Patents by Inventor David G. Rohrer
David G. Rohrer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10461450Abstract: Example implementations relate signal connector braces. For instance, in an example a signal connector brace can include a housing having an exterior surface, and a protrusion extending from the housing to couple the housing to a via of a circuit board thereby positioning the exterior surface of the housing in contact with a corresponding exterior surface of a signal connector to brace the signal connector.Type: GrantFiled: July 24, 2017Date of Patent: October 29, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: James D. Hensley, David R. Cowles, David G. Rohrer
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Patent number: 10439307Abstract: Examples herein relate to cuts in a circuit board. In some examples, a circuit board can include a signal connector located on the circuit board, and cuts extending through at least a body of the circuit board that are adjacent to the signal connector and extend from a perimeter of the circuit board to an inner portion of the circuit board, where the circuit board flexes relative to the signal connector responsive to the circuit board experiencing a force.Type: GrantFiled: July 26, 2017Date of Patent: October 8, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: James D. Hensley, David G. Rohrer, Brent A. Ford
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Publication number: 20190036248Abstract: Examples herein relate to cuts in a circuit board. In some examples, a circuit board can include a signal connector located on the circuit board, and cuts extending through at least a body of the circuit board that are adjacent to the signal connector and extend from a perimeter of the circuit board to an inner portion of the circuit board, where the circuit board flexes relative to the signal connector responsive to the circuit board experiencing a force.Type: ApplicationFiled: July 26, 2017Publication date: January 31, 2019Inventors: James D. Hensley, David G. Rohrer, Brent A. Ford
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Publication number: 20190027845Abstract: Example implementations relate signal connector braces. For instance, in an example a signal connecter brace can include a housing having an exterior surface, and a protrusion extending from the housing to couple the housing to a via of a circuit board thereby positioning the exterior surface of the housing in contact with a corresponding exterior surface of a signal connector to brace the signal connector.Type: ApplicationFiled: July 24, 2017Publication date: January 24, 2019Inventors: James D. Hensley, David R. Cowles, David G. Rohrer
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Patent number: 8767725Abstract: Modules, modular devices, and modular systems are provided. Some examples include a backplane oriented in a first plane, a first module including a major surface oriented parallel to the first plane and a first minor surface oriented perpendicular to the first plane, wherein the major surface of the first module includes a connector thereon that releasably mates with a corresponding connector located on a first side of the backplane. Some examples include a second module including a major surface oriented perpendicular to the first plane and a first minor surface oriented parallel to the first plane, wherein the first minor surface of the second module includes a connector thereon that releasably mates with a corresponding connector located on a second side of the backplane. Circuitry within the first module can provide interconnections for the second module. The first and second modules can be fabric and interface modules, respectively.Type: GrantFiled: April 20, 2012Date of Patent: July 1, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Tsun-Yao Chang, David G. Rohrer
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Patent number: 8693195Abstract: An apparatus includes a chassis that further includes at least one receiving buttress. The chassis defines an enclosure, and the at least one buttress protrudes a portion of a first electronic device outside the enclosure by preventing further insertion of the first electronic device into the enclosure.Type: GrantFiled: May 1, 2012Date of Patent: April 8, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: David G. Rohrer, Glenn C. Simon
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Publication number: 20140036451Abstract: A heat sink assembly includes a printed circuit board, a heat sink, and clamp, and at least two clamp retainers. The printed circuit board has at least two holes extending from a front surface to a back surface of the printed circuit board. The heat sink is mounted to the printed circuit board. The heat sink has a bottom side and a plurality of fins extending from a top side. The clamp is coupled to the printed circuit board. The clamp includes a beam extending across the heat sink and between adjacent fins, at least two legs extending through the at least two holes of the printed circuit board, and a foot extending from each of the at least two legs contacting the back surface of the printed circuit board. The at least two clamp retainers extend through the at least two holes adjacent to the at least two legs.Type: ApplicationFiled: July 31, 2012Publication date: February 6, 2014Inventors: Glenn C. Simon, David R. Cowles, James D. Hensley, Chadi Farid Theodossy, David G. Rohrer, Teri F. Greenhoe
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Patent number: 8614890Abstract: A chassis extension module includes an extension housing structure and a support structure. The extension housing structure is to be attached to a housing structure of another module. Attachment of the extension housing structure to the housing structure of the other module expands an inner volume of an assembly.Type: GrantFiled: April 18, 2011Date of Patent: December 24, 2013Assignee: Hewlett-Packard Development Company, L.P.Inventors: James D. Hensley, David G. Rohrer
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Publication number: 20130293075Abstract: An apparatus includes a chassis including at least one receiving buttress. The chassis defines an enclosure, and the at least one buttress protrudes a portion electronic devices outside the enclosure by preventing further insertion of the electronic devices into the enclosure.Type: ApplicationFiled: May 1, 2012Publication date: November 7, 2013Inventors: David G. ROHRER, Glenn C. Simon
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Publication number: 20130284682Abstract: A chassis card cage includes a front panel, a backplane opposite the front panel, opposing sides extending between the front panel and the backplane, a series of module slots extending between opposing sides, each of the series of module slots configured to accommodate a card module, and a module slot divider including a first portion extending perpendicularly from the backplane and a second portion connectable to the first portion and extending from the second portion toward the front panel, wherein at least the second portion of the module slot divider has a divider height substantially equal to a height of a single module slot and is configured to divide one of the series of module slots into side-by-side module slots.Type: ApplicationFiled: April 25, 2012Publication date: October 31, 2013Inventors: David G Rohrer, Glenn C. Simon
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Publication number: 20130279501Abstract: Modules, modular devices, and modular systems are provided. Some examples include a backplane oriented in a first plane, a first module including a major surface oriented parallel to the first plane and a first minor surface oriented perpendicular to the first plane, wherein the major surface of the first module includes a connector thereon that releasably mates with a corresponding connector located on a first side of the backplane. Some examples include a second module including a major surface oriented perpendicular to the first plane and a first minor surface oriented parallel to the first plane, wherein the first minor surface of the second module includes a connector thereon that releasably mates with a corresponding connector located on a second side of the backplane. Circuitry within the first module can provide interconnections for the second module. The first and second modules can be fabric and interface modules, respectively.Type: ApplicationFiled: April 20, 2012Publication date: October 24, 2013Inventors: Tsun-Yao Chang, David G. Rohrer
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Publication number: 20130269997Abstract: A wire defining a repeating pattern is removably joined to a flange having apertures defined therein. The wire includes contact portions to make electrically-conductive contact with a device supported by a chassis. The device can be cooled by air flow through the apertures of the flange while being protected against electromagnetic interference (EMI). The wire and the flange can be respectively formed from various metals and are separable from each other for recycling or other purposes.Type: ApplicationFiled: April 11, 2012Publication date: October 17, 2013Inventors: Glenn C. Simon, David G. Rohrer, David L. Mallery
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Publication number: 20130074697Abstract: An air filter for electrical equipment includes metallic filter media including a first outer layer, an opposing second outer layer, and at least one inner layer disposed between the first outer layer and the opposing second outer layer, and a frame disposed along a perimeter edge of the filter media configured to retain the filter media.Type: ApplicationFiled: September 28, 2011Publication date: March 28, 2013Inventors: Teri F. Verschoor, Glenn C. Simon, James D. Hensley, David G. Rohrer
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Publication number: 20120262876Abstract: A chassis extension module includes an extension housing structure and a support structure. The extension housing structure is to be attached to a housing structure of another module. Attachment of the extension housing structure to the housing structure of the other module expands an inner volume of an assembly.Type: ApplicationFiled: April 18, 2011Publication date: October 18, 2012Inventors: James D. Hensley, David G. Rohrer