Abstract: One variation of a system for cooling an integrated circuit within a computing device includes: a substrate arranged within the computing device, extending to an external housing of the computing device, and defining a closed fluid circuit comprising a cavity, a first boustrophedonic fluid channel across a first region of the substrate adjacent the integrated circuit, and second boustrophedonic fluid channel across a second region of the substrate; a volume of fluid within the closed fluid circuit; a displacement device comprising a diaphragm arranged across the cavity and operable between a first position and a second position, the diaphragm distended into the cavity in the first position and distended away from the cavity in the second position; and a power supply powering the displacement device to oscillate the diaphragm between the first position and the second position to pump the volume of fluid through the closed fluid circuit.

Abstract: One variation of a system for cooling an electrical component within a computing device—including a digital display—includes: an internal heatsink thermally coupled to the integrated circuit and defining a fluid passage including a first end and a second end; a heat exchange layer arranged across a viewing surface of the digital display, including a transparent material, and defining a fluid channel extending across a portion of the digital display, the fluid channel including a fluid inlet coupled to the first end of the fluid passage and a fluid outlet coupled to the second end of the fluid passage; a transparent fluid; and a displacement device configured to circulate the transparent fluid between the internal heatsink and the fluid channel.