Abstract: Methods, systems, and apparatus are provided for manufacturing a flash module. In some implementations, the method includes mounting at least one LED module on a top portion of a first substrate for providing light. A lens portion is mounted on a second substrate in a first region of the second substrate. The lens portion illuminates the light from the at least one LED module and the second substrate comprises the first region having a first diameter and a second region for providing a path for the illuminating light having a second diameter. The first diameter is greater than the second diameter. The second substrate is mounted on the first substrate. A substance is applied to a top portion of the second substrate from an end of the first diameter to the end of the second diameter and to a side portion of the second substrate in the second region.

Abstract: Methods, systems, and apparatus are provided for manufacturing a flash module. In some implementations, the method includes mounting at least one LED module on a top portion of a first substrate for providing light. A lens portion is mounted on a second substrate in a first region of the second substrate. The lens portion illuminates the light from the at least one LED module and the second substrate comprises the first region having a first diameter and a second region for providing a path for the illuminating light having a second diameter. The first diameter is greater than the second diameter. The second substrate is mounted on the first substrate. A substance is applied to a top portion of the second substrate from an end of the first diameter to the end of the second diameter and to a side portion of the second substrate in the second region.

Abstract: Methods, systems, and apparatus are provided for manufacturing a flash module. In some implementations, the method includes mounting at least one LED module on a top portion of a first substrate for providing light. A lens portion is mounted on a second substrate in a first region of the second substrate. The lens portion illuminates the light from the at least one LED module and the second substrate comprises the first region having a first diameter and a second region for providing a path for the illuminating light having a second diameter. The first diameter is greater than the second diameter. The second substrate is mounted on the first substrate. A substance is applied to a top portion of the second substrate from an end of the first diameter to the end of the second diameter and to a side portion of the second substrate in the second region.

Abstract: Methods, systems, and apparatus are provided for manufacturing a flash module. In some implementations, the method includes mounting at least one LED module on a top portion of a first substrate for providing light. A lens portion is mounted on a second substrate in a first region of the second substrate. The lens portion illuminates the light from the at least one LED module and the second substrate comprises the first region having a first diameter and a second region for providing a path for the illuminating light having a second diameter. The first diameter is greater than the second diameter. The second substrate is mounted on the first substrate. A substance is applied to a top portion of the second substrate from an end of the first diameter to the end of the second diameter and to a side portion of the second substrate in the second region.

Abstract: A docking mechanism is described. The docking mechanism may include a locking protrusion and a locking receptacle configured to receive the locking protrusion and having an inclined surface. The docking mechanism may include a wedging member abutting the inclined surface. The docking mechanism may include a locking detent. The locking detent may have a spring configured to bias the locking detent towards the locking protrusion. Computing devices that include docking mechanisms are also described. Methods of use of the docking mechanisms are also described.

Abstract: The presently disclosed technology includes a composite unibody keyboard that both serves as a bottom case and a top bezel in traditional keyboard design. The unibody keyboard is made of a high-rigidity composite material with varying thicknesses to achieve predetermined design specifications for the keyboard. Areas of the unibody keyboard frame are removed to accommodate various electronic or other components of the keyboard prior to final assembly.

Abstract: A docking mechanism is described. The docking mechanism may include a locking protrusion and a locking receptacle configured to receive the locking protrusion and having an inclined surface. The docking mechanism may include a wedging member abutting the inclined surface. The docking mechanism may include a locking detent. The locking detent may have a spring configured to bias the locking detent towards the locking protrusion. Computing devices that include docking mechanisms are also described. Methods of use of the docking mechanisms are also described.

Abstract: A docking mechanism is described. The docking mechanism may include a locking protrusion and a locking receptacle configured to receive the locking protrusion and having an inclined surface. The docking mechanism may include a wedging member abutting the inclined surface. The docking mechanism may include a locking detent. The locking detent may have a spring configured to bias the locking detent towards the locking protrusion. Computing devices that include docking mechanisms are also described. Methods of use of the docking mechanisms are also described.

Abstract: A docking mechanism is described. The docking mechanism may include a locking protrusion and a locking receptacle configured to receive the locking protrusion and having an inclined surface. The docking mechanism may include a wedging member abutting the inclined surface. The docking mechanism may include a locking detent. The locking detent may have a spring configured to bias the locking detent towards the locking protrusion. Computing devices that include docking mechanisms are also described. Methods of use of the docking mechanisms are also described.

Abstract: Cosmetically hidden electrostatic discharge (ESD) protection structures and systems are disclosed herein. In one example, an electronic device is provided. The electronic device includes an integrated circuit and an ESD protection structure positioned at least partially around a perimeter of the integrated circuit, where the ESD protection structure is configured to protect the integrated circuit from an electrostatic discharge strike. The electronic device further includes a concealing layer positioned on a surface of the ESD protection structure, the concealing layer configured to at least partially conceal the ESD protection structure from view.

Abstract: A method of covering a device includes splitting a sheet of non-woven material between a cosmetic surface of the non-woven material and a non-cosmetic surface of the non-woven material. This produces two sheets—a cosmetic sheet of the non-woven material including the cosmetic surface and a first split surface opposite the cosmetic surface, and a non-cosmetic sheet of the non-woven material including the non-cosmetic surface and a second split surface opposite the non-cosmetic surface. The method further includes applying an at least partially transparent coating to the non-cosmetic surface of the non-cosmetic sheet. The first split surface of the cosmetic sheet is affixed to a first portion of the device, and the second split surface of the non-cosmetic sheet is affixed to a second portion of the device.

Abstract: The presently disclosed technology includes a composite unibody keyboard that both serves as a bottom case and a top bezel in traditional keyboard design. The unibody keyboard is made of a high-rigidity composite material with varying thicknesses to achieve predetermined design specifications for the keyboard. Areas of the unibody keyboard frame are removed to accommodate various electronic or other components of the keyboard prior to final assembly.

Abstract: A method of covering a device includes splitting a sheet of non-woven material between a cosmetic surface of the non-woven material and a non-cosmetic surface of the non-woven material. This produces two sheets—a cosmetic sheet of the non-woven material including the cosmetic surface and a first split surface opposite the cosmetic surface, and a non-cosmetic sheet of the non-woven material including the non-cosmetic surface and a second split surface opposite the non-cosmetic surface. The method further includes applying an at least partially transparent coating to the non-cosmetic surface of the non-cosmetic sheet. The first split surface of the cosmetic sheet is affixed to a first portion of the device, and the second split surface of the non-cosmetic sheet is affixed to a second portion of the device.

Abstract: Cosmetically hidden electrostatic discharge (ESD) protection structures and systems are disclosed herein. In one example, an electronic device is provided. The electronic device includes an integrated circuit and an ESD protection structure positioned at least partially around a perimeter of the integrated circuit, where the ESD protection structure is configured to protect the integrated circuit from an electrostatic discharge strike. The electronic device further includes a concealing layer positioned on a surface of the ESD protection structure, the concealing layer configured to at least partially conceal the ESD protection structure from view.