Patents by Inventor David B. Stone
David B. Stone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11049819Abstract: Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor.Type: GrantFiled: November 15, 2019Date of Patent: June 29, 2021Assignee: International Business Machines CorporationInventors: Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr., David B. Stone
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Patent number: 10714411Abstract: An IC chip structure including a plurality of IC chips electrically connected to one another in back-end-of-line (BEOL) interconnect layer of the structure is disclosed. The IC structure may include openings in crack-stop structures surrounding the IC chips and a interconnect wire extending between the IC chips through the openings. A packaging structure for utilizing the IC structure where at least one IC chip is inoperable is also disclosed. The structure may include a first bond pad array on a top surface of a packaging substrate including operable bond pads connected to an operable IC chip and structural support bond pads connected to the inoperable IC chip; a second bond pad array on a bottom surface of the substrate including operable bond pads connected to a single IC chip printed circuit board; and an interconnect structure for connecting the operable bond pads of the first and second bond pad arrays.Type: GrantFiled: March 15, 2018Date of Patent: July 14, 2020Assignee: GLOBALFOUNDRIES INC.Inventors: Wolfgang Sauter, Mark W. Kuemerle, Eric W. Tremble, David B. Stone, Nicholas A. Polomoff, Eric S. Parent, Jawahar P. Nayak, Seungman Choi
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Patent number: 10685919Abstract: A laminate structure includes a conductive layer and a dielectric layer in contact with the conductive layer, the dielectric layer comprises a selectively patterned high-modulus dielectric material that balances a differential stress between the conductive layer and the dielectric layer to mechanically stiffen the laminate structure and reduce warpage.Type: GrantFiled: February 7, 2017Date of Patent: June 16, 2020Assignee: International Business Machines CorporationInventors: Mark C. Lamorey, Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell, Peter Slota, Jr., David B. Stone
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Publication number: 20200083177Abstract: Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor.Type: ApplicationFiled: November 15, 2019Publication date: March 12, 2020Inventors: Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr., David B. Stone
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Patent number: 10553544Abstract: Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor.Type: GrantFiled: October 27, 2017Date of Patent: February 4, 2020Assignee: International Business Machines CorporationInventors: Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr., David B. Stone
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Publication number: 20190363047Abstract: A panel assembly is configured with individual laminates to connect processors in parallel. The individual laminates may be arranged in rows and columns and separated by gaps on adjacent sides. This arrangement forms a placement area comprising a portion of the individual laminates resident in both neighboring rows and neighboring columns. A chip may be disposed on the substrate, the chip spanning the gaps to contact the portion of the individual laminates found in the placement area.Type: ApplicationFiled: May 24, 2018Publication date: November 28, 2019Applicant: GLOBALFOUNDRIES INC.Inventors: Edmund Blackshear, Eric W. Tremble, Wolfgang Sauter, David B. Stone
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Patent number: 10483233Abstract: A multi-chip module, and method of fabricating the multi-chip module. The multi-chip module includes: a substrate containing multiple wiring layers, each wiring layer having first pads on a top surface of the substrate and second pads on a bottom surface of the substrate, wherein the second pads include split pad and a conventional pad; a first solder ball in direct physical contact with a contiguous bottom surface of the conventional pad and connected to a next level of packaging under the conventional pad, wherein the first solder ball has a first height; and a second solder ball in direct physical contact with first and second sections of the split pad separated by a gap, wherein the second solder ball has a second height that is sufficiently less than the first height such that the second solder ball is not connected to the next level of packaging.Type: GrantFiled: January 26, 2017Date of Patent: November 19, 2019Assignee: International Business Machines CorporationInventors: Anson J. Call, Erwin B. Cohen, Dany Minier, Wolfgang Sauter, David B. Stone, Eric W. Tremble
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Publication number: 20190287879Abstract: An IC chip structure including a plurality of IC chips electrically connected to one another in back-end-of-line (BEOL) interconnect layer of the structure is disclosed. The IC structure may include openings in crack-stop structures surrounding the IC chips and a interconnect wire extending between the IC chips through the openings. A packaging structure for utilizing the IC structure where at least one IC chip is inoperable is also disclosed. The structure may include a first bond pad array on a top surface of a packaging substrate including operable bond pads connected to an operable IC chip and structural support bond pads connected to the inoperable IC chip; a second bond pad array on a bottom surface of the substrate including operable bond pads connected to a single IC chip printed circuit board; and an interconnect structure for connecting the operable bond pads of the first and second bond pad arrays.Type: ApplicationFiled: March 15, 2018Publication date: September 19, 2019Inventors: Wolfgang Sauter, Mark W. Kuemerle, Eric W. Tremble, David B. Stone, Nicholas A. Polomoff, Eric S. Parent, Jawahar P. Nayak, Seungman Choi
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Patent number: 10214929Abstract: A pool cover apparatus includes a sheet of corrugated polyethylene as a vapor barrier, where the sheet is wound onto a storage shaft when not in use. A drive shaft is disposed in a spaced-apart relationship with the storage shaft. When it is desired to deploy the sheet to cover the surface of a pool, the sheet passes over the drive shaft and the corrugations on the polyethylene sheet engage with the teeth on the drive shaft. Thus, as the drive shaft rotates, it causes the vapor barrier sheet to continue to move out and away from the shafts and cover the pool. Conversely, when it is desired to remove the sheet from the pool, the storage shaft is engaged, rotating in a manner that functions as a take-up reel and winds the vapor barrier sheet up on the shaft for storage.Type: GrantFiled: December 23, 2016Date of Patent: February 26, 2019Inventor: David B. Stone, Jr.
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Patent number: 9935058Abstract: Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor.Type: GrantFiled: November 21, 2016Date of Patent: April 3, 2018Assignee: International Business Machines CorporationInventors: Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr., David B. Stone
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Publication number: 20180068957Abstract: Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor.Type: ApplicationFiled: October 27, 2017Publication date: March 8, 2018Inventors: Mark C. Lamorey, Janak G. Patel, Peter Slota, JR., David B. Stone
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Publication number: 20170198486Abstract: A pool cover apparatus includes a sheet of corrugated polyethylene as a vapor barrier, where the sheet is wound onto a storage shaft when not in use. A drive shaft is disposed in a spaced-apart relationship with the storage shaft. When it is desired to deploy the sheet to cover the surface of a pool, the sheet passes over the drive shaft and the corrugations on the polyethylene sheet engage with the teeth on the drive shaft. Thus, as the drive shaft rotates, it causes the vapor barrier sheet to continue to move out and away from the shafts and cover the pool. Conversely, when it is desired to remove the sheet from the pool, the storage shaft is engaged, rotating in a manner that functions as a take-up reel and winds the vapor barrier sheet up on the shaft for storage.Type: ApplicationFiled: December 23, 2016Publication date: July 13, 2017Inventor: David B. Stone, JR.
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Publication number: 20170148749Abstract: A laminate structure includes a conductive layer and a dielectric layer in contact with the conductive layer, the dielectric layer comprises a selectively patterned high-modulus dielectric material that balances a differential stress between the conductive layer and the dielectric layer to mechanically stiffen the laminate structure and reduce warpage.Type: ApplicationFiled: February 7, 2017Publication date: May 25, 2017Inventors: Mark C. Lamorey, Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell, Peter Slota, JR., David B. Stone
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Publication number: 20170141078Abstract: A multi-chip module, and method of fabricating the multi-chip module. The multi-chip module includes: a substrate containing multiple wiring layers, each wiring layer having first pads on a top surface of the substrate and second pads on a bottom surface of the substrate, wherein the second pads include split pad and a conventional pad; a first solder ball in direct physical contact with a contiguous bottom surface of the conventional pad and connected to a next level of packaging under the conventional pad, wherein the first solder ball has a first height; and a second solder ball in direct physical contact with first and second sections of the split pad separated by a gap, wherein the second solder ball has a second height that is sufficiently less than the first height such that the second solder ball is not connected to the next level of packaging.Type: ApplicationFiled: January 26, 2017Publication date: May 18, 2017Inventors: Anson J. Call, Erwin B. Cohen, Dany Minier, Wolfgang Sauter, David B. Stone, Eric W. Tremble
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Publication number: 20170125358Abstract: Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor.Type: ApplicationFiled: November 21, 2016Publication date: May 4, 2017Inventors: Mark C. Lamorey, Janak G. Patel, Peter Slota, JR., David B. Stone
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Patent number: 9633914Abstract: A multi-chip module and method of fabricating a multi-chip module. The multi-chip module includes: a substrate having a top surface and a bottom surface and containing multiple wiring layers, first pads on the top surface of the substrate and second pads on the bottom surface of the substrate; a first active component attached to a first group of the first pads and a second active component attached to a second group of the first pads; wherein at least one pad of the second pads is a split pad having a first section and a non-contiguous second section separated by a gap, the first section connected by a first wire of the multiple wires to a pad of the first group of first pads and the second section is connected by a second wire of the multiple wires to a pad of the second group of first pads.Type: GrantFiled: September 15, 2015Date of Patent: April 25, 2017Assignee: International Business Machines CorporationInventors: Anson J. Call, Erwin B. Cohen, Dany Minier, Wolfgang Sauter, David B. Stone, Eric W. Tremble
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Patent number: 9613915Abstract: A laminate structure includes a conductive layer and a dielectric layer in contact with the conductive layer, the dielectric layer comprises a selectively patterned high-modulus dielectric material that balances a differential stress between the conductive layer and the dielectric layer to mechanically stiffen the laminate structure and reduce warpage.Type: GrantFiled: December 2, 2014Date of Patent: April 4, 2017Assignee: International Business Machines CorporationInventors: Mark C. Lamorey, Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell, Peter Slota, Jr., David B. Stone
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Patent number: 9599664Abstract: Detection circuits, methods of use and manufacture and design structures are provided herein. The structure includes at least one signal line traversing one or more metal layers of an integrated circuit. Circuitry is coupled to the at least one signal line, which is structured to receive a signal with a known signal from the at least one signal line or a signal from a different potential and, based on which signal is received, determine whether there is a structural defect in the integrated circuit.Type: GrantFiled: May 15, 2015Date of Patent: March 21, 2017Assignee: GLOBALFOUNDRIES INC.Inventors: Luke D. Lacroix, Mark C. H. Lamorey, Steven F. Oakland, Janak G. Patel, Kerry P. Pfarr, Peter Slota, Jr., David B. Stone
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Publication number: 20170077000Abstract: A multi-chip module and method of fabricating a multi-chip module. The multi-chip module includes: a substrate having a top surface and a bottom surface and containing multiple wiring layers, first pads on the top surface of the substrate and second pads on the bottom surface of the substrate; a first active component attached to a first group of the first pads and a second active component attached to a second group of the first pads; wherein at least one pad of the second pads is a split pad having a first section and a non-contiguous second section separated by a gap, the first section connected by a first wire of the multiple wires to a pad of the first group of first pads and the second section is connected by a second wire of the multiple wires to a pad of the second group of first pads.Type: ApplicationFiled: September 15, 2015Publication date: March 16, 2017Inventors: Anson J. Call, Erwin B. Cohen, Dany Minier, Wolfgang Sauter, David B. Stone, Eric W. Tremble
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Patent number: 9543255Abstract: A laminate structure includes a conductive layer and a dielectric layer in contact with the conductive layer, the dielectric layer comprises a selectively patterned high-modulus dielectric material that balances a differential stress between the conductive layer and the dielectric layer to mechanically stiffen the laminate structure and reduce warpage.Type: GrantFiled: February 15, 2016Date of Patent: January 10, 2017Assignee: International Business Machines CorporationInventors: Mark C. Lamorey, Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell, Peter Slota, Jr., David B. Stone