Abstract: An apparatus for heat sealing thermoplastic articles includes a heater movable reciprocably in a longitudinal direction, and two opposed transversely reciprocable and pivotable carriers, each supporting a thermoplastic workpiece to be bonded. Two opposed heating surfaces of the platen heater are inclined and diverge in the longitudinal direction, to give the heater a "V" configuration. The carriers may be pivoted to a corresponding "V" configuration to position each workpiece against an associated heating surface of the platen. Following heating of the workpieces, pneumatic or other force applying cylinders urge the carriers toward one another as the heater is withdrawn from between them. Cam surfaces on the heater cooperate with cam following rollers on the carriers to control the position of the carriers during withdrawal of the heater, and permit rapid and accurate engagement of the thermoplastic articles after withdrawal.