Abstract: Aspects include a cryptographic hardware security module having a secure embedded heat pipe and methods for assembling the same. The cryptographic hardware security module can include a printed circuit board having one or more components. The cryptographic hardware security module can further include an encapsulation structure having a top can and a bottom can. The top can is fixed to a first surface of the printed circuit board and the bottom can is fixed to second surface of the printed circuit board opposite the first surface. A heat pipe is positioned between the top can and the component. The heat pipe includes two or more 180-degree bends. A portion of the heat pipe extends beyond a secure region of the encapsulation structure.

Abstract: A structure of a circuitry substrate for securing an area from tampering is disclosed. The structure includes a circuitry substrate with at least one of a top tamper enclosure and a bottom tamper enclosure covering a component in a protected area of the circuitry substrate. The top and bottom tamper enclosures are adhesively bonded to a surface of the circuitry substrate, and a tear initiation site is added to a side of the perimeter of circuitry substrate bordering the protected area that includes at least one tamper enclosure, such that the tear initiation site is located and configured to enable propagation of a delamination of at least one internal layer of the circuitry substrate and a severing of a security circuit when a removal force is applied to the at least one of the top tamper enclosure and the bottom tamper enclosure.

Abstract: An electronic component includes a first trace configured to transmit a first signal and a second trace configured to transmit a second signal. The electronic component further includes a layer of conductive material separated from the first and second traces by a layer of insulative material. The electronic component further includes a first vertical wall formed in direct contact with the layer of conductive material. The electronic component further includes a second vertical wall formed in direct contact with the layer of conductive material. The second vertical wall is separated from the first vertical wall by a void, and the void extends between the first trace and the second trace.

Abstract: Methods and systems provide for assessing likelihood of market success of a flavor. One embodiment of a method includes (a) collecting input information from a consumer regarding at least one food related preference; (b) analyzing the input information using a computer algorithm in order to assign the consumer to one of a plurality of distinct consumer segments based on the consumer's food related preferences; (c) collecting input information from the consumer regarding preference level of at least one flavor for a particular consumable product; (d) analyzing the input information and assigning the preference level of the at least one flavor within each distinct consumer segment; and (e) determining the impact of the at least one flavor within each distinct consumer segment.

Abstract: Disclosed is a telephone accessible system that stores one or more messages for a subscriber. The subscriber is given a card with their subscriber number and an access code. In one embodiment, a first responder or other user needing to access the recorded messages, finds the card, calls the system and enters the subscriber number and access code to retrieve one or more of the messages. In one embodiment, the messages are digital audio recordings that contain medical information useful to a first responder before treating the subscriber. The messages can only be changed upon submission of a password that is unique to the subscriber. In one embodiment, the first responder can record an alert message that is transmitted to individuals or entities previously designed by a subscriber to receive an alert message.

Abstract: A method of preparing a particulate refractory composition for use in the manufacture of foundry molds and cores from spent foundry molds or cores formed of refractory material and an ester-cured phenolic resin binder, the method comprising the steps of breaking up the spent foundry molds or cores, mixing the resulting broken material with a particulate pozzolan additive and subjecting the mixture to a heat treatment at a temperature in the range 450 to 900°.

Abstract: A system and method for providing an outdoor flooring such as a lightweight deck surface, employs a fiber reinforced polymer structural panel with plural grid openings therein. A fastener is driven into selected openings to enable the panel to be secured to a deck frame. A surfacing material, such as a quarried stone, is attached to the top of the panel, providing a stone deck surface without requiring substantial structural support.