Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.

Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.

Abstract: A converter including a semiconductor module and a cooling housing. The semiconductor module includes a semiconductor chip, a substrate having a first side and a second side, a base plate having a first side and a second side, and a molding compound. The semiconductor chip connects to the first side of the substrate. The second side of the substrate connects to the first side of the base plate, the second side of the base plate has a first region and a second region. The first region has a surface expansion, and the first region having the surface expansion contacts with a coolant liquid in an operating state. The second region forms a closed path around the first region, the cooling housing has a plate including at least one hole, and the plate is connected around the hole to the second region of the base plate by welding.

Abstract: A vehicle service tag sheet system for facilitating a vehicle service request generally includes a pad of sheets attached to a backing material of a thickness sufficient to allow a service station attendant to take notes on one of the sheets without placing the pad on a hard surface. In one embodiment, each sheet includes a vehicle identification section that has printed thereon an identification number, and a key identification section that has printed thereon the identification number. Each sheet also includes a services section that has printed thereon the identification number and prompts for reminding the user to take down pertinent information for the vehicle service request.

Abstract: A method and apparatus for normalizing the acceleration constant used by a servo control system in a disc drive are disclosed. The method and apparatus involve performing a test seek and summing the position error measured at sample periods during the deceleration phase of the test seek. A correction factor applied to the acceleration constant is adjusted if the sum of the position errors differs from the sum of position errors measured from a nominal seek. Adjusting the correction factor to cause a position error sum that is close or equal to the sum from the nominal seek provides a relatively symmetrical seek arrival without additional correction factor offsets or gain variances.

Abstract: The present invention is a method of correcting radial position error signal (PES) values by utilizing predetermined error correction values located at predetermined locations in advance of their associated servo fields. Calculated correction values are written to zero-acceleration path (ZAP) fields on the disc during the manufacture process. ZAP fields are positioned before the servo fields whose PES they are designed to correct. The ZAP field is comprised of two or more correction data elements to correct subsequent PES values. As the read/write head flies along a track, it reads a ZAP field, and stores the PES correction data in local random access memory (RAM). Subsequently, the corresponding servo field is read and the stored PES correction data is used to correct the PES. Two types of ZAP fields are written on the disc—one type for read operations, another type for write operations.

Abstract: A thermostat for use within a building consisting of a wall-mounted unit and a remote unit movably attached thereto by means of a removable, flexible connecting cable. The remote unit is composed of a separate base portion and a separate movable portion. The base portion is provided with means for attaching the base portion to the back of a room furnishing and the movable portion can removably attach to either the wall-mounted unit when the connecting cable is removed or to the base portion when the connecting cable is reattached. The base portion is provided with "U" shaped sides which form a track for movably receiving the movable portion when the movable portion is disengaged from the wall-mounted unit.