Patents by Inventor David B. Goland
David B. Goland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6652956Abstract: A method and structure to form a conductive pattern on a ceramic sheet deposits a photosensitive conductive material on a carrier and exposes a pattern of x-ray energy on the material and sinters the carrier and the material to the ceramic sheet so that only the conductive pattern of the material remains on the ceramic sheet. The structure has a conductive patterned material which includes a photosensitive agent.Type: GrantFiled: July 24, 2001Date of Patent: November 25, 2003Assignee: International Business Machines CorporationInventors: Lawrence A. Clevenger, David B. Goland, Louis L. Hsu, Joseph F. Shepard, Jr., Subhash L. Shinde
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Patent number: 6638681Abstract: A method and structure to form a conductive pattern on a ceramic sheet deposits a photosensitive conductive material on a carrier and exposes a pattern of x-ray energy on the material and sinters the carrier and the material to the ceramic sheet so that only the conductive pattern of the material remains on the ceramic sheet. The structure has a conductive patterned material which includes a photosensitive agent.Type: GrantFiled: October 28, 2002Date of Patent: October 28, 2003Assignee: International Business Machines CorporationInventors: Lawrence A. Clevenger, David B. Goland, Louis L. Hsu, Joseph F. Shepard, Jr., Subhash L. Shinde
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Publication number: 20030044590Abstract: A method and structure to form a conductive pattern on a ceramic sheet deposits a photosensitive conductive material on a carrier and exposes a pattern of x-ray energy on the material and sinters the carrier and the material to the ceramic sheet so that only the conductive pattern of the material remains on the ceramic sheet. The structure has a conductive patterned material which includes a photosensitive agent.Type: ApplicationFiled: October 28, 2002Publication date: March 6, 2003Inventors: Lawrence A. Clevenger, David B. Goland, Louis L. Hsu, Joseph F. Shepard, Subhash L. Shinde
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Publication number: 20030021968Abstract: A method and structure to form a conductive pattern on a ceramic sheet deposits a photosensitive conductive material on a carrier and exposes a pattern of x-ray energy on the material and sinters the carrier and the material to the ceramic sheet so that only the conductive pattern of the material remains on the ceramic sheet. The structure has a conductive patterned material which includes a photosensitive agent.Type: ApplicationFiled: July 24, 2001Publication date: January 30, 2003Inventors: Lawrence A. Clevenger, David B. Goland, Louis L. Hsu, Joseph F. Shepard, Subhash L. Shinde
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Patent number: 6373133Abstract: A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.Type: GrantFiled: July 13, 1999Date of Patent: April 16, 2002Assignee: International Business Machines CorporationInventors: Giulio DiGiacomo, Stephen S. Drofitz, Jr., David L. Edwards, Larry D. Gross, Sushumna Iruvanti, Raed A. Sherif, Subhash L. Shinde, David J. Womac, David B. Goland, Lester W. Herron
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Patent number: 6352014Abstract: A method for making small punches by employing multi-layer ceramic (MLC) technology includes the steps of preparing a sublaminate matrix of a high or low sintering temperature material, drilling holes in the sublaminate using a mask as a guide, filling the holes with punch material paste by a solupor process, laminating the sublaminate to a base plate or as a freestanding substrate, firing a laminate at an appropriate sintering temperature and removing the matrix material by a chemical or mechanical method. In accordance with the present invention, a large number of small punches are made in parallel to precise dimensions of two to ten mils in diameter and approximately 100 mils in length. This method allows that a punch plate array can also be used to simultaneously punch an array of vias in a greensheet and eliminates the additional step of loading individual punches into a punch plate, offering cost and time savings.Type: GrantFiled: December 15, 1999Date of Patent: March 5, 2002Assignee: International Business Machines CorporationInventors: David B. Goland, David C. Long, John U. Knickerbocker, Subhash L. Shinde
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Publication number: 20010055703Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.Type: ApplicationFiled: May 13, 1999Publication date: December 27, 2001Inventors: RICHARD A. BATES, CARLA N. CORDERO, BENJAMIN V. FASANO, DAVID B. GOLAND, ROBERT HANNON, LESTER W. HERRON, GREGORY M. JOHNSON, ANDREW REITTER, SUBHASH L. SHINDE, LISA STUDZINSKI
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Patent number: 6306528Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.Type: GrantFiled: May 13, 1999Date of Patent: October 23, 2001Assignee: International Business Machines CorporationInventors: Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon, Lester W. Herron, Gregory M. Johnson, Andrew Reitter, Subhash L. Shinde, Lisa Studzinski
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Patent number: 6262390Abstract: A method to repair Aluminum Nitride (AlN) substrates is disclosed wherein a frequency doubled Q-switched Nd:YAG laser is used to remove unwanted metallurgy. The substrate is place in a liquid filled work chamber which acts to prevent metallic species of AlN from forming. The repair site can be sealed with a novel polymer coating to prevent contamination or corrosion. Repairs can be made to buried or surface metallurgy.Type: GrantFiled: December 14, 1998Date of Patent: July 17, 2001Assignee: International Business Machines CorporationInventors: David B. Goland, Mark J. LaPlante, David C. Long, Dale C. McHerron, Krishna G. Sachdev, Subhash L. Shinde
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Patent number: 6200373Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.Type: GrantFiled: May 13, 1999Date of Patent: March 13, 2001Assignee: International Business Machines CorporationInventors: Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon, Lester W. Herron, Gregory M. Johnson, Andrew Reitter, Subhash L. Shinde, Lisa Studzinski
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Patent number: 6096565Abstract: A multilayer ceramic substrate electronic component is provided having high temperature superconductor material circuitry. The high temperature superconductor material is preferably yttrium-barium-copper-oxide and is encased within a noble metal such as silver or gold when forming the surface circuitry or filling of the vias. The noble metal layers preferably have through-openings to enable direct connection of circuitry to the encased superconductor layer. A method is also provided for fabricating such multilayer ceramic substrate electronic components.Type: GrantFiled: March 9, 1999Date of Patent: August 1, 2000Assignee: International Business Machines CorporationInventors: David B. Goland, Richard A. Shelleman, Subhash L. Shinde, Lisa M. Studzinski, Rao V. Vallabhaneni
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Patent number: 6004624Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.Type: GrantFiled: July 2, 1997Date of Patent: December 21, 1999Assignee: International Business Machines CorporationInventors: Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon, Lester W. Herron, Gregory M. Johnson, Andrew Reitter, Subhash L. Shinde, Lisa Studzinski
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Patent number: 6002951Abstract: A multilayer ceramic substrate electronic component is provided having high temperature superconductor material circuitry. The high temperature superconductor material is preferably yttrium-barium-copper-oxide and is encased within a noble metal such as silver or gold when forming the surface circuitry or filling of the vias. The noble metal layers preferably have through-openings to enable direct connection of circuitry to the encased superconductor layer. A method is also provided for fabricating such multilayer ceramic substrate electronic components.Type: GrantFiled: November 12, 1997Date of Patent: December 14, 1999Assignee: International Business Machines CorporationInventors: David B. Goland, Richard A. Shelleman, Subhash L. Shinde, Lisa M. Studzinski, Rao V. Vallabhaneni
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Patent number: 5981310Abstract: A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.Type: GrantFiled: January 22, 1998Date of Patent: November 9, 1999Assignee: International Business Machines CorporationInventors: Giulio DiGiacomo, Stephen S. Drofitz, Jr., David L. Edwards, Larry D. Gross, Sushumna Iruvanti, Raed A. Sherif, Subhash L. Shinde, David J. Womac, David B. Goland, Lester W. Herron
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Patent number: 5891543Abstract: The present invention relates generally to a new apparatus and method for screening using electrostatic adhesion. More particularly, the invention encompasses an apparatus that uses an electrostatic charge during the screening process for a semiconductor substrate. Basically, a backing layer is adhered to a green ceramic sheet using an electrostatic charge, while the green ceramic sheet is processed.Type: GrantFiled: August 27, 1996Date of Patent: April 6, 1999Assignee: International Business Machines CorporationInventors: Jon Alfred Casey, Cynthia Jeane Calli, Darren T. Cook, David B. Goland, John Ulrich Knickerbocker, Mark Joseph LaPlante, David Clifford Long, Daniel Scott Mackin, Kathleen Mary McGuire, Keith Colin O'Neil, Kevin Michael Prettyman, Michael Thomas Puchalski, Joseph Christopher Saltarelli, Candace Anne Sullivan
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Patent number: 5759669Abstract: The present invention relates generally to a new apparatus and method for screening using porous backing material. More particularly, the invention encompasses an apparatus that uses a porous backing material which is adhered to a green sheet during the screening process. Basically, a backing layer having a very high porosity is adhered to a green sheet, while the green sheet is screened. During the drying process of the green sheet some of the screening fluids are absorbed by the porous backing layer, which allows the screened vias of the green sheet to have a smooth surface.Type: GrantFiled: December 22, 1995Date of Patent: June 2, 1998Assignee: International Business Machines CorporationInventors: Jon Alfred Casey, Cynthia Jeane Calli, Darren T. Cook, David B. Goland, John Ulrich Knickerbocker, Mark Joseph LaPlante, David Clifford Long, Daniel Scott Mackin, Kathleen Mary McGuire, Keith Colin O'Neil, Kevin Michael Prettyman, Michael Thomas Puchalski, Joseph Christopher Saltarelli, Candace Anne Sullivan
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Patent number: 5635000Abstract: The present invention relates generally to a new apparatus and method for screening using electrostatic adhesion. More particularly, the invention encompasses an apparatus that uses an electrostatic charge during the screening process for a semiconductor substrate. Basically, a backing layer is adhered to a green ceramic sheet using an electrostatic charge, while the green ceramic sheet is processed.Type: GrantFiled: December 22, 1995Date of Patent: June 3, 1997Assignee: International Business Machines CorporationInventors: Jon A. Casey, Cynthia J. Calli, Darren T. Cook, David B. Goland, John U. Knickerbocker, Mark J. LaPlante, David C. Long, Daniel S. Mackin, Kathleen M. McGuire, Keith C. O'Neil, Kevin M. Prettyman, Michael T. Puchalski, Joseph C. Saltarelli, Candace A. Sullivan
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Patent number: 5552107Abstract: Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct contact with, and that completely encapsulates, the first layer. The first layer includes 30 to 60 volume percent aluminum nitride and 40 to 70 volume percent tungsten and/or molybdenum while the second layer includes 90 to 100 volume percent of tungsten and/or molybdenum and 0 to 10 volume percent of aluminum nitride.Type: GrantFiled: May 9, 1995Date of Patent: September 3, 1996Inventors: Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon, Jonathan H. Harris, Lester W. Herron, Gregory M. Johnson, Niranjan M. Patel, Andrew M. Reitter, Subhash L. Shinde, Rao V. Vallabhaneni, Robert A. Youngman
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Patent number: 5552232Abstract: Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct contact with, and that completely encapsulates, the first layer. The first layer includes 30 to 60 volume percent aluminum nitride and 40 to 70 volume percent tungsten and/or molybdenum while the second layer includes 90 to 100 volume percent of tungsten and/or molybdenum and 0 to 10 volume percent of aluminum nitride.Type: GrantFiled: December 21, 1994Date of Patent: September 3, 1996Assignees: International Business Machines Corporation, The Carborundum CompanyInventors: Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon, Jonathan H. Harris, Lester W. Herron, Gregory M. Johnson, Niranjan M. Patel, Andrew M. Reitter, Subhash L. Shinde, Rao V. Vallabhaneni, Robert A. Youngman
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Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
Patent number: 5480503Abstract: Process for producing circuitized greensheets including multi-layer ceramic sub-laminates and composites comprising thin ceramic greensheets carrying and thin, fine line patterned conductive metal layers. The invention comprises releasably-supporting the thin greensheets on a temporary carrier support having an ablatable release layer, preferably over a patterned conductive layer, and filling the vias with conductive metal paste, whereby the thin greensheets are supported against warpage and distortion. The supported greensheets are formed as single layers, pairs and stacks thereof, as desired, and thereafter separated from the temporary support for use.Type: GrantFiled: December 30, 1993Date of Patent: January 2, 1996Assignee: International Business Machines CorporationInventors: Jon A. Casey, David B. Goland, Dinesh Gupta, Lester W. Herron, James N. Humenik, Thomas E. Lombardi, John U. Knickerbocker, Robert J. Sullivan, James R. Wylder