Abstract: A curable thermal interface material is provided comprising a functionalized elastomer and a filler. Preferred materials comprise an epoxidized polybutadiene cured with an iodonium catalyst and a filler comprising silver and/or aluminum oxide.

Abstract: A curable thermal interface material is provided comprising a functionalized elastomer and a filler. Preferred materials comprise an epoxidized polybutadiene cured with an iodonium catalyst and a filler comprising silver and/or aluminum oxide.

Abstract: A semiconductor package is disclosed that includes multiple combinations of stacked or side by side semiconductor chips, at least one of which is at least partially disposed within a through hole formed in a substrate. Another embodiment includes a package with a metal core for improving mechanical strength, heat dissipation, electrical grounding, and power distribution characteristics of the packages. The substrate may be configured to facilitate stacking additional semiconductor packages.

Abstract: This invention provides a method for making a semiconductor package with stacked dies that eliminates fracturing of the upper die(s) during the wire bonding process. One embodiment of the method includes the provision of a substrate and pair of semiconductor dies, each having opposite top and bottom surfaces and a plurality of wire bonding pads around the peripheries of their respective top surfaces. One die is attached and wire bonded to a top surface of the substrate. A measured quantity of an uncured, fluid adhesive is dispensed onto the top surface of the first die, and the adhesive is squeezed toward the edges of the dies by pressing the bottom surface of the second die down onto the adhesive until the two dies are separated by a layer of the adhesive. The adhesive is cured, the second die is then wire bonded to the substrate, and the dies are then molded over with an encapsulant.

Abstract: In a leadframe type of semiconductor package, the internal electrical interconnectability of and signal routing between multiple dies laminated in a stack with the die paddle of the leadframe is substantially enhanced by laminating an “interposer” in the stack. The interposer comprises a dielectric layer and a metallic layer patterned to include wire bonding pads arrayed around the periphery of a surface thereof, and circuit traces interconnecting selected ones of the wire bonding pads in a single plane across the horizontal span of the interposer. In packages having multiple dies and relatively few leads, the bonding pads and circuit traces can be flexibly arranged on the interposer by the package designer to substantially increase the number and routings of internal electrical interconnections otherwise possible between the dies and between the dies and the leads of the package.

Abstract: This invention provides a method for making a semiconductor package with stacked dies that eliminates fracturing of the upper die(s) during the wire bonding process. One embodiment of the method includes the provision of a substrate and pair of semiconductor dies, each having opposite top and bottom surfaces and a plurality of wire bonding pads around the peripheries of their respective top surfaces. One die is attached and wire bonded to a top surface of the substrate. A measured quantity of an uncured, fluid adhesive is dispensed onto the top surface of the first die, and the adhesive is squeezed toward the edges of the dies by pressing the bottom surface of the second die down onto the adhesive until the two dies are separated by a layer of the adhesive. The adhesive is cured, the second die is then wire bonded to the substrate, and the dies are then molded over with an encapsulant.

Abstract: This invention provides a method for making a semiconductor package with stacked dies that eliminates fracturing of the upper die(s) during the wire bonding process. One embodiment of the method includes the provision of a substrate and pair of semiconductor dies, each having opposite top and bottom surfaces and a plurality of wire bonding pads around the peripheries of their respective top surfaces. One die is attached and wire bonded to a top surface of the substrate. A measured quantity of an uncured, fluid adhesive is dispensed onto the top surface of the first die, and the adhesive is squeezed toward the edges of the dies by pressing the bottom surface of the second die down onto the adhesive until the two dies are separated by a layer of the adhesive. The adhesive is cured, the second die is then wire bonded to the substrate, and the dies are then molded over with an encapsulant.