Abstract: A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.

Abstract: An integrated device package includes a housing having a first opening and a second opening in fluid communication with an interior volume of the housing. A package substrate(s) has a first port and a second port. A first device die is mounted to the substrate(s) over the first port. A second device die is mounted to the substrate(s) over the second port. The substrate(s) is coupled to the housing to cover the first and second openings such that the first device die is disposed within the interior volume through the first opening and the second device die is disposed within the interior volume through the second opening.

Abstract: A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the first surface of the substrate and positioned over the opening. A cover substrate has a plurality of metal traces. A cavity in the cover substrate forms side wall sections around the cavity. The cover substrate is attached to the base substrate so the at least one die is positioned in the interior of the cavity. Ground planes in the base substrate are coupled to ground planes in the cover substrate to form an RF shield around the at least one die.

Abstract: Various embodiments related to a compact device package are disclosed herein. In some arrangements, a flexible substrate can be coupled to a carrier having walls angled relative to one another. The substrate can be shaped to include two bends. First and second integrated device dies can be mounted on opposite sides of the substrate between the two bends in various arrangements.

Abstract: A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.

Abstract: A packaged microphone has a base and a lid that at least in part form a package having a plurality of exterior sides and an interior chamber. The packaged microphone also has a flexible substrate having a first portion within the interior chamber, and a second portion, extending from the interior chamber, having at least two sets of pads. A MEMS microphone die is mounted to the first portion of the flexible substrate, and each set of pads is in electrical communication with the microphone die. One set of pads is on a first exterior side of the package, and a second set of pads is on a second exterior side of the package.

Abstract: A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.

Abstract: A microphone system has a package with a top, a bottom, and four sides that at least in part form an interior chamber. One of the sides forms an inlet aperture for communicating the inlet chamber with the exterior environment. The system also has first and second microphone dies, in a stacked relationship, respectively having a first and second diaphragms. A circuit die, positioned in electrical communication with the first and second microphone dies, is configured to mitigate vibrational noise from the first microphone die using a signal produced by the second microphone die or vice versa. The first and second microphone dies are positioned so that the first and second diaphragms are substantially the same distance from the inlet aperture in the side.

Abstract: A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.

Abstract: Various embodiments related to a compact device package are disclosed herein. In some arrangements, a flexible substrate can be coupled to a carrier having walls angled relative to one another. The substrate can be shaped to include two bends. First and second integrated device dies can be mounted on opposite sides of the substrate between the two bends in various arrangements.

Abstract: Various embodiments of a compact sensor module are disclosed herein. The sensor module can include a stiffener and a sensor substrate having a mounting segment and a first wing segment extending from the mounting segment. The first wing segment may be folded around an edge of the stiffener. A sensor die may be mounted on the mounting segment of the sensor substrate. A processor substrate may be coupled to the sensor substrate. A processor die may be mounted on the processor substrate and may be in electrical communication with the sensor die.

Abstract: A fingerprint sensor package includes a flat surface having a dielectric protective coating protecting a sensing element of a fingerprint sensor and an electrically conductive bezel that discharges electrostatic discharge (ESD). Both the protective coating and the bezel can be colored to have desired colors. Accordingly, the flat surface can be colored as desired enhancing the attractiveness for consumer applications. Further, light emitting diodes are integrated into the fingerprint sensor package providing a visual feedback to the user that the user's fingerprint has been successfully sensed. Further, the fingerprint sensor package is formed using a high volume low cost assembly technique.

Abstract: A microphone system has a package forming an interior chamber, and a MEMS microphone secured within the interior chamber. The package forms an aperture for permitting acoustic access to the interior of the chamber and thus, the MEMS microphone. The system also has two dies; namely, the system has a primary circuit die within the interior chamber, and an integrated passive device die electrically connected with the primary circuit die. The primary circuit die is electrically connected with the MEMS microphone and has at least one active circuit element.

Abstract: A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first surface of the package substrate inside the first cavity and over the hole. A port can be formed in the first lid or the second lid.

Abstract: A method of forming a light emitting diode (LED) package includes mounting a LED structure to a carrier, overmolding the LED structure in a package body, backgrinding the package body to expose the LED structure, removing the carrier, and forming a redistribution layer (RDL) buildup structure comprising a RDL circuit pattern coupled to a LED of the LED structure. The LED package is formed without a substrate in one embodiment. By forming the LED package without a substrate, the thickness of the LED package is minimized. Further, by forming the LED package without a substrate, heat removal from the LED is maximized as is electrical performance. Further still, by forming the LED package without a substrate, the fabrication cost of the LED package is minimized.

Abstract: A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the first surface of the substrate and positioned over the opening. A cover substrate has a plurality of metal traces. A cavity in the cover substrate forms side wall sections around the cavity. The cover substrate is attached to the base substrate so the at least one die is positioned in the interior of the cavity. Ground planes in the base substrate are coupled to ground planes in the cover substrate to form an RF shield around the at least one die.

Abstract: A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the first surface of the substrate and positioned over the opening. A cover substrate has a plurality of metal traces. A cavity in the cover substrate forms side wall sections around the cavity. The cover substrate is attached to the base substrate so the at least one die is positioned in the interior of the cavity. Ground planes in the base substrate are coupled to ground planes in the cover substrate to form an RF shield around the at least one die.

Abstract: A semiconductor device has a first substrate having a plurality of metal traces. At least one electronic component is electrically attached to a first surface of the first substrate. A second substrate has a plurality of metal traces and attached to the first substrate. At least one electronic component is electrically attached to a first surface of the second substrate. An RF shield is formed on the first substrate to minimizing Electro-Magnetic Interference (EMI) radiation and Radio Frequency (RF) radiation to the at least one electronic component on the first substrate to form an RF shield. A mold compound is used for encapsulating the semiconductor device.

Abstract: A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. A cover substrate having a plurality of metal traces and a plurality of cover vias is provided. A first die is attached to the first surface of the substrate and positioned over the opening. Side members are coupled to ground planes on the base substrate and cover substrate to form an RF shield around the first die. At least one wirebond having a first end attached to the first die and a second end attached to a metal trace of the base substrate is provided. The at least one wirebond forms a loop wherein a top section of the loop contacts a metal trace of the cover substrate.

Abstract: An integrated circuit module has a substrate having a plurality of metal traces. At least one semiconductor package is electrically coupled to at least one metal trace on a first surface of the substrate. At least one electronic component is electrically coupled to at least one metal trace on the first surface of the substrate. A non-conductive coating covers exposed active surfaces on the first surface of the substrate. A conductive coating is applied to the non-conductive coating, and electrically contacting ground pads exposed on the substrate.