Patents by Inventor David Allen Moore
David Allen Moore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230171935Abstract: In some examples, a system derives a first representation of an assembly of components based on a first source of information, and derives a second representation of the assembly of components based on a second source of information that is of a different type than the first source of information, where the second representation includes any or a combination of an indication of a source of a respective component of the assembly of components, or placement location information of a component in the assembly. The system compares the first representation to the second representation to identify a deviation between the first representation and the second representation, the deviation corresponding to an alteration of the assembly of components.Type: ApplicationFiled: November 29, 2021Publication date: June 1, 2023Inventors: David Allen Moore, Jonathon Hughes
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Patent number: 10571206Abstract: An assembly useable with a cooling system is provided herein. The assembly includes a support member, a channel, and a fluid control mechanism. The support member includes a receiving member formed therein to receive a thermal member. The channel is formed within the support member to carry a fluid therethrough. The fluid control mechanism is along the channel to control the flow of the fluid.Type: GrantFiled: March 26, 2018Date of Patent: February 25, 2020Assignee: Hewlett Packard Enterprise Development LPInventors: David Allen Moore, John P. Franz, Tahir Cader, Michael Lawrence Sabotta
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Patent number: 10455726Abstract: A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.Type: GrantFiled: September 30, 2014Date of Patent: October 22, 2019Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LPInventors: Tahir Cader, John P Franz, David Allen Moore, Douglas Kent Garday, Wade D Vinson
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Publication number: 20180216899Abstract: An assembly useable with a cooling system is provided herein. The assembly includes a support member, a channel, and a fluid control mechanism. The support member includes a receiving member formed therein to receive a thermal member. The channel is formed within the support member to carry a fluid therethrough. The fluid control mechanism is along the channel to control the flow of the fluid.Type: ApplicationFiled: March 26, 2018Publication date: August 2, 2018Inventors: David Allen Moore, John P. Franz, Tahir Cader, Michael Lawrence Sabotta
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Patent number: 9927187Abstract: An assembly useable with a cooling system is provided herein. The assembly includes a support member, a channel, and a fluid control mechanism. The support member includes a receiving member formed therein to receive a thermal member. The channel is formed within the support member to carry a fluid therethrough. The fluid control mechanism is along the channel to control the flow of the fluid.Type: GrantFiled: September 28, 2012Date of Patent: March 27, 2018Assignee: Hewlett Packard Enterprise Development LPInventors: David Allen Moore, John P. Franz, Tahir Cader, Michael Lawrence Sabotta
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Publication number: 20170295667Abstract: A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.Type: ApplicationFiled: September 30, 2014Publication date: October 12, 2017Inventors: Tahir CADER, John P FRANZ, David Allen MOORE, Douglas Kent GARDAY, Wade D Vinson
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Publication number: 20150253088Abstract: An assembly useable with a cooling system is provided herein. The assembly includes a support member, a channel, and a fluid control mechanism. The support member includes a receiving member formed therein to receive a thermal member. The channel is formed within the support member to carry a fluid therethrough. The fluid control mechanism is along the channel to control the flow of the fluid.Type: ApplicationFiled: September 28, 2012Publication date: September 10, 2015Inventors: David Allen Moore, John P. Franz, Tahir Cader, Michael Lawrence Sabotta
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Patent number: 8845404Abstract: A ventilation system includes a ventilation tile. The ventilation tile has a substantially circular opening to allow air to flow through the ventilation tile and a collapsible damper operable to collapse and expand to alter the size of the substantially circular opening in the ventilation tile and thereby variably restrict air flow through the substantially circular opening.Type: GrantFiled: February 14, 2006Date of Patent: September 30, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Cullen E. Bash, David Allen Moore
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Patent number: 7339490Abstract: A modular sensor assembly for sensing conditions at a computer rack, such as environmental conditions. The sensor assembly includes an elongate flexible body, configured to attach to a computer rack, with a plurality of addressable sensors, disposed along the body and interconnected to a common connector wire. A connector wire lead is provided to interconnect the connector wire to a central system configured to receive and interpret data from the plurality of sensors relating to conditions associated with the computer rack.Type: GrantFiled: June 29, 2004Date of Patent: March 4, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventors: David Allen Moore, Robert Allen Pereira, Ratnesh K. Sharma, Cullen E. Bash
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Patent number: 7006949Abstract: A first aspect of the present invention is a method for collecting temperature data in a facility wherein the facility includes a plurality of systems. The method includes coupling a plurality of sensors to at least one of the plurality of systems, connecting each of the plurality of sensors to a central system and utilizing the central system to collect temperature data from each of the plurality of sensors.Type: GrantFiled: January 27, 2004Date of Patent: February 28, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventor: David Allen Moore
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Patent number: 6981915Abstract: A control system for controlling airflow through a vent. The system includes a vent assembly having a frame. The frame includes an opening to allow air to flow through the frame. The vent assembly also includes a movable damper for variably restricting the fluid flow through the opening in the vent assembly, a motor for controlling movement of the damper, and a sensor for determining the position of the damper. In addition, a controller is provided to control the motor to vary the position of the damper to thereby vary the airflow through the opening in the vent assembly.Type: GrantFiled: March 15, 2004Date of Patent: January 3, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: David Allen Moore, Abdlmonem H. Beitelmal, Cullen E. Bash