Abstract: A vehicle charging adapter including a connector configured to engage with a charging port of a vehicle, and a receiver coupled to the connector. The receiver includes a receiver charging surface, an indicator provided on the receiver charging surface, an inner radial wall extending from the receiver charging surface and defining a receiver cavity extending along an insertion axis, and one or more receiver electrical contacts provided on the inner radial wall within the receiver cavity. The one or more receiver electrical contacts are electrically connected to the connector.

Abstract: A vehicle including a plurality of truck assemblies is provided. Each truck assembly includes a truck axle, a first wheel fixed to the truck axle, a second wheel selectively coupled to the truck axle, a motor configured to rotate the truck axle, and a clutch operatively coupled to the second wheel. The clutch is positionable between a coupled position and a decoupled position. When the clutch is in the coupled position, the second wheel rotates with the truck axle, and when the clutch is in the decoupled position, the second wheel is free to rotate relative to the truck axle.

Abstract: A wafer polisher and method for the chemical mechanical planarization of semiconductor wafers. The polisher includes a wafer holder for supporting the semiconductor wafer and a linear polishing assembly having a polishing member positioned to engage the surface of the wafer. The polishing member is movable in a linear direction relative to the wafer surface to uniformly polish the surface of the wafer. A pivotal alignment device may be used to pivotally support one of the wafer holder and the polishing member relative to the other of the wafer holder and the polishing member with the surface of the wafer and the polishing member retained in parallel alignment during operation of the polisher. The polisher optionally includes a conditioning station for conditioning the polishing member.

Abstract: A wafer polisher and method for the chemical mechanical planarization of semiconductor wafers. The polisher includes a wafer holder for supporting the semiconductor wafer and a linear polishing assembly having a polishing member positioned to engage the surface of the wafer. The polishing member is movable in a linear direction relative to the wafer surface to uniformly polish the surface of the wafer. A pivotal alignment device may be used to pivotally support one of the wafer holder and the polishing member relative to the other of the wafer holder and the polishing member with the surface of the wafer and the polishing member retained in parallel alignment during operation of the polisher. The polisher optionally includes a conditioning station for conditioning the polishing member.