Abstract: A tool for vibrationally joining a heel pad to a floor mat includes a platen having a first region and a second region. A first plurality of pins may extend from the first region of the platen, and a second plurality of pins may extend from the second region of the platen. The first plurality of pins are arranged non-parallel to the second plurality of pins. The method of joining a heel pad to a floor mat includes applying a glue between the heel pad and the floor mat, and thereafter vibrationally welding the heel pad and floor mat such that a perimeter region of the heel pad is recessed lower than an interior region of the heel pad. In another aspect of the subject invention, a perimeter region of a heel pad may be joined to a floor mat includes ultrasonically welding a portion of the perimeter or rim region of the heel pad to the floor mat, and thereafter ultrasonically welding the remaining portion of the perimeter region of the heel pad to the floor mat.