Patents by Inventor David Boretti

David Boretti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9374924
    Abstract: A mounting enclosure assembly configured to mount an electronic component onto a DIN rail. The mounting enclosure assembly includes a mounting bracket having a slot configured to receive the DIN rail therein. The mounting enclosure assembly further includes a locking mechanism configured to selectively engage the DIN rail. The locking mechanism includes a release button and a protrusion positioned proximate the slot and configured to releasably engage a first flange of the DIN rail. The locking mechanism further includes a first hinged armature connected to the release button and the first protrusion, wherein the first protrusion is configured to disengage the first flange of the DIN rail when the release button is depressed. Other embodiments of the mounting enclosure assembly, as well as methods directed to the mounting enclosure assembly, are further disclosed.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: June 21, 2016
    Assignee: SCHNEIDER ELECTRIC BUILDINGS, LLC
    Inventor: David Boretti
  • Patent number: 9341270
    Abstract: A globe valve assembly includes a globe valve and a bonnet secured to a housing of the globe valve. The globe valve assembly further includes a yoke assembly having a yoke secured to a globe valve actuator, and a connector assembly secured to the yoke and configured to be connected to the bonnet to secure the globe valve to the globe valve actuator. The connector assembly includes a first arm pivotally secured to the yoke and a second arm pivotally secured to the yoke, with the first arm and the second arm being movable between an open position in which the yoke can receive the bonnet and a closed position in which the arms engage and connect the bonnet to the yoke, and a latch to fasten the arms in the closed position.
    Type: Grant
    Filed: July 28, 2014
    Date of Patent: May 17, 2016
    Assignee: SCHNEIDER ELECTRIC BUILDINGS, LLC
    Inventor: David Boretti
  • Publication number: 20160081215
    Abstract: A mounting enclosure assembly configured to mount an electronic component onto a DIN rail. The mounting enclosure assembly includes a mounting bracket having a slot configured to receive the DIN rail therein. The mounting enclosure assembly further includes a locking mechanism configured to selectively engage the DIN rail. The locking mechanism includes a release button and a protrusion positioned proximate the slot and configured to releasably engage a first flange of the DIN rail. The locking mechanism further includes a first hinged armature connected to the release button and the first protrusion, wherein the first protrusion is configured to disengage the first flange of the DIN rail when the release button is depressed. Other embodiments of the mounting enclosure assembly, as well as methods directed to the mounting enclosure assembly, are further disclosed.
    Type: Application
    Filed: September 16, 2014
    Publication date: March 17, 2016
    Inventor: David Boretti
  • Publication number: 20160025227
    Abstract: A globe valve assembly includes a globe valve and a bonnet secured to a housing of the globe valve. The globe valve assembly further includes a yoke assembly having a yoke secured to a globe valve actuator, and a connector assembly secured to the yoke and configured to be connected to the bonnet to secure the globe valve to the globe valve actuator. The connector assembly includes a first arm pivotally secured to the yoke and a second arm pivotally secured to the yoke, with the first arm and the second arm being movable between an open position in which the yoke can receive the bonnet and a closed position in which the arms engage and connect the bonnet to the yoke, and a latch to fasten the arms in the closed position.
    Type: Application
    Filed: July 28, 2014
    Publication date: January 28, 2016
    Inventor: David Boretti