Abstract: An equipment management system including a controller and a server. The controller communicatively couples to one or more remote systems. At least one of the remote systems includes a heating, ventilation, and air conditioning (HVAC) system, a refrigeration system, or a building automation system. The controller receives telemetry data associated with the operation of the one or more remote systems and with individual components of the one or more remote systems. The controller communicates at least a portion of the received telemetry data to the server. The server determines one or more operational commands for the one or more remote systems. The one or more operational commands are determined based on the telemetry data communicated from the controller to the server. The server communicates the one or more operational commands to the controller. The controller communicates the one or more operational commands to the one or more remote systems.

Abstract: An equipment management system including a controller and a server. The controller communicatively couples to one or more remote systems. At least one of the remote systems includes a heating, ventilation, and air conditioning (HVAC) system, a refrigeration system, or a building automation system. The controller receives telemetry data associated with the operation of the one or more remote systems and with individual components of the one or more remote systems. The controller communicates at least a portion of the received telemetry data to the server. The server determines one or more operational commands for the one or more remote systems. The one or more operational commands are determined based on the telemetry data communicated from the controller to the server. The server communicates the one or more operational commands to the controller. The controller communicates the one or more operational commands to the one or more remote systems.

Abstract: The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires are preferably non-identical, for example, being of different gauges and/or material composition. According to a preferred embodiment of the invention, dual capillary bond head apparatus includes a rotatable ultrasonic horn with a pair of capillaries for selectably dispensing separate strands of bond wire and for forming bonds on bond targets. According to another aspect of the invention, a method is provided for dual capillary IC wirebonding including steps for using two dual capillary bond heads for contemporaneously attaching non-identical bond wires to selected bond targets on one or more IC package assemblies.

Abstract: A computerized system and method for customizing bond programs in order to compensate first for variabilities in an integrated circuit (IC) “slave” bonder, and second to any irregularities in a “slave” circuit positioned on the slave bonder for attaching connecting bonds onto the IC bond pads. According to the invention, a “master” segmentator groups the bond pads of a “master” circuit on a master bonder into segments and stores the reference data related to these segments in a master file. Next, a slave regenerator, coupled to the master file, regenerates the master reference data so that variable characteristics of the slave bonder are defined and adaptively compensated. Finally, a slave corrector, coupled to the salve regenerator, corrects the bond program for the slave circuit on the adaptively compensated slave bonder. The slave bonder attaches the connecting bonds based on the computed correct bond locations.

Abstract: A computerized system and method for reducing bond program errors in a slave bonder, prepared to attach connecting bonds onto bond pads of a slave integrated circuit, by first collecting, on a master bonder, input data concerning bond x-y locations, alignment reference x-y locations, and alignment reference images from a master integrated circuit, then analyzing these data to construct a network of relationships between reference images and bond locations, and store data and relationships in a master file. Secondly, on a slave bonder, all this information is automatically retrieved and compared by a computer with input data concerning alignment reference images from a slave circuit. Thirdly, any discrepancy found is corrected by a computer to identify the new bond locations on the slave circuit. Finally, the slave bonder attaches the connecting bonds based on the computed correct bond locations.

Abstract: A computerized system and method for recreating illumination conditions in a slave bonder, prepared to attach connecting bonds onto bond pads of a slave integrated circuit. First, images of illuminated alignment references of a master circuit on a master bonder are defined; these data are analyzed to construct relationships between reference images and bond locations; data and relationships are stored in a master file. Secondly, on a slave bonder, the master reference image data are regenerated so that the illumination conditions of the slave bonder, as based on images, are recreated. Thirdly, images of the slave circuit references are produced under the newly created illumination conditions, and the alignment references are compensated. Finally, the bonding locations of the slave circuit and the bonding program of the slave bonder are corrected so that connecting bonds can be attached onto the recomputed correct bond locations.

Abstract: A computerized system and method for recreating illumination conditions in a slave bonder, prepared to attach connecting bonds onto bond pads of a slave integrated circuit. First, images of illuminated alignment references of a master circuit on a master bonder are defined; these data are analyzed to construct relationships between reference images and bond locations; data and relationships are stored in a master file. Secondly, on a slave bonder, the master reference image data are regenerated so that the illumination conditions of the slave bonder, as based on images, are recreated. Thirdly, images of the slave circuit references are produced under the newly created illumination conditions, and the alignment references are compensated. Finally, the bonding locations of the slave circuit and the bonding program of the slave bonder are corrected so that connecting bonds can be attached onto the recomputed correct bond locations.

Abstract: A computerized system and method for customizing bond programs in order to compensate first for variabilities in an integrated circuit (IC) “slave” bonder, and second to any irregularities in a “slave” circuit positioned on the slave bonder for attaching connecting bonds onto the IC bond pads. According to the invention, a “master” segmentator groups the bond pads of a “master” circuit on a master bonder into segments and stores the reference data related to these segments in a master file. Next, a slave regenerator, coupled to the master file, regenerates the master reference data so that variable characteristics of the slave bonder are defined and adaptively compensated. Finally, a slave corrector, coupled to the salve regenerator, corrects the bond program for the slave circuit on the adaptively compensated slave bonder. The slave bonder attaches the connecting bonds based on the computed correct bond locations.

Abstract: A computerized system and method for reducing bond program errors in a slave bonder, prepared to attach connecting bonds onto bond pads of a slave integrated circuit, by first collecting, on a master bonder, input data concerning bond x-y locations, alignment reference x-y locations, and alignment reference images from a master integrated circuit, then analyzing these data to construct a network of relationships between reference images and bond locations, and store data and relationships in a master file. Secondly, on a slave bonder, all this information is automatically retrieved and compared by a computer with input data concerning alignment reference images from a slave circuit. Thirdly, any discrepancy found is corrected by a computer to identify the new bond locations on the slave circuit. Finally, the slave bonder attaches the connecting bonds based on the computed correct bond locations.