Patents by Inventor David H. Brandwein

David H. Brandwein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for tool feedback sensing
    Patent number: 10035008
    Abstract: A microneedle application device for moving a microneedle array toward a target skin location includes a feedback sensor. The feedback sensor is operably connected to the microneedle application device, and is capable of generating an output corresponding to forces between the target skin location and the microneedle application device.
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: July 31, 2018
    Assignee: 3M Innovative Properties Company
    Inventors: David H. Brandwein, Franklyn L. Frederickson, Karl M. Kropp
  • Integrated microneedle array delivery system
    Patent number: 10010707
    Abstract: The present disclosure provides a low-profile system and methods for delivering a microneedle array. The delivery system includes a housing that may be secured to and temporarily worn on a patient's skin. A carrier assembly coupled to a microneedle array is received in the housing proximate an applicator device. The carrier assembly is at least releasably secured to the housing and it is typically not attached or otherwise fixed to any portion of the applicator device.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: July 3, 2018
    Assignee: 3M Innovative Properties Company
    Inventors: David J. Colburn, Erik J. Johnson, David H. Brandwein, Jerome E. Gysbers, Patrick J. Young, Adam S. Cantor
  • INTEGRATED MICRONEEDLE ARRAY DELIVERY SYSTEM
    Publication number: 20140257187
    Abstract: The present disclosure provides a low-profile system and methods for delivering a microneedle array. The delivery system includes a housing that may be secured to and temporarily worn on a patient's skin. A carrier assembly coupled to a microneedle array is received in the housing proximate an applicator device. The carrier assembly is at least releasably secured to the housing and it is typically not attached or otherwise fixed to any portion of the applicator device.
    Type: Application
    Filed: October 9, 2012
    Publication date: September 11, 2014
    Inventors: David J. Colburn, Erik J. Johnson, David H. Brandwein, Jerome E. Gysbers, Patrick J. Young, Adam S. Cantor
  • INTEGRATED MICRONEEDLE ARRAY DELIVERY SYSTEM
    Publication number: 20140236090
    Abstract: The present disclosure provides low-profile systems and methods for delivering a microneedle array. A delivery system includes a housing that may be secured to and temporarily worn on a patient's skin. A carrier assembly coupled to a microneedle array is received in the housing proximate a stored energy device. The stored energy device can be designed to store a predetermined amount of potential energy that is greater or substantially greater than the energy necessary to release said energy. As the stored energy device is potentially capable of releasing substantially more energy than is required to cause the release, the amount of normal force applied to the skin can be minimized while sufficient application velocity is still generated.
    Type: Application
    Filed: October 9, 2012
    Publication date: August 21, 2014
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: David J. Colburn, Erik J. Johnson, David H. Brandwein, Jerome E. Gysbers, Patrick J. Young, Adam S. Cantor
  • System and Method for Tool Feedback Sensing
    Publication number: 20080208146
    Abstract: A microneedle application device for moving a microneedle array toward a target skin location includes a feedback sensor. The feedback sensor is operably connected to the microneedle application device, and is capable of generating an output corresponding to forces between the target skin location and the microneedle application device.
    Type: Application
    Filed: April 7, 2006
    Publication date: August 28, 2008
    Inventors: David H. Brandwein, Franklyn L. Frderickson, Karl M. Kropp