Abstract: Methods to generate doubled haploid plants and plant components using low mammalian toxicity chromosome doubling agents are disclosed. Chromosome doubling agents provide low mortality rates and higher chromosome doubling rate in plants.

Abstract: The present disclosure is related to the field agrochemicals including 5-fluorocytosine and its derivatives and their use as fungicides.

Abstract: Processes and compositions have been discovered that are suitable for controlling a pathogen induced disease in a plant that is at risk of being diseased from a pathogen resistant to a Qo inhibitor. Such processes and compositions comprise contacting said plant(s) with a composition comprising an effective amount of a Qi inhibitor.

Abstract: This invention relates to certain novel 2-alkynyl-6-pyridin-2-yl-pyridazinones, 2-alkynyl-6-pyridin-2-yl-dihydropyridazinones, 2-alkynyl-6-pyrimidin-2-yl-pyridazinones and 2-alkynyl-6-pyrimidin-2-yl-dihydropyridazinones and to the use of these compounds for control of fungal pathogens of plants and mammals.

Abstract: This present disclosure is related to the field of 5-fluoro pyrimidines and their derivatives and to the use of these compounds as fungicides.

Abstract: Porous films are provided which include a blend of a film forming polymer and a non-film forming material, the film having a network of pores or channels throughout the film. The porous polymer films are formed between 0° and 80° C., retain porosity at elevated temperatures and are non-friable. A process for preparing porous polymer films and their applications are disclosed.

Abstract: Porous films are provided which include a blend of a film forming polymer and a non-film forming material, the film having a network of pores or channels throughout the film. The porous polymer films are formed between 0° and 80° C., retain porosity at elevated temperatures and are non-friable. A process for preparing porous polymer films and their applications are disclosed.

Abstract: Porous films are provided which include a blend of a film forming polymer and a non-film forming material, the film having a network of pores or channels throughout the film. The porous polymer films are formed between 0° and 80° C. retain porosity at elevated temperatures and are non-friable. A process for preparing porous polymer films and their applications are disclosed.

Abstract: Porous films are provided which include a blend of a film forming polymer and a non-film forming material, the film having a network of pores or channels throughout the film. The porous polymer films are formed between 0° and 80° C., retain porosity at elevated temperatures and are non-friable. A process for preparing porous polymer films and their applications are disclosed.

Abstract: Novel N-acetonylbenzamides and their use in controlling phytopathogenic fungi.

Abstract: Certain N-acetonylbenzamides exhibit low phytotoxicity and are useful for control of a wide range of fungi, including phytopathogenic fungi of the classes Oomycetes, Ascomycetes, Deuteromycetes and Basidiomycetes.

Abstract: Process comprising the use as a microbicide or plant growth regulator of a compound of the formula ##STR1## wherein A, B, C and D is each independently selected from the group consisting of O,NR.sup.1, CR.sup.1 R.sup.1, CO, S,SO, and SO.sub.2, except for the A-C, C-A, B-D,D-B combinations: O--O, SO--SO, SO.sub.2 --SO.sub.2, S--O, S--NR.sup.2, SONR.sup.2, SO--CO, SO.sub.2 --CO, SO.sub.2 --SO;each group of the groups R.sup.1 is independently selected from the group consisting of H and (C.sub.1 -C.sub.4)alkyl;Y.sup.1 and Y.sup.2 may each be independently selected from the group consisting of H, (C.sub.1 -C.sub.4)alkyl, halogen, OR,SOR,SO.sub.2 R, SO.sub.3 R, CN, CO.sub.2 R, COR, CF.sub.3, NO.sub.2, NHCOR, and OCOR; or alternatively Y.sup.1 and Y.sup.2 and the carbons to which they are attached may comprise a cyclic structure selected from the group consisting of ##STR2## where R.sup.11 is aryl or (C.sub.1 -C.sub.4)alkylX.sup.1 to X.sup.8 is each independently selected from the group consisting of H, (C.sub.1 -C.

Abstract: The present invention relates to an apparatus for the automatic assembly of electronic components and, in particular, relates to a programmable substrate transport mechanism for conveying variously sized substrates to a robotic electronic component assembly machine.

Abstract: A machine and method for subdividing into individual substrates a wafer which is prescored with a pattern of intersecting score lines defining the substrates. The wafer is progressively directed over a first wafer-engaging surface substantially paralleling one set of score lines, and this surface operates during a breaking operation to impart a localized force at a score line in the set. The wafer is halted for the breaking operation, after which the broken-off portion is directed over a second wafer-engaging surface substantially paralleling the other set of score lines. This second surface operates, during a substrate breaking operation, to apply a localized force adjacent a score line of the other set. The broken-off portion is also halted for this second breaking operation, in which an individual substrate is separated from the previously broken-off portion of the wafer. An inclined track transports the material from the first to the second breaking operation.

Abstract: A machine and method for subdividing into individual substrates a wafer which is prescored with a pattern of intersecting score lines defining the substrates. The wafer is progressively directed over a first wafer-engaging surface substantially paralleling one set of score lines, and this surface cooperates during a breaking operation to impart a localized force at a score line in the set. The wafer is halted during the breaking operation, after which the broken-off portion is directed over a second wafer-engaging surface substantially paralleling the other set of score lines. This second surface cooperates, during a substrate breaking operation, to apply a localized force adjacent a score line of the other set. The broken-off portion is halted during this latter breaking operation at which a substrate is separated from the broken-off portion of the wafer.