Abstract: A microfluidic cartridge is provided. The microfluidic cartridge has an interior and an exterior. The microfluidic cartridge includes a reservoir disposed in the interior of the microfluidic cartridge and configured to contain a fluid composition. The microfluidic cartridge includes an electric circuit disposed on the exterior of the microfluidic cartridge. The electric circuit comprises a first end portion having electrical contacts and a second end portion opposing the first end portion. The microfluidic cartridge includes a microfluidic die disposed on the exterior of the microfluidic cartridge, wherein the microfluidic die is electrically connected with the second end portion of the electric circuit and in fluid communication with the reservoir. A silicone pressure-sensitive adhesive is used to join the electric circuit with the exterior of the microfluidic cartridge.

Abstract: A microfluidic cartridge is provided. The microfluidic cartridge has an interior and an exterior. The microfluidic cartridge includes a reservoir disposed in the interior of the microfluidic cartridge and configured to contain a fluid composition. The microfluidic cartridge includes an electric circuit disposed on the exterior of the microfluidic cartridge. The electric circuit comprises a first end portion having electrical contacts and a second end portion opposing the first end portion. The microfluidic cartridge includes a microfluidic die disposed on the exterior of the microfluidic cartridge, wherein the microfluidic die is electrically connected with the second end portion of the electric circuit and in fluid communication with the reservoir. A silicone pressure-sensitive adhesive is used to join the electric circuit with the exterior of the microfluidic cartridge.

Abstract: Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

Abstract: A nozzle plate for a micro-fluid ejection head, a method of making a hydrophobic nozzle plate, and a method for improving the resiliency of a nozzle plate. The nozzle has a photoimageable hydrophobic polycyclic polyolefin layer derived from an epoxy functionalized polynorbornene.

Abstract: Thermally curable adhesive compositions and method for failure analysis in micro-fluid ejections heads. The adhesive composition may be provided by a composition including from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin, from about 0.1 to about 30.0 percent by weight of at least one thermal curative agent, and from about 0.0 to about 5.0 percent by weight filler, from about 0.1 to about 10.0 percent by weight fluorescent pigment. Upon curing, the adhesive composition exhibits a relatively low shear modulus.

Abstract: Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

Abstract: Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

Abstract: Micro-fluid ejection head structures, methods of making micro-fluid ejection head structures having improved operability, and methods for improving the durability of micro-fluid ejection head structures are provided. One such micro-fluid ejection head structure includes a micro-fluid ejection head having a substrate and nozzle plate assembly adhesively attached adjacent to a substrate support using a substrate adhesive. The nozzle plate is adhesively attached adjacent to the substrate with a nozzle plate adhesive. A thermally, UV or other cure mechanism encapsulant material is attached adjacent to the ejection head and substrate support. Each of the substrate adhesive, and the encapsulant material, after curing, have a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.

Abstract: Disclosed is a micro-fluid ejection head of an inkjet print cartridge. More specifically, disclosed is a thermally curable encapsulant composition for use in the micro-fluid ejection head of the inkjet print cartridge. The encapsulant composition includes from about 1.5 to about 95 percent by weight of one or more cross-linkable epoxy resins having a rigid backbone. Further, the encapsulant composition includes about 0.1 to about 35 percent by weight of one or more thermal curative agents. Further disclosed is a method for protecting the micro-fluid ejection head using the encapsulant composition.

Abstract: A method for making a dry film photoresist layer for a micro-fluid ejection head and a micro-fluid ejection head made by the method. The method includes applying a photoimageable liquid to a moving web of release material to provide a photoimageable layer on the release material using a slot die coater. The layer on the release material has a coating thickness ranging from about 8 to about 25 microns with a thickness variation of no more than about one micron. The photoimageable layer on the web is dried to provide a dry film photoresist layer. A protective web is then applied to the dry film photoresist layer.

Abstract: A nozzle plate for a micro-fluid ejection head, a method of making a hydrophobic nozzle plate, and a method for improving the resiliency of a nozzle plate. The nozzle has a photoimageable hydrophobic polycyclic polyolefin layer derived from an epoxy functionalized polynorbornene.

Abstract: Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).