cutter mechanism control logic is configured to monitor the sensed pre-packaged tablet location and orientation, then initiate a cutting sequence responsive to at least one of the predetermined configuration within the processor and the dynamic configuration responsive to determining an optimal sensed location and orientation. The control logic generates and logs a message into the distributed database responsive to the cutting sequence.
    Type: Application
    Filed: May 3, 2021
    Publication date: November 4, 2021
    Inventors: Dave Hunt, Dan Stone, Eric Paul, Dan Preston, Rigel Correa, Jessica Milanio, Lindsey Atkinson, John Gibson, Benjamin Cheek, John Friar, Lucas Cheek
  • Patent number: 10646892
    Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: May 12, 2020
    Assignees: STMicroelectronics, Inc., STMICROELECTRONICS S.R.L., STMicroelectronics International N.V.
    Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Matt Giere, Dana Gruenbacher, Faiz Sherman
  • Patent number: 10543504
    Abstract: A microfluidic die is disclosed that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: January 28, 2020
    Assignees: STMicroelectronics, Inc., STMICROELECTRONICS S.R.L., STMicroelectronics International N.V.
    Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Matt Giere, Dana Gruenbacher, Faiz Sherman
  • Publication number: 20190200453
    Abstract: The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.
    Type: Application
    Filed: February 27, 2019
    Publication date: June 27, 2019
    Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Steve Bush, Faiz Sherman
  • Patent number: 10264667
    Abstract: The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: April 16, 2019
    Assignees: STMicroelectronics, Inc., STMicroelectronics S.R.L., STMicroelectronics International N.V.
    Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Steve Bush, Faiz Sherman
  • Patent number: 9919334
    Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: March 20, 2018
    Assignees: STMicroelectronics, Inc., STMicroelectronics S.R.L., STMicroelectronics International N.V.
    Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Matt Giere, Dana Gruenbacher, Faiz Sherman
  • Publication number: 20180056319
    Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
    Type: Application
    Filed: November 3, 2017
    Publication date: March 1, 2018
    Inventors: Simon DODD, Joe SCHEFFELIN, Dave HUNT, Matt GIERE, Dana GRUENBACHER, Faiz SHERMAN
  • Patent number: 9861720
    Abstract: One or more embodiments are directed to a microfluidic delivery system that dispenses a fluid in a direction that, at least in part, opposes gravity. In one embodiment, the microfluidic delivery system includes a microfluidic refill cartridge that is configured to be placed in a housing. The microfluidic refill cartridge includes at least one nozzle that faces upward or off to a side. The microfluidic refill cartridge includes a fluid transport member that allows fluid to travel upward from a fluid reservoir in opposition to gravity. A fluid path is located above the fluid transport member placing an end of the fluid transport member in fluid communication with a chamber and a nozzle. In response to the microfluidic delivery system receiving an electrical signal, an ejection element is configured to cause fluid in the chamber to be expelled through the nozzle.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: January 9, 2018
    Assignee: STMicroelectronics, Inc.
    Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Tim Hoekstra, Faiz Sherman, Steve Bush
  • Patent number: 9833806
    Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: December 5, 2017
    Assignees: STMicroelectronics, Inc., STMICROELECTRONICS S.R.L., STMicroelectronics International N.V.
    Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Matt Giere, Dana Gruenbacher, Faiz Sherman
  • Publication number: 20170297332
    Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
    Type: Application
    Filed: June 28, 2017
    Publication date: October 19, 2017
    Inventors: Simon DODD, Joe SCHEFFELIN, Dave HUNT, Matt GIERE, Dana GRUENBACHER, Faiz SHERMAN
  • Patent number: 9561657
    Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instance, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: February 7, 2017
    Assignees: STMicroelectronics S.r.l., STMicroelectronics Asia Pacific Pte Ltd, STMicroelectronics, Inc.
    Inventors: Simon Dodd, Joe Scheffelin, Dana Gruenbacher, Roberto Brioschi, Teck Khim Neo, Dave Hunt, Faiz Sherman
  • Publication number: 20160354799
    Abstract: A microfluidic fluid delivery device and method. The device includes a reservoir and a transport member. The device includes a microfluidic delivery member including a microfluidic die configured to release a fluid composition from the device. The microfluidic delivery member includes an adapter configured to receive an end portion of the transport member, wherein a capillary passage is formed between the adapter and the transport member. The capillary passage has a largest effective pore size that is smaller than the average effective pore size of the transport member.
    Type: Application
    Filed: August 9, 2016
    Publication date: December 8, 2016
    Inventors: Dana Paul GRUENBACHER, Dave HUNT, Joseph SCHEFFLIN, Timothy James HOEKSTRA, Simon DODD, Roberto BRIOSCHI
  • Publication number: 20160236471
    Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instance, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.
    Type: Application
    Filed: April 26, 2016
    Publication date: August 18, 2016
    Inventors: Simon Dodd, Joe Scheffelin, Dana Gruenbacher, Roberto Brioschi, Teck Khim Neo, Dave Hunt, Faiz Sherman
  • Patent number: 9358567
    Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: June 7, 2016
    Assignee: STMicroelectronics, Inc.
    Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Matt Giere, Dana Gruenbacher, Faiz Sherman
  • Patent number: 9357635
    Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: May 31, 2016
    Assignees: STMicroelectronics S.r.l., STMicroelectronics Asia Pacific Pte Ltd, STMicroelectronics, Inc.
    Inventors: Simon Dodd, Joe Scheffelin, Dana Gruenbacher, Roberto Brioschi, Teck Khim Neo, Dave Hunt, Faiz Sherman
  • Publication number: 20160107443
    Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
    Type: Application
    Filed: December 21, 2015
    Publication date: April 21, 2016
    Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Matt Giere, Dana GRUENBACHER, Faiz SHERMAN
  • Publication number: 20160107446
    Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.
    Type: Application
    Filed: December 28, 2015
    Publication date: April 21, 2016
    Inventors: Simon Dodd, Joe Scheffelin, Dana Gruenbacher, Roberto Brioschi, Teck Khim Neo, Dave Hunt, Faiz Sherman
  • Publication number: 20160101619
    Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
    Type: Application
    Filed: December 18, 2015
    Publication date: April 14, 2016
    Inventors: Simon DODD, Joe SCHEFFELIN, Dave HUNT, Matt GIERE, Dana GRUENBACHER, Faiz SHERMAN