Patents by Inventor David J. Fryklund
David J. Fryklund has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8222085Abstract: Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first polymer layer, selectively removing the first polymer layer to provide at least one opening to expose a portion of the die, and depositing a first metal layer over the first polymer layer, the first metal layer at least partially filling the at least one opening to provide an electrical contact to the die, and including a portion that substantially surrounds the die in a plane of an upper surface of the first metal layer to provide an electromagnetic shield around the die.Type: GrantFiled: July 25, 2011Date of Patent: July 17, 2012Assignee: Skyworks Solutions, Inc.Inventors: David J Fryklund, Alfred H Carl, Brian P Murphy
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Patent number: 8105879Abstract: Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first polymer layer, selectively removing the first polymer layer to provide at least one opening to expose a portion of the die, and depositing a first metal layer over the first polymer layer, the first metal layer at least partially filling the at least one opening to provide an electrical contact to the die, and including a portion that substantially surrounds the die in a plane of an upper surface of the first metal layer to provide an electromagnetic shield around the die.Type: GrantFiled: September 22, 2010Date of Patent: January 31, 2012Assignee: Skyworks Solutions, Inc.Inventors: David J Fryklund, Alfred H Carl, Brian P Murphy
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Publication number: 20110281400Abstract: Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first polymer layer, selectively removing the first polymer layer to provide at least one opening to expose a portion of the die, and depositing a first metal layer over the first polymer layer, the first metal layer at least partially filling the at least one opening to provide an electrical contact to the die, and including a portion that substantially surrounds the die in a plane of an upper surface of the first metal layer to provide an electromagnetic shield around the die.Type: ApplicationFiled: July 25, 2011Publication date: November 17, 2011Applicant: SKYWORKS SOLUTIONS, INC.Inventors: David J. Fryklund, Alfred H. Carl, Brian P. Murphy
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Patent number: 8022557Abstract: Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first polymer layer, selectively removing the first polymer layer to provide at least one opening to expose a portion of the die, and depositing a first metal layer over the first polymer layer, the first metal layer at least partially filling the at least one opening to provide an electrical contact to the die, and including a portion that substantially surrounds the die in a plane of an upper surface of the first metal layer to provide an electromagnetic shield around the die.Type: GrantFiled: August 31, 2010Date of Patent: September 20, 2011Assignee: Skyworks Solutions, Inc.Inventors: David J Fryklund, Alfred H Carl, Brian P Murphy
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Publication number: 20110008934Abstract: Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first polymer layer, selectively removing the first polymer layer to provide at least one opening to expose a portion of the die, and depositing a first metal layer over the first polymer layer, the first metal layer at least partially filling the at least one opening to provide an electrical contact to the die, and including a portion that substantially surrounds the die in a plane of an upper surface of the first metal layer to provide an electromagnetic shield around the die.Type: ApplicationFiled: September 22, 2010Publication date: January 13, 2011Applicant: SKYWORKS SOLUTIONS, INC.Inventors: David J. Fryklund, Alfred H. Carl, Brian P. Murphy
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Publication number: 20100327438Abstract: Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first polymer layer, selectively removing the first polymer layer to provide at least one opening to expose a portion of the die, and depositing a first metal layer over the first polymer layer, the first metal layer at least partially filling the at least one opening to provide an electrical contact to the die, and including a portion that substantially surrounds the die in a plane of an upper surface of the first metal layer to provide an electromagnetic shield around the die.Type: ApplicationFiled: August 31, 2010Publication date: December 30, 2010Applicant: SKYWORKS SOLUTIONS, INC.Inventors: David J. Fryklund, Alfred H. Carl, Brian P. Murphy
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Patent number: 7824965Abstract: Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first polymer layer, selectively removing the first polymer layer to provide at least one opening to expose a portion of the die, and depositing a first metal layer over the first polymer layer, the first metal layer at least partially filling the at least one opening to provide an electrical contact to the die, and including a portion that substantially surrounds the die in a plane of an upper surface of the first metal layer to provide an electromagnetic shield around the die.Type: GrantFiled: October 25, 2007Date of Patent: November 2, 2010Assignee: Skyworks Solutions, Inc.Inventors: David J. Fryklund, Alfred H. Carl, Brian P. Murphy
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Publication number: 20090039530Abstract: Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first polymer layer, selectively removing the first polymer layer to provide at least one opening to expose a portion of the die, and depositing a first metal layer over the first polymer layer, the first metal layer at least partially filling the at least one opening to provide an electrical contact to the die, and including a portion that substantially surrounds the die in a plane of an upper surface of the first metal layer to provide an electromagnetic shield around the die.Type: ApplicationFiled: October 25, 2007Publication date: February 12, 2009Inventors: David J. Fryklund, Alfred H. Carl, Brian P. Murphy