Patents by Inventor David Barry Rennie

David Barry Rennie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semi-aqueous photoresist or semiconductor manufacturing residue stripping and cleaning composition with improved silicon passivation
    Patent number: 10073351
    Abstract: A photoresist or semiconductor manufacturing residue stripping and cleaning composition comprising water, one or more alkaline compounds, one or more corrosion inhibitors, and one or more oxidized products of one or more antioxidants, the method of making the composition and the method of using the composition.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: September 11, 2018
    Assignee: VERSUM MATERIALS US, LLC
    Inventors: Rajiv Krishan Agarwal, Mark Richard Brown, Aiping Wu, David Barry Rennie, Yi-Chia Lee, Gene Everad Parris
  • Semi-Aqueous Photoresist or Semiconductor Manufacturing Residue Stripping and Cleaning Composition with Improved Silicon Passivation
    Publication number: 20160179011
    Abstract: A photoresist or semiconductor manufacturing residue stripping and cleaning composition comprising water, one or more alkaline compounds, one or more corrosion inhibitors, and one or more oxidized products of one or more antioxidants, the method of making the composition and the method of using the composition.
    Type: Application
    Filed: December 9, 2015
    Publication date: June 23, 2016
    Applicant: AIR PRODUCTS AND CHEMICALS, INC.
    Inventors: Rajiv Krishan Agarwal, Mark Richard Brown, Aiping Wu, David Barry Rennie, Yi-Chia Lee, Gene Everad Parris
  • Method for wafer dicing and composition useful thereof
    Patent number: 9328318
    Abstract: A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.
    Type: Grant
    Filed: March 3, 2014
    Date of Patent: May 3, 2016
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Dnyanesh Chandrakant Tamboli, Rajkumar Ramamurthi, David Barry Rennie, Madhukar Bhaskara Rao, Gautam Banerjee, Gene Everad Parris
  • Method for wafer dicing and composition useful thereof
    Patent number: 8883701
    Abstract: A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: November 11, 2014
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Dnyanesh Chandrakant Tamboli, Rajkumar Ramamurthi, David Barry Rennie, Madhukar Bhaskara Rao, Gautam Banerjee, Gene Everad Parris
  • Method for Wafer Dicing and Composition Useful Thereof
    Publication number: 20140170835
    Abstract: A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.
    Type: Application
    Filed: March 3, 2014
    Publication date: June 19, 2014
    Applicant: AIR PRODUCTS AND CHEMICALS, INC.
    Inventors: Dnyanesh Chandrakant Tamboli, Rajkumar Ramamurthi, David Barry Rennie, Madhukar Bhaskara Rao, Gautam Banerjee, Gene Everad Parris
  • Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor
    Patent number: 8580656
    Abstract: Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; a hydroxycarboxylic acid and/or salt thereof or amine group containing acid, a surfactant and deionized water is employed.
    Type: Grant
    Filed: July 8, 2009
    Date of Patent: November 12, 2013
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Terence Quintin Collier, Charles A. Lhota, David Barry Rennie, Rajkumar Ramamurthi, Madhukar Bhaskara Rao, Dnyanesh Chandrakant Tamboli
  • Method for Wafer Dicing and Composition Useful Thereof
    Publication number: 20120009762
    Abstract: A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.
    Type: Application
    Filed: June 28, 2011
    Publication date: January 12, 2012
    Applicant: AIR PRODUCTS AND CHEMICALS, INC.
    Inventors: Dnyanesh Chandrakant Tamboli, Rajkumar Ramamurthi, David Barry Rennie, Madhukar Bhaskara Rao, Gautam Banerjee, Gene Everad Parris
  • Process for Inhibiting Corrosion and Removing Contaminant from a Surface During Wafer Dicing and Composition Useful Therefor
    Publication number: 20100009517
    Abstract: Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; a hydroxycarboxylic acid and/or salt thereof or amine group containing acid, a surfactant and deionized water is employed.
    Type: Application
    Filed: July 8, 2009
    Publication date: January 14, 2010
    Applicant: AIR PRODUCTS AND CHEMICALS, INC.
    Inventors: Terence Quintin Collier, Charles A. Lhota, David Barry Rennie, Rajkumar Ramamurthi, Madhukar Bhaskara Rao, Dnyanesh Chandrakant Tamboli
  • Compositions for removing etching residue and use thereof
    Patent number: 6821352
    Abstract: A composition for removing etching residue and a method using same are disclosed herein. In one aspect, there is provided a method for removing etching residue from a substrate comprising: contacting the substrate with a composition comprising water, an organic dicarboxylic acid, a buffering agent, a fluorine source, and optionally a water miscible organic solvent.
    Type: Grant
    Filed: November 26, 2003
    Date of Patent: November 23, 2004
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Roberto John Rovito, David Barry Rennie, Dana L. Durham
  • Compositions for removing etching residue and use thereof
    Publication number: 20040171503
    Abstract: A composition for removing etching residue and a method using same are disclosed herein. In one aspect, there is provided a method for removing etching residue from a substrate comprising: contacting the substrate with a composition comprising water, an organic dicarboxylic acid, a buffering agent, a fluorine source, and optionally a water miscible organic solvent.
    Type: Application
    Filed: November 26, 2003
    Publication date: September 2, 2004
    Inventors: Roberto John Rovito, David Barry Rennie, Dana L. Durham
  • Compositions for removing etching residue and use thereof
    Patent number: 6677286
    Abstract: Compositions containing water, an organic dicarboxylic acid, a buffering agent and fluorine source and optionally a water miscible organic solvent are capable of removing etching residue.
    Type: Grant
    Filed: July 10, 2002
    Date of Patent: January 13, 2004
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Roberto John Rovito, David Barry Rennie, Dana L. Durham