Abstract: A semiconductor structure is provided that includes a gate structure that is wired to a backside signal line through a backside gate contact extension and a backside skip-level through via. The backside skip-level through via has a dielectric spacer located on a sidewall thereof and a portion of the backside skip-level through via is positioned between a pair of backside power rails that are located in a first backside metal level that is located beneath a second backside metal level that includes the backside signal line.

Abstract: An operation management system is disclosed. The operation management system may receive a video stream from a wearable device of a user that is performing an operation in a physical environment. The operation management system may process, using an operation performance model, a set of frames of the video stream that indicates a state of a performance of the operation by the user. The operation management system may determine, based on the state of the performance by the user, a next task of the operation. The operation management system may configure display data that is associated with a physical object that is associated with the next task. The display data may be associated with an indicator that identifies the physical object and/or task information associated with performing the next task. The operation management system may provide the display data to the wearable device.

Abstract: Embodiments include super via placement in the development of an integrated circuit. Aspects of the invention include obtaining a power distribution network for the integrated circuit (IC) IC, wherein the PDN includes a plurality of metal vias each configured to connect adjacent metal layers of a plurality of metal layers. Aspects also include placing one or more cells on each metal layer of the IC and identifying a power demand associated with each of the one or more cells. Aspects further include updating the PDN, based on the power demand associated with each of the one or more cells, to replace at least two of the plurality of metal vias with a super via that is configured to connect non-adjacent metal layers of the plurality of metal layers.

Abstract: The invention provides droplet actuator assemblies and systems and methods of manufacturing the droplet actuator assemblies. In certain embodiments, two-piece enclosures are used to form a droplet actuator assembly that houses a droplet operations substrate. In certain other embodiments, one-piece enclosures are used to form a droplet actuator assembly that houses a droplet operations substrate. In the plastic injection molding process for forming substrates of the droplet actuator assemblies of the present invention may utilize insert molding (or overmolding) processes for forming a gasket in at least one substrate, thereby avoiding the need for providing and installing a separate gasket component. Further, the droplet actuator assemblies may include features that allow ultrasonic welding processes to be used for bonding substrates together. The manufacturing systems of the present invention for fabricating the droplet actuator assemblies may utilize continuous flow reel-to-reel manufacturing processes.

Abstract: The invention provides droplet actuator assemblies and systems and methods of manufacturing the droplet actuator assemblies. In certain embodiments, two-piece enclosures are used to form a droplet actuator assembly that houses a droplet operations substrate. In certain other embodiments, one-piece enclosures are used to form a droplet actuator assembly that houses a droplet operations substrate. In the plastic injection molding process for forming substrates of the droplet actuator assemblies of the present invention may utilize insert molding (or overmolding) processes for forming a gasket in at least one substrate, thereby avoiding the need for providing and installing a separate gasket component. Further, the droplet actuator assemblies may include features that allow ultrasonic welding processes to be used for bonding substrates together. The manufacturing systems of the present invention for fabricating the droplet actuator assemblies may utilize continuous flow reel-to-reel manufacturing processes.

Abstract: Evaluating values of different terms in online auctions is disclosed. An interest rate and a period from a buyer for a lot are obtained. The lot has a predetermined value. A first bid is received from a first bidder and a second bid is received from a second bidder on the lot. The first and second bids each have a payment time and a rebate. The first bid is transformed into a first value and the second bid is transformed into a second value using the interest rate, period, and predetermined value from the buyer and the payment times and rebates from the first and second bidders.

Abstract: A method and system of evaluating values of different payment or delivery terms in online auctions, including obtaining an interest rate and a period from a buyer for a lot, the lot having a predetermined value, receiving a first bid from a first bidder and a second bid from a second bidder on the lot, the first and second bids each having a payment time and a rebate and transforming the first bid into a first value and the second bid into a second value using the interest rate, the period, and the predetermined value from the buyer, and the payment times and rebates from the first and second bidders.

Abstract: A method and system of evaluating values of different payment or delivery terms in online auctions, including obtaining an interest rate and a period from a buyer for a lot, the lot having a predetermined value, receiving a first bid from a first bidder and a second bid from a second bidder on the lot, the first and second bids each having a payment time and a rebate and transforming the first bid into a first value and the second bid into a second value using the interest rate, the period, and the predetermined value from the buyer, and the payment times and rebates from the first and second bidders.