Patents by Inventor David A. Babow

David A. Babow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5450664
    Abstract: An initially integral terminal assembly 84; 94 useful for terminating a selected conductor 74; of a flat power cable 72 having at least two insulated conductors 74, 76 includes upper and lower plate sections 26, 50 extending in diverging directions from a common bendable hinge 46 defining a cable receiving region therebetween. Each plate section 26, 50 has at least a first portion 28, 52 corresponding to the first conductor 74 and a second portion 36, 60 associated with a second conductor 76 of the cable 72. Each portion 28, 52; 36, 60 further includes conductor terminating regions 30, 38, 54, 62 intermediate opposed upstanding side walls 42, 66 of the upper and lower plate sections 26, 50.
    Type: Grant
    Filed: November 18, 1993
    Date of Patent: September 19, 1995
    Assignee: The Whitaker Corporation
    Inventors: David A. Babow, Roger N. Polk
  • Patent number: 5030108
    Abstract: A bus bar assembly (110) includes a pair of source and return bus bars (118,116) mounted on at least one of the side edges (108,112) of a daughter card (102) and electrically connected by arrays of terminals (172) to power circuits of the card, for use in a system for distributing electrical power to the daughter card module (100) upon insertion into a card cage (10). The pair of bus bars (118,116) is insulated by a cover (120) having a rail (126) for following the guide channels (18,20) of the card cage at each card location. Rearward ends of the bus bars have blades (122,124) which are received into receptacle contacts (46,44) mounted in the card cage above and below the backplane (14), which are mounted at each card location and electrically connected to source and return busses (68,58) of the card cage, with the receptacle contacts (46,44) preferably being float mounted to be easily incrementally moved upon blade receipt during card module (100) insertion.
    Type: Grant
    Filed: June 29, 1990
    Date of Patent: July 9, 1991
    Assignee: AMP Incorporated
    Inventors: David A. Babow, Glenn E. Bennett, John E. Lucius, Roger N. Polk, Frederick H. Rider, David S. Szczesny
  • Patent number: 4871319
    Abstract: A paddle board for a connector for one or two ribbon cables having closely spaced signal and ground wires, includes on one or both major surfaces a plurality of wire-terminating pads comprising conductive material along bottoms of wire-receiving grooves proximate the cable-proximate edge of the board, the grooves defined by serrate ridges. Circuit paths extend from the signal ones of the wire-terminating pads to terminal-connecting pads along one or both major surfaces at a connector-proximate edge of the board to be connected to signal terminals of the connector. Other circuit paths extend from ground ones of the wire-terminating pads to a ground bus which includes at least one ground circuit path extending to a ground terminal-connecting pad along the connector-proximate edge. The wires of each ribbon cable are soldered to the wire-terminating pads after being wiped into the grooves, and the ridges serve as integral wire alignment means.
    Type: Grant
    Filed: December 21, 1988
    Date of Patent: October 3, 1989
    Assignee: AMP Incorporated
    Inventor: David A. Babow
  • Patent number: 4786256
    Abstract: A socket for a flatpack semiconductor package includes an insulative housing with a plurality of terminal receiving channels which open onto an upper package receiving surface. The channels are in lateral communication with apertures which are profiled for receiving tail portions of the terminals therethrough for interconnection of the tail portions to a printed circuit board. The electrical terminals are disposed within the channels with a contact portion situated above the package receiving face for contact with the flatpack semiconductor package leads. The terminals are designed with a lengthened beam section which forms the contact portion which defines the force deflection characteristics of the terminals to be somewhat insensitive to the insertion depth of the carrier.
    Type: Grant
    Filed: April 3, 1987
    Date of Patent: November 22, 1988
    Assignee: AMP Incorporated
    Inventors: Angelo V. Angeleri, David A. Babow
  • Patent number: 4717347
    Abstract: A burn-in test socket for use with flatpack semiconductor components is disclosed. The flatpack burn-in socket is especially adapted for use with robotic assembly techniques. The socket comprises an insulative housing with a plurality of terminals adapted to be in registry with leads on a flatpack semiconductor device located in a conventional flatpack carrier. The terminals are doubly reversely formed to laterally wipe the leads during insertion. Electrical continuity of the socket terminals and dynamic electrical testing of the semiconductor device can be probed from above the socket.
    Type: Grant
    Filed: January 14, 1987
    Date of Patent: January 5, 1988
    Assignee: AMP Incorporated
    Inventors: David A. Babow, Thomas K. Doench, Angelo V. Angeleri
  • Patent number: 4410922
    Abstract: A magnetic transducing head is mounted on a transducing machine so that the angle of orientation (e.g., azimuth inclination) of the head with respect to the machine is adjustable as by means of a differential screw mechanism extending between two relatively pivotable portions of the mount. The screw mechanism comprises a manually-operable element having threads of two different pitches on the same axis, threaded respectively into the two mount portions. Thus the two mount portions are always held at an intended distance from each other without lost-motion play, and the sensitivity of orientation adjustment is increased, because the translation corresponding to unit angular movement of the screw is measured by the difference between the inverse-pitch dimensions of the two threads.
    Type: Grant
    Filed: January 26, 1981
    Date of Patent: October 18, 1983
    Assignee: Ampex Corporation
    Inventors: David A. Babow, William M. Nedley