Abstract: A socket lid for a semiconductor test socket which uses a plurality of pneumatic cylinders integrated into the socket lid to facilitate the application of a controlled and variable force to multiple zones of an electronic circuit device carried by the test socket. The socket lid includes a cylinder casing with multiple independently sealed pressure chambers, each of which incorporates a plurality a pneumatic cylinders which bear against separate and independently movable compression plates that engage different areas of the electronic circuit device carried by the semiconductor test socket, thus providing an adjustably variable force to multiple zones of the electronic circuit device under test.

Abstract: A lightweight, spacious and collapsible tent having an apex and contacting the ground on three struts, utilizing: three collapsible subframes each containg four struts pivotally connected at one end to a central hub and extending radially outward to a distal end; a flexible covering having four sides and corners, said covering overlaying the hub and struts and extending so that each corner extends to the distal end of a strut; each of said subframes being connected along two sides to one of the sides of each of the other two subframes; each of said subframes having a strut the distal end of which is pivotally connected to the distal end of a strut from each of the other two subframes to form the apex of the tent; and each of said subframes resting on the ground on the distal end of a strut farthest from the apex.