Abstract: A method may include receiving an indication of an available updated container. The method may also involve identifying one or more compute surfaces comprising a first container and a second container that correspond to the available container, such that the first container may control one or more operations of an operational technology (OT) device. The method may also include scheduling a deployment of the updated container to replace the second container, receiving expected output data associated with a digital model associated with the OT device, and scheduling a switchover of control of the one or more operations to the second container based on the expected output data.

Abstract: A method of providing a collision avoiding travel path for an autonomous vehicle. A sensor system obtains stereo image data of a scene in the environment ahead of the normal travel path. This image data is used to generate a disparity image. The disparity image is processed to generate an occupancy map that assigns values to areas of the scene based on levels of visual clutter. The occupancy map is then converted to a potential field, which assigns each pixel in the scene with a force value that corresponds to its proximity to one or more obstacles. These force value are summed and used to modify the vehicle's path is a collision is likely.

Abstract: Disclosed are energy conditioner structures, method of making and using them wherein the structure comprises a sequence of conductive layers including a first A layer, a G layer, and a first B layer; wherein said first A layer, said G layer, and said first B layer are each conductive, and are conductively isolated from one another in said energy conditioner structure; wherein said first A layer includes a first A layer main body and a first A layer tab, said first B layer includes a first B layer main body and a first B layer tab, and said G layer includes a G layer main body and a G layer first tab; wherein said G layer is in a plane between a plane containing said first A layer and a plane containing said first B layer; where the main body of at least one of said first A layer and said first B layer opposes a portion of said G layer main body; wherein two of said first A layer tab, said first B layer tab, and said G layer first tab are on a first side of said energy conditioner, and the remaining one of sai

Abstract: Disclosed are energy conditioner structures, method of making and using them wherein the structure comprises a sequence of conductive layers including a first A layer, a G layer, and a first B layer; wherein said first A layer, said G layer, and said first B layer are each conductive, and are conductively isolated from one another in said energy conditioner structure; wherein said first A layer includes a first A layer main body and a first A layer tab, said first B layer includes a first B layer main body and a first B layer tab, and said G layer includes a G layer main body and a G layer first tab; wherein said G layer is in a plane between a plane containing said first A layer and a plane containing said first B layer; where the main body of at least one of said first A layer and said first B layer opposes a portion of said G layer main body; wherein two of said first A layer tab, said first B layer tab, and said G layer first tab are on a first side of said energy conditioner, and the remaining one of sai

Abstract: The present invention is a component carrier consisting of a plate of insulating material having a plurality of apertures for accepting the leads of a thru-hole differential and common mode filter. Another embodiment consists of a surface mount component carrier comprised of a disk of insulating material having a plurality of apertures. The same concept for the above described carrier is also incorporated into several alternate embodiments, either independently, embedded within electronic connectors. The overall configuration and electrical characteristics of the concepts underlying the present inventions are also described as an energy conditioning circuit assembly which encompasses the combination of differential and common mode filters and component carriers optimized for such filters.