Patents by Inventor David E. Nestle

David E. Nestle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5292462
    Abstract: This relates to a mold for rebonding polyurethane and like plastic foam to form selected shapes. A typical shape may be a back or a seat member for an article of furniture. The mold is improved in that the bottom mold member, which is particularly designed in accordance with the desired configuration of the shape, has been formed of epoxy which is readily moldable at a low cost. The mold is also improved by providing the base plate of the mold with a ramped floor which facilitates the drainage of condensate from a lower steam chamber. The configuration of the ramped floor allows for quick removal of the condensate and serves to reduce the volume in the steam chamber thereby minimizing pressure build-up in the steam chamber. This results in lower steam pressures being used during the curing process and for a shorter curing operation. The lower steam pressure also avoids leakage of steam and water from the epoxy mold.
    Type: Grant
    Filed: September 4, 1992
    Date of Patent: March 8, 1994
    Assignee: Herman Miller, Inc.
    Inventor: David E. Nestle
  • Patent number: 5173307
    Abstract: This relates to a mold for rebonding polyurethane and like plastic foam to form selected shapes. A typical shape may be a back or a seat member for an article of furniture. The mold is improved in that the bottom mold member, which is particularly designed in accordance with the desired configuration of the shape, has been formed of epoxy which is readily moldable at a low cost. The mold is also improved by providing the base plate of the mold with a ramped floor which facilitates the drainage of condensate from a lower steam chamber. The configuration of the ramped floor allows for quick removal of the condensate and serves to reduce the volume in the steam chamber thereby minimizing pressure build-up in the steam chamber. This results in lower steam pressures being used during the curing process and for a shorter curing operation. The lower steam pressure also avoids leakage of steam and water from the epoxy mold.
    Type: Grant
    Filed: January 9, 1991
    Date of Patent: December 22, 1992
    Assignee: Herman Miller, Inc.
    Inventor: David E. Nestle