Abstract: In some aspects, the disclosure is directed to methods and systems for virtual angle-of-arrival (AoA) or angle-of-departure (AoD) tracking for virtually tracking multiple Targets. The wireless devices (e.g. Tracker and Targets) may participate in a mesh configuration and share data within the mesh. A first device may purport to be a virtual tracker, while acting as an AoA or Angle of Departure (AoD) Target. The devices being tracked (e.g. virtual targets), may instead operate as Trackers. Processor- and energy-intensive calculations may be distributed to the virtual targets and transmitted via the mesh for aggregation at the virtual tracker.

Abstract: In some aspects, the disclosure is directed to methods and systems for virtual angle-of-arrival (AoA) or angle-of-departure (AoD) tracking for virtually tracking multiple Targets. The wireless devices (e.g. Tracker and Targets) may participate in a mesh configuration and share data within the mesh. A first device may purport to be a virtual tracker, while acting as an AoA or Angle of Departure (AoD) Target. The devices being tracked (e.g. virtual targets), may instead operate as Trackers. Processor- and energy-intensive calculations may be distributed to the virtual targets and transmitted via the mesh for aggregation at the virtual tracker.

Abstract: A method and system detect directionality between two objects by measuring angles of signals incident on antenna arrays on at least one side to determine angle of incidence. The methods utilize Bluetooth Low Energy communications for both the control protocol and for providing updated information for deriving directionality. Directionality information is broadcast on selected BLE advertising or data channels, or broadcast using a hopping pattern over the BLE data channels, both at a specific interval duty cycle. If a hopping pattern is selected to transmit directionality information, then anchor information is simultaneously broadcast on the BLE advertising or data channels at a different, asynchronous duty cycle. In additional embodiments, signals incident on antenna arrays located on both target and tracking sides are used to determine angle of incidence, separate antennas are combined to form new antennas and antenna models are used to anticipate known antenna structure responses.

Abstract: A method and system detect directionality between two objects by measuring angles of signals incident on antenna arrays on at least one side to determine angle of incidence. The methods utilize Bluetooth Low Energy communications as the means for both the control protocol and for providing updated information for deriving directionality. Directionality information is broadcast on selected BLE advertising or data channels, or broadcast using a hopping pattern over the BLE data channels, both at a specific interval duty cycle. If a hopping pattern is selected to transmit directionality information, then anchor information is simultaneously broadcast on the BLE advertising or data channels at a different, asynchronous duty cycle. In additional embodiments, signals incident on antenna arrays located on both target and tracking sides are used to determine angle of incidence, separate antennas are combined to form new antennas and antenna models are used to anticipate known antenna structure responses.

Abstract: A method of making redistributed electronic devices that includes providing a wafer having a plurality of electronic devices, each electronic device having a pattern of contact areas forming die pads. The method also includes forming redistribution layers on a temporary substrate having a pattern of contact areas forming wafer bonding pads matching the die pads and a pattern of contact areas forming redistributed pads different than the wafer bonding pads, the wafer bonding pads are coupled to the redistributed pads through a plurality of stacked conductive and insulating layers. The die pads are coupled to the wafer bonding pads, and the temporary substrate is removed. The wafer and redistribution layers are then divided into a plurality of redistributed electronic devices.

Abstract: A method of making an electronic device with a redistribution layer includes providing an electronic device having a first pattern of contact areas, and forming a redistribution layer on a temporary substrate. The temporary substrate has a second pattern of contact areas matching the first pattern of contact areas, and a third pattern of contact areas different than the second pattern of contact areas. The second pattern of contact areas is coupled to the third pattern of contact areas through a plurality of stacked conductive and insulating layers. The first pattern of contact areas is coupled to the second pattern of contact areas on the transferrable redistribution layer. The temporary substrate is then removed to thereby form a redistributed electronic device.

Abstract: A method of making redistributed electronic devices that includes providing a wafer having a plurality of electronic devices, each electronic device having a pattern of contact areas forming die pads. The method also includes forming redistribution layers on a temporary substrate having a pattern of contact areas forming wafer bonding pads matching the die pads and a pattern of contact areas forming redistributed pads different than the wafer bonding pads, the wafer bonding pads are coupled to the redistributed pads through a plurality of stacked conductive and insulating layers. The die pads are coupled to the wafer bonding pads, and the temporary substrate is removed. The wafer and redistribution layers are then divided into a plurality of redistributed electronic devices.

Abstract: A method of making an electronic device with a redistribution layer includes providing an electronic device having a first pattern of contact areas, and forming a redistribution layer on a temporary substrate. The temporary substrate has a second pattern of contact areas matching the first pattern of contact areas, and a third pattern of contact areas different than the second pattern of contact areas. The second pattern of contact areas is coupled to the third pattern of contact areas through a plurality of stacked conductive and insulating layers. The first pattern of contact areas is coupled to the second pattern of contact areas on the transferrable redistribution layer. The temporary substrate is then removed to thereby form a redistributed electronic device.

Abstract: An additive delivery laminate, suitable for cooking a food product and transferring a colorant, flavorant, and/or odorant to a food product, has an additive delivery layer comprising a thermoplastic layer and water-soluble granules containing a food additive. The laminate further comprises a substrate layer to which the additive delivery layer is bonded. The additive delivery layer is placed in contact with the food product to be packaged, with the granules thereafter dissolving and the additive being transferred to the food product. The additive can be transferred during cook-in or otherwise. Also disclosed is a process for preparing the additive delivery laminate and a process for preparing a packaged food product.

Abstract: A method of processing a wafer includes establishing a fine of symmetry defining left and right die areas on a front side of the wafer and left and right die areas on a back side. A first mask is used to form a first interconnection layer on the left and right die areas comprising a first portion on the left die area and second portion different than the first portion on the right die area. A second mask is used to form a second interconnection layer on the left and right die areas comprising a third portion on the left die area and fourth portion different than the third portion on the right die area. The first mask is reused to form a third interconnection layer on the left and right die areas on a back side, and the second mask to form a fourth interconnection layer on the left and right die areas on a back side.

Abstract: A method of processing a wafer includes establishing a fine of symmetry defining left and right die areas on a front side of the wafer and left and right die areas on a back side. A first mask is used to form a first interconnection layer on the left and right die areas comprising a first portion on the left die area and second portion different than the first portion on the right die area. A second mask is used to form a second interconnection layer on the left and right die areas comprising a third portion on the left die area and fourth portion different than the third portion on the right die area. The first mask is reused to form a third interconnection layer on the left and right die areas on a back side, and the second mask to form a fourth interconnection layer on the left and right die areas on a back side.

Abstract: A method of making a multi-chip module may include forming an interconnect layer stack on a sacrificial substrate. The interconnect layer stack may include patterned electrical conductor layers and a dielectric layer between adjacent patterned electrical conductor layers. The method may further include electrically coupling a first integrated circuit (IC) die in a flip chip arrangement to an uppermost patterned electrical conductor layer, and forming a first underfill dielectric layer between the first IC die and adjacent portions of the interconnect layer stack. The method further may include removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at a second integrated circuit die in a flip chip arrangement to the lowermost patterned electrical conductor layer. Still further, the method may include forming a second underfill dielectric layer between the second IC die and adjacent portions of the interconnect layer stack.

Abstract: The invention features methods of treating a subject having a lung disorder such as lung inflammation and injury, by administering antithrombin III by inhalation.

Abstract: Mobile terminals include a portable housing and a wireless communication network interface circuit in the housing. A memory is coupled to the housing and a user interface is in the housing. A data interface in the housing is configured to be operatively coupled to a game module and a controller in the housing is configured to couple the memory and/or the user interface of the mobile terminal to the game module through the data interface to supplement resources of the game module using the memory and/or the user interface. Methods and computer program products are also provided.

Abstract: An additive delivery laminate, suitable for cooking a food product and transferring a colorant, flavorant, and/or odorant to a food product, has an additive delivery layer comprising a thermoplastic layer and additive granules containing a food additive. The laminate further comprises a substrate layer to which the additive delivery layer is bonded. The additive delivery layer is placed in contact with the food product to be packaged, with the granules thereafter dissolving and the additive being transferred to the food product. The additive can be transferred during cook-in or otherwise. Also disclosed is a process for preparing the additive delivery laminate and a process for preparing a packaged food product.

Abstract: An additive delivery laminate, suitable for cooking a food product and transferring a colorant, flavorant, and/or odorant to a food product, has an additive delivery layer comprising a thermoplastic layer and water-soluble granules containing a food additive. The laminate further comprises a substrate layer to which the additive delivery layer is bonded. The additive delivery layer is placed in contact with the food product to be packaged, with the granules thereafter dissolving and the additive being transferred to the food product. The additive can be transferred during cook-in or otherwise. Also disclosed is a process for preparing the additive delivery laminate and a process for preparing a packaged food product.

Abstract: An additive delivery laminate is suitable for packaging a food product which is cooked in the package, with an additive transferring from the laminate to the food product. The additive delivery laminate has a substrate and an additive delivery layer. The additive delivery layer contains a water-insoluble thermoplastic polymer, a polymer toughening agent, and additive granules containing a colorant, flavorant, and/or odorant. The polymer toughening agent is present in a blend with the water-insoluble thermoplastic polymer. Polyisobutylene is a preferred water-insoluble thermoplastic polymer, and hydrogenated wood rosin is a preferred polymer toughening agent. The polymer toughening agent decreases the tendency of the water-insoluble thermoplastic polymer to form legs or transfer to the food product upon stripping the laminate from the food product after cooking and transfer to the additive to the food product.