Patents by Inventor David H. Narajowski
David H. Narajowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190235587Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: ApplicationFiled: April 6, 2019Publication date: August 1, 2019Inventors: Brett W. DEGNER, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
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Publication number: 20190230427Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: ApplicationFiled: September 22, 2017Publication date: July 25, 2019Inventors: Brett W. Degner, Christopher J. Stringer, Daniel R. Bloom, Michael E. Leclerc, David H. Narajowski, Kristopher P. Laurent, Daniele de Iuliis, Markus Diebel, Sung-Ho Tan
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Publication number: 20190222913Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: ApplicationFiled: March 22, 2019Publication date: July 18, 2019Inventors: Michael E. Leclerc, Brett W. Degner, David H. Narajowski, Kristopher P. Laurent, Daniel R. Bloom, Daniele de Iuliis, Christopher J. Stringer, Sung-Ho Tan, Markus Diebel
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Publication number: 20190222936Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: ApplicationFiled: March 22, 2019Publication date: July 18, 2019Inventors: Brett W. Degner, Michael E. Leclerc, David H. Narajowski, Kristopher P. Laurent, William K. Smith, Christopher J. Stringer, Daniele de Iuliis, Markus Diebel, Sung-Ho Tan
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Publication number: 20190222915Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: ApplicationFiled: March 22, 2019Publication date: July 18, 2019Inventors: Kristopher P. Laurent, David H. Narajowski, Michael E. Leclerc, Brett W. Degner, Christopher J. Stringer, Daniele de Iuliis, Markus Diebel, Sung-Ho Tan
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Patent number: 10355402Abstract: Connector inserts and connector receptacles that have a small form factor, readily mate when brought into proximity to each other, and disconnect when subjected to a non-axial force.Type: GrantFiled: September 29, 2017Date of Patent: July 16, 2019Assignee: Apple Inc.Inventors: Brett W. Degner, Bradley J. Hamel, Christopher J. Stringer, Christiaan A. Ligtenberg, David H. Narajowski, Kristopher P. Laurent, Mahmoud R. Amini, Michael E. Leclerc
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Patent number: 10254805Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: GrantFiled: April 27, 2018Date of Patent: April 9, 2019Assignee: Apple Inc.Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
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Publication number: 20190103701Abstract: Connector inserts and connector receptacles that have a small form factor, readily mate when brought into proximity to each other, and disconnect when subjected to a non-axial force.Type: ApplicationFiled: September 29, 2017Publication date: April 4, 2019Applicant: Apple Inc.Inventors: Brett W. Degner, Bradley J. Hamel, Christopher J. Stringer, Christiaan A. Ligtenberg, David H. Narajowski, Kristopher P. Laurent, Mahmoud R. Amini, Michael E. Leclerc
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Patent number: 10248171Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: GrantFiled: April 27, 2018Date of Patent: April 2, 2019Assignee: Apple Inc.Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
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Patent number: 10073499Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: GrantFiled: June 5, 2017Date of Patent: September 11, 2018Assignee: Apple Inc.Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
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Patent number: 10069392Abstract: Embodiments described herein may take the form of an electromagnetic actuator that produces a haptic output during operation. Generally, an electromagnetic coil is wrapped around a central magnet array. A shaft passes through the central magnet array, such that the central array may move along the shaft when the proper force is applied. When a current passes through the electromagnetic coil, the coil generates a magnetic field. The coil is stationary with respect to a housing of the actuator, while the central magnet array may move along the shaft within the housing. Thus, excitation of the coil exerts a force on the central magnet array, which moves in response to that force. The direction of the current through the coil determines the direction of the magnetic field and thus the motion of the central magnet array.Type: GrantFiled: June 2, 2015Date of Patent: September 4, 2018Assignee: Apple Inc.Inventors: Brett W. Degner, Bradley J. Hamel, David H. Narajowski, Jonah A. Harley, Michael E. Leclerc, Patrick Kessler, Samuel Bruce Weiss, Storrs T. Hoen
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Publication number: 20180246548Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: ApplicationFiled: April 27, 2018Publication date: August 30, 2018Inventors: Brett W. DEGNER, Caitlin Elizabeth KALINOWSKI, Richard D. KOSOGLOW, Joshua D. BANKO, David H. NARAJOWSKI, Jonathan L. BERK, Michael E. LECLERC, Michael D. MCBROOM, Asif IQBAL, Paul S. MICHELSEN, Mark K. SIN, Paul A. BAKER, Harold L. SONTAG, Wai Ching YUEN, Matthew P. CASEBOLT, Kevin S. FETTERMAN, Alexander C. CALKINS, Daniel L. MCBROOM
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Publication number: 20180246547Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: ApplicationFiled: April 27, 2018Publication date: August 30, 2018Inventors: Brett W. DEGNER, Caitlin Elizabeth KALINOWSKI, Richard D. KOSOGLOW, Joshua D. BANKO, David H. NARAJOWSKI, Jonathan L. BERK, Michael E. LECLERC, Michael D. MCBROOM, Asif IQBAL, Paul S. MICHELSEN, Mark K. SIN, Paul A. BAKER, Harold L. SONTAG, Wai Ching YUEN, Matthew P. CASEBOLT, Kevin S. FETTERMAN, Alexander C. CALKINS, Daniel L. MCBROOM
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Patent number: 9974206Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: GrantFiled: September 12, 2016Date of Patent: May 15, 2018Assignee: Apple Inc.Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
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Patent number: 9964999Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: GrantFiled: June 29, 2017Date of Patent: May 8, 2018Assignee: Apple Inc.Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
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Patent number: 9946315Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).Type: GrantFiled: June 29, 2017Date of Patent: April 17, 2018Assignee: Apple Inc.Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
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Patent number: 9913400Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.Type: GrantFiled: May 26, 2015Date of Patent: March 6, 2018Assignee: Apple Inc.Inventors: Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
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Patent number: 9905964Abstract: An accessory to device coupling system can include a first magnet array adapted for assembly with respect to a surface of an electronic device and a second magnet array adapted for assembly with respect to a surface of an accessory device, the accessory device configured to interact electrically with the electronic device. The first magnet array can include a first plurality of magnets arranged in a first pattern of alternating polarities, and the second magnet array can include a second plurality of magnets arranged in a second pattern of alternating polarities that corresponds to the first pattern of alternating polarities. The corresponding alternating polarity patterns can cause the second magnet array to couple to the first magnet array with a normalized attraction force only at an intended orientation and alignment, and with less than half of the normalized attraction force at any other orientation and alignment.Type: GrantFiled: September 2, 2016Date of Patent: February 27, 2018Assignee: Apple Inc.Inventors: Brett W. Degner, David H. Narajowski, Oliver C. Ross, Hao Zhu, Erik A. Uttermann, Stephen R. McClure, Melody L. Kuna
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Publication number: 20180013231Abstract: Magnetic connectors that may be readily manufactured and provide a high landed force and labels for magnetic connectors that may protect magnets or magnetic elements in the connectors, provide an aesthetically pleasing appearance, and improve the magnetic performance of the connectors. In various examples, power and signal paths may be formed using contacts that are separate from magnets or magnetic elements, paths may be formed using magnets or magnetic elements, or paths may be formed using a combination of contacts and magnets and magnetic elements. The magnets may have various arrangements. One or more magnets may be used in conjunction with magnetic elements. The interface surface of these magnets and magnetic elements may have various contours, such as flat, spline, or involute.Type: ApplicationFiled: July 18, 2017Publication date: January 11, 2018Applicant: Apple Inc.Inventors: John C. DiFonzo, George V. Anastas, David H. Narajowski, Bradley J. Hamel, Brett William Degner, Christiaan A. Ligtenberg
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Patent number: 9853402Abstract: An interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconnect device can be configured to electrically couple with a main logic board aligned in a second plane. In particular, the plurality of pins can be inserted into corresponding electrical contact locations within the main logic board to form a biplanar connection. The biplanar connection can be made in way that minimizes signal loss for high speed data transfers.Type: GrantFiled: May 10, 2016Date of Patent: December 26, 2017Assignee: Apple Inc.Inventors: Anton Talalayev, David H. Narajowski, Christiaan A. Ligtenberg, Mahmoud R. Amini, William F. Leggett, Mikael M. Silvanto, Christopher J. Stringer, George Tziviskos, Edward Cooper, Ron Alan Hopkinson, Ari Parsons Miller