Abstract: An electrified vehicle includes a front axle, a rear axle, an engine, a pump, a battery, a first electric motor electrically coupled to the battery, a second electric motor electrically coupled to the battery and configured to drive at least one of the front axle or the rear axle, a first clutch positioned between the engine and the first electric motor, and a second clutch positioned between the first electric motor and the pump. With the first clutch engaged and the second clutch disengaged, the engine is configured to drive the first electric motor to generate electricity to charge the battery. With the first clutch disengaged and the second clutch engaged, the first electric motor is configured to drive the pump. With the first clutch engaged and the second clutch engaged, the engine is configured to drive the pump.

Abstract: A controlled extraction of an electronic connector from an electronic circuit board includes a press mechanism of a device positioned in spaced relation over a base fixture of the device. The base fixture receiving an electronic circuit board which includes a connector. Shafts of a removal tool of the press mechanism can be inserted into a series of openings in the connector, respectively, in response to applying a downward force to the press mechanism. A capturing element on each of the shafts can be actuated where the capturing element couples to a wall defining the opening of each of the openings. The connector can be removed from the electronic circuit board by applying an upward force to the press mechanism which removes the connector with the capturing element of the shafts coupled to the wall of the opening, and releasing the press mechanism from the base fixture.

Abstract: Provided herein is a system for automated dispensing and packaging of articles. Systems may include: a controller configured to receive an indication of an order to be packaged, where the order includes one or more articles; a packaging station; a web of bags, where the web of bags is fed to the packaging station; a pneumatic table configurable to support a bag disposed at the packaging station; an opening mechanism including a pneumatic nozzle to open the bag disposed at the packaging station; a loading bin configured to be inserted into the open bag and deposit the one or more articles; and a closure apparatus to seal the bag disposed at the packaging station after receiving the one or more articles.

Abstract: A method for forming an electronic device that includes solder bonding pins from a component to plated through holes of a board, the component being positioned on a first side of the board; and applying solder paste to openings of the plated through holes on a second side of the board opposite the first side of the board that the component is positioned on. The method can further include drawing the solder paste to the pins to provide a reworked solder bond bonding at least one of the pins to the plated through hole.

Abstract: A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjacent to an aperture of the multilayer circuit board. The modified voltage-to-ground clearance of conductive material is based on a configuration of a connector pin to be press-fit connected within the aperture of the multilayer circuit board, and the internal clearance region is enlarged in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.

Abstract: Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.

Abstract: A press-fit insertion method is provided. The press-fit insertion method includes loading press-fit pins into a connector, heating a printed circuit board (PCB) defining plated through holes (PTHs) into which the press-fit pins are insertable and pressing the connector onto the PCB to insert the press-fit pins into the PTHs with the PCB remaining heated.

Abstract: An apparatus for thermal interface material detection includes a heatsink stack up with a heatsink, a thermal interface material, a heat generating component, and a printed circuit board. The heatsink is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heatsink is configured for insertion of a compression probe, where a first end of the channel leads to a lower surface of the body of the heatsink and a second end of the channels leads to an upper surface of the body of the heatsink.

Abstract: An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.

Abstract: A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.

Abstract: Aspects of the invention include a press-fit pin for mechanically and electrically connecting to a through-hole of a substrate. The press-fit pin can include a press-fit portion configured to be deformed upon insertion into the through-hole against a plated surface of the through-hole. A surface mount technology (SMT) pad can be coupled to a first end of the press-fit portion. The SMT pad can include a conductive material. The press-fit pin can further include a trace extension coupled to the SMT pad. The trace extension can extend from the SMT pad in a direction perpendicular to the press-fit portion. The press-fit pin can include a tip portion coupled to a second end of the press-fit portion.

Abstract: A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.

Abstract: A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.

Abstract: An apparatus for thermal interface material detection includes a heatsink stack up with a heatsink, a thermal interface material, a heat generating component, and a printed circuit board. The heatsink is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heatsink is configured for insertion of a compression probe, where a first end of the channel leads to a lower surface of the body of the heatsink and a second end of the channels leads to an upper surface of the body of the heatsink.

Abstract: Described is an anti-vibration fixture comprising a radiolucent enclosure and a vibration-dampening material attached to an inside face of the radiolucent enclosure. The vibration-dampening material is configured to receive a component for nondestructive testing by computed tomography (CT) scanning. The anti-vibration fixture further comprises a plurality of fasteners attached to opposing faces of the radiolucent enclosure.

Abstract: Described is an anti-vibration fixture comprising a radiolucent enclosure and a vibration-dampening material attached to an inside face of the radiolucent enclosure. The vibration-dampening material is configured to receive a component for nondestructive testing by computed tomography (CT) scanning. The anti-vibration fixture further comprises a plurality of fasteners attached to opposing faces of the radiolucent enclosure.

Abstract: Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.

Abstract: Aspects of the invention include a press-fit pin for mechanically and electrically connecting to a through-hole of a substrate. The press-fit pin can include a press-fit portion configured to be deformed upon insertion into the through-hole against a plated surface of the through-hole. A surface mount technology (SMT) pad can be coupled to a first end of the press-fit portion. The SMT pad can include a conductive material. The press-fit pin can further include a trace extension coupled to the SMT pad. The trace extension can extend from the SMT pad in a direction perpendicular to the press-fit portion. The press-fit pin can include a tip portion coupled to a second end of the press-fit portion.

Abstract: Provided is a system for removing an electronic component from a printed circuit board (PCB). The system may comprise a heating well configured to hold a rework liquid. The system may further comprise a head system configured to create a liquid-tight seal around an electronic component. The system may further comprise a nozzle and a mechanical capture device disposed within the head system. The mechanical capture device may be configured to attach to the electronic component. The system may further comprise a controller. The controller may be configured to release the rework liquid through the nozzle and onto the electronic component and lift the electronic component off the PCB.

Abstract: A press-fit insertion method is provided. The press-fit insertion method includes loading press-fit pins into a connector, heating a printed circuit board (PCB) defining plated through holes (PTHs) into which the press-fit pins are insertable and pressing the connector onto the PCB to insert the press-fit pins into the PTHs with the PCB remaining heated.