Patents by Inventor Davey Beard

Davey Beard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer level packaging of infrared camera detectors
    Patent number: 10161803
    Abstract: An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: December 25, 2018
    Assignee: FLIR Systems, Inc.
    Inventors: Gregory A. Carlson, Alex Matson, Andrew Sharpe, Davey Beard, Paul Schweikert, Robert Simes
  • WAFER LEVEL PACKAGING OF INFRARED CAMERA DETECTORS
    Publication number: 20170328779
    Abstract: An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.
    Type: Application
    Filed: December 5, 2016
    Publication date: November 16, 2017
    Inventors: Gregory A. Carlson, Alex Matson, Andrew Sharpe, Davey Beard, Paul Schweikert, Robert Simes
  • Wafer level packaging of infrared camera detectors
    Patent number: 9513172
    Abstract: An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.
    Type: Grant
    Filed: January 25, 2013
    Date of Patent: December 6, 2016
    Assignee: FLIR Systems, Inc.
    Inventors: Gregory A. Carlson, Alex Matson, Andrew Sharpe, Davey Beard, Paul Schweikert, Robert Simes