Abstract: A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module.

Abstract: A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module. A method of making a component-on-package circuit may include attaching a component for an electrical circuit to a circuit module. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component after the attachment both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides a spring-like cushioning of force applied to the component in the direction of the circuit module.

Abstract: A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module. A method of making a component-on-package circuit may include attaching a component for an electrical circuit to a circuit module. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component after the attachment both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides a spring-like cushioning of force applied to the component in the direction of the circuit module.

Abstract: A flipchip package may include a semiconductor die, a heat spreader, and encapsulation material. The semiconductor die may contain an electronic circuit and exposed electrical connections to the electronic circuit. The heat spreader may be thermally-conductive and may have a first outer surface and a second outer surface substantially parallel to the first outer surface. The first outer surface may be affixed to all portions of a silicon side of the semiconductor die in a thermally-conductive manner. The encapsulation material may be non-electrically conductive and may completely encapsulate the semiconductor die and the heat spreader, except for the second surface of the heat spreader. The second surface of the heat spreader may be solderable and may form part of an exterior surface of the flipchip package.

Abstract: A semiconductor device is disclosed that has a die and a substrate having a die attachment area with a perimeter. A layer of solder connects the substrate and the die, the solder layer having at least one vent channel connected to the perimeter of the die attachment area, wherein the maximum distance from any point in the solder layer to the nearest free surface of the solder at a vent channel or at the perimeter of the die is less than the distance from the center of the die to the nearest edge of the die.

Abstract: A packaging technique is described for QFNs, DFN, and other surface mount packages that allows the sides of leads to be plated with a wettable metal prior to the lead frames being singulated from the lead frame sheet. The leads of the lead frames in the sheet are shorted together and to the body of the lead frame sheet by a sacrificial interconnect structure. Chips are mounted to the lead frames and encapsulated, leaving the bottoms of the leads exposed. The lead frame sheet is then sawed along boundaries of the lead frames but not sawed through the interconnect structure. The sawing exposes at least a portion of the sides of the leads. The leads are then electroplated while the leads are biased with a bias voltage via the interconnect structure. After the plating, the lead frame sheet is sawed completely thorough the interconnect structure to singulate the lead frames and prevent the interconnect structure from shorting the leads together.

Abstract: A lead frame is configured for use with a singulation apparatus that eliminates flash. A die pad is attached to sides of the frame by tie bars and peripheral portions. The peripheral portions have cutout sections defining openings that are bridged by lead frame segments. The apparatus applies a downward force to the lead frame segments and translates the downward force to a horizontal force applied to the tie bars. The singulation process confines movement of the lead frame metal to within the plane of the lead frame.

Abstract: A basket for a shopping cart comprising a single unitary member molded from a plastic material. The basket includes a frame including a plurality of generally vertical upright frame members spaced apart from each other, with each frame member including a generally smooth outer surface without holes. A front panel extends generally vertically and laterally across the front portion of the single unitary member between two of the generally vertical upright frame members. A pair of side panels extends generally vertically, being generally parallel to each other and spaced from each other. Each side panel extends from a front portion to a rear portion of the basket between two of the generally vertical upright frame members. The front panel and each side panel comprise a generally flat portion defining a plurality of holes and have a substantially uniform thickness at least about two times less than a thickness of the generally vertical upright frame members.

Abstract: A shopping cart includes a base, a pair of masts, and a basket. The base extends generally horizontally between a front portion and a rear portion of the cart and including a plurality of wheels. The pair of masts extends generally vertically upward from the base in a generally singular plane extending laterally across the rear portion of the cart. Each mast includes a rear portion facing the rear portion of the cart and defining a generally straight surface, and a front portion facing in a direction generally opposite the rear portion of the respective mast and defining a generally concave curved portion. The basket includes a front portion and a rear portion with the rear portion of the basket connected to the base via the pair of masts to support the front portion of the basket in a vertically spaced relationship over the base adjacent the front portion of the cart.

Abstract: A seat assembly for a shopping cart includes a gate pivotally mounted to a rear portion of the shopping cart and a seat member made from a plastic material. The seat member is mounted to the gate of the shopping cart via a pivot mechanism to extend in a position to support a child within the shopping cart. The seat member includes a generally curved concave portion having an apex adjacent the gate and a generally straight portion on a side of the seat member opposite the apex of the generally curved concave portion.

Abstract: A handle for a shopping cart includes a frame defining a unitary member in a substantially continuous loop. At least one connection portion extends from the frame for securing the frame to a basket of a shopping cart and is configured to position the loop of the frame to be generally parallel to and spaced from an upper portion of a basket of the shopping cart.

Abstract: A lead frame is configured for use with a singulation apparatus that eliminates flash. A die pad is attached to sides of the frame by tie bars and peripheral portions. The peripheral portions have cutout sections defining openings that are bridged by lead frame segments. The apparatus applies a downward force to the lead frame segments and translates the downward force to a horizontal force applied to the tie bars. The singulation process confines movement of the lead frame metal to within the plane of the lead frame.

Abstract: A lead frame is configured for use with a singulation apparatus that eliminates flash. A die pad is attached to sides of the frame by tie bars and peripheral portions. The peripheral portions have cutout sections defining openings that are bridged by lead frame segments. The apparatus applies a downward force to the lead frame segments and translates the downward force to a horizontal force applied to the tie bars. The singulation process confines movement of the lead frame metal to within the plane of the lead frame.

Abstract: A lead frame is configured for use with a singulation apparatus that eliminates flash. A die pad is attached to sides of the frame by tie bars and peripheral portions. The peripheral portions have cutout sections defining openings that are bridged by lead frame segments. The apparatus applies a downward force to the lead frame segments and translates the downward force to a horizontal force applied to the tie bars. The singulation process confines movement of the lead frame metal to within the plane of the lead frame.

Abstract: An endoscope having a sheath having a plurality of lumens, an imaging bundle received in a first lumen in the sheath, and a lighting bundle received in one or more second lumens in the sheath. A distal tip connects to a distal end of the sheath and includes an objective lens disposed in the distal tip, wherein the objective lens is spaced apart from the distal end of the imaging bundle.

Abstract: A leadframe is disclosed. The leadframe comprises a frame characterized by a substantially rectangular outline, a die paddle with a receiving surface, and a plurality of support members that connect the frame to the die paddle. The leadframe further comprises a plurality of leads connected to the frame, that will eventually serve to electrically connect an integrated circuit mounted on the die paddle to an external electrical device. The die paddle lies in a lower horizontal plane. A plurality of support members connect the frame with the die paddle. As projected on to a vertical plane that is perpendicular to the side of the frame to which a support member is attached, the offset angle between the support member and a vertical axis is less than 45 degrees.

Abstract: The present invention relates to an improved bead wire letoff assembly and method of operation that controls the tension of wire being pulled from a wire spool mounted to the bead wire letoff assembly. The improved wire letoff assembly can accurately control the rotational speed of the wire spool and incorporates a cam plate and tension arm linkage to control the braking force applied to the wire spool.