Abstract: An apparatus for providing a stiffener and cooling to a printed circuit board includes a printed circuit board coupled to a top surface of a stiffening cooling structure, where a lower surface of the printed circuit board is opposite the top surface of the stiffening cooling structure. One or more channels of the stiffening cooling structure defined by the top surface of the stiffening cooling structure, a bottom surface of the stiffening cooling structure, and one or more support members, where the one or more support members are positioned between the top surface of the stiffening cooling structure and the bottom surface of the stiffening cooling. One or more apertures in the top surface of the stiffening cooling structure directs airflow from the one or more channels of the stiffening cooling structure to one or more components disposed on a top surface of the printed circuit board.

Abstract: A shaving or shearing blade utilized in dressing solder joint chip technologies without the use of heat or a copper block wicking process. In essence, any solder debris resulting from the solder shaving process as implemented by the shaving blade is removed through the intermediary of a vacuum arrangement located as an integral structure in the shaving blade so as to inhibit the potential formation of electrical shorts or causing solder damage in subsequent replacement chip joins or other assembly operations.

Abstract: A shaving or shearing blade utilized in dressing solder joint chip technologies without the use of heat or a copper block wicking process. In essence, any solder debris resulting from the solder shaving process as implemented by the shaving blade is removed through the intermediary of a vacuum arrangement located as an integral structure in the shaving blade so as to inhibit the potential formation of electrical shorts or causing solder damage in subsequent replacement chip joins or other assembly operations.

Abstract: Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.

Abstract: Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.

Abstract: Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.