Patents by Inventor David G. Rohrer

David G. Rohrer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10461450
    Abstract: Example implementations relate signal connector braces. For instance, in an example a signal connector brace can include a housing having an exterior surface, and a protrusion extending from the housing to couple the housing to a via of a circuit board thereby positioning the exterior surface of the housing in contact with a corresponding exterior surface of a signal connector to brace the signal connector.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: October 29, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: James D. Hensley, David R. Cowles, David G. Rohrer
  • Patent number: 10439307
    Abstract: Examples herein relate to cuts in a circuit board. In some examples, a circuit board can include a signal connector located on the circuit board, and cuts extending through at least a body of the circuit board that are adjacent to the signal connector and extend from a perimeter of the circuit board to an inner portion of the circuit board, where the circuit board flexes relative to the signal connector responsive to the circuit board experiencing a force.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: October 8, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: James D. Hensley, David G. Rohrer, Brent A. Ford
  • Publication number: 20190036248
    Abstract: Examples herein relate to cuts in a circuit board. In some examples, a circuit board can include a signal connector located on the circuit board, and cuts extending through at least a body of the circuit board that are adjacent to the signal connector and extend from a perimeter of the circuit board to an inner portion of the circuit board, where the circuit board flexes relative to the signal connector responsive to the circuit board experiencing a force.
    Type: Application
    Filed: July 26, 2017
    Publication date: January 31, 2019
    Inventors: James D. Hensley, David G. Rohrer, Brent A. Ford
  • Publication number: 20190027845
    Abstract: Example implementations relate signal connector braces. For instance, in an example a signal connecter brace can include a housing having an exterior surface, and a protrusion extending from the housing to couple the housing to a via of a circuit board thereby positioning the exterior surface of the housing in contact with a corresponding exterior surface of a signal connector to brace the signal connector.
    Type: Application
    Filed: July 24, 2017
    Publication date: January 24, 2019
    Inventors: James D. Hensley, David R. Cowles, David G. Rohrer
  • Patent number: 8767725
    Abstract: Modules, modular devices, and modular systems are provided. Some examples include a backplane oriented in a first plane, a first module including a major surface oriented parallel to the first plane and a first minor surface oriented perpendicular to the first plane, wherein the major surface of the first module includes a connector thereon that releasably mates with a corresponding connector located on a first side of the backplane. Some examples include a second module including a major surface oriented perpendicular to the first plane and a first minor surface oriented parallel to the first plane, wherein the first minor surface of the second module includes a connector thereon that releasably mates with a corresponding connector located on a second side of the backplane. Circuitry within the first module can provide interconnections for the second module. The first and second modules can be fabric and interface modules, respectively.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: July 1, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Tsun-Yao Chang, David G. Rohrer
  • Patent number: 8693195
    Abstract: An apparatus includes a chassis that further includes at least one receiving buttress. The chassis defines an enclosure, and the at least one buttress protrudes a portion of a first electronic device outside the enclosure by preventing further insertion of the first electronic device into the enclosure.
    Type: Grant
    Filed: May 1, 2012
    Date of Patent: April 8, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David G. Rohrer, Glenn C. Simon
  • Publication number: 20140036451
    Abstract: A heat sink assembly includes a printed circuit board, a heat sink, and clamp, and at least two clamp retainers. The printed circuit board has at least two holes extending from a front surface to a back surface of the printed circuit board. The heat sink is mounted to the printed circuit board. The heat sink has a bottom side and a plurality of fins extending from a top side. The clamp is coupled to the printed circuit board. The clamp includes a beam extending across the heat sink and between adjacent fins, at least two legs extending through the at least two holes of the printed circuit board, and a foot extending from each of the at least two legs contacting the back surface of the printed circuit board. The at least two clamp retainers extend through the at least two holes adjacent to the at least two legs.
    Type: Application
    Filed: July 31, 2012
    Publication date: February 6, 2014
    Inventors: Glenn C. Simon, David R. Cowles, James D. Hensley, Chadi Farid Theodossy, David G. Rohrer, Teri F. Greenhoe
  • Patent number: 8614890
    Abstract: A chassis extension module includes an extension housing structure and a support structure. The extension housing structure is to be attached to a housing structure of another module. Attachment of the extension housing structure to the housing structure of the other module expands an inner volume of an assembly.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: December 24, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James D. Hensley, David G. Rohrer
  • Publication number: 20130293075
    Abstract: An apparatus includes a chassis including at least one receiving buttress. The chassis defines an enclosure, and the at least one buttress protrudes a portion electronic devices outside the enclosure by preventing further insertion of the electronic devices into the enclosure.
    Type: Application
    Filed: May 1, 2012
    Publication date: November 7, 2013
    Inventors: David G. ROHRER, Glenn C. Simon
  • Publication number: 20130284682
    Abstract: A chassis card cage includes a front panel, a backplane opposite the front panel, opposing sides extending between the front panel and the backplane, a series of module slots extending between opposing sides, each of the series of module slots configured to accommodate a card module, and a module slot divider including a first portion extending perpendicularly from the backplane and a second portion connectable to the first portion and extending from the second portion toward the front panel, wherein at least the second portion of the module slot divider has a divider height substantially equal to a height of a single module slot and is configured to divide one of the series of module slots into side-by-side module slots.
    Type: Application
    Filed: April 25, 2012
    Publication date: October 31, 2013
    Inventors: David G Rohrer, Glenn C. Simon
  • Publication number: 20130279501
    Abstract: Modules, modular devices, and modular systems are provided. Some examples include a backplane oriented in a first plane, a first module including a major surface oriented parallel to the first plane and a first minor surface oriented perpendicular to the first plane, wherein the major surface of the first module includes a connector thereon that releasably mates with a corresponding connector located on a first side of the backplane. Some examples include a second module including a major surface oriented perpendicular to the first plane and a first minor surface oriented parallel to the first plane, wherein the first minor surface of the second module includes a connector thereon that releasably mates with a corresponding connector located on a second side of the backplane. Circuitry within the first module can provide interconnections for the second module. The first and second modules can be fabric and interface modules, respectively.
    Type: Application
    Filed: April 20, 2012
    Publication date: October 24, 2013
    Inventors: Tsun-Yao Chang, David G. Rohrer
  • Publication number: 20130269997
    Abstract: A wire defining a repeating pattern is removably joined to a flange having apertures defined therein. The wire includes contact portions to make electrically-conductive contact with a device supported by a chassis. The device can be cooled by air flow through the apertures of the flange while being protected against electromagnetic interference (EMI). The wire and the flange can be respectively formed from various metals and are separable from each other for recycling or other purposes.
    Type: Application
    Filed: April 11, 2012
    Publication date: October 17, 2013
    Inventors: Glenn C. Simon, David G. Rohrer, David L. Mallery
  • Publication number: 20130074697
    Abstract: An air filter for electrical equipment includes metallic filter media including a first outer layer, an opposing second outer layer, and at least one inner layer disposed between the first outer layer and the opposing second outer layer, and a frame disposed along a perimeter edge of the filter media configured to retain the filter media.
    Type: Application
    Filed: September 28, 2011
    Publication date: March 28, 2013
    Inventors: Teri F. Verschoor, Glenn C. Simon, James D. Hensley, David G. Rohrer
  • Publication number: 20120262876
    Abstract: A chassis extension module includes an extension housing structure and a support structure. The extension housing structure is to be attached to a housing structure of another module. Attachment of the extension housing structure to the housing structure of the other module expands an inner volume of an assembly.
    Type: Application
    Filed: April 18, 2011
    Publication date: October 18, 2012
    Inventors: James D. Hensley, David G. Rohrer