Abstract: A method of preparing a computer processor die includes determining a warpage shape of the computer processor die at a testing temperature. The method also includes selectively contouring a thickness of the computer processor die at a contouring temperature by physically removing material from a surface of the computer processor die such that the surface will be substantially flat at the testing temperature.

Abstract: Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.

Abstract: Aspects of the invention include a non-destructive bond line thickness measurement of thermal interface material on silicon packages. A non-limiting example computer-implemented method includes receiving a chip mounted on a laminate and depositing a high-density material on the chip. The computer-implemented method deposits a thermal interface material on the chip and lids the chip, and the laminate with a lid. The computer-implemented method X-rays the lid, the chip, and the laminate to produce an X-ray and measures, using a processor, from the X-ray a bond line thickness of the TIM as a distance from a bottom of the lid to a top surface of the high-density material.

Abstract: Apparatuses and methods of fabrication are provided which include a coolant-cooled heat sink through which coolant passes to facilitate cooling the coolant-cooled heat sink, and an ultra-violet (UV) light assembly associated with the coolant-cooled heat sink for directing UV light towards an interior surface of the coolant-cooled heat sink across which the coolant passes. The UV light inhibits bacterial growth at the interior surface of the coolant-cooled heat sink.

Abstract: An electronic apparatus that includes a semiconductor device; an electronic packaging substrate for receiving the semiconductor device; a thermal interface material on the semiconductor device; and a lid in contact with the thermal interface material and having a zone of targeted flexibility spaced from the semiconductor device.

Abstract: Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.

Abstract: A method of preparing a computer processor die includes determining a warpage shape of the computer processor die at a testing temperature. The method also includes selectively contouring a thickness of the computer processor die at a contouring temperature by physically removing material from a surface of the computer processor die such that the surface will be substantially flat at the testing temperature.

Abstract: Coolant-cooled heat sinks and methods of fabrication are provided with a coolant-carrying compartment between a cover and a heat transfer base. The heat transfer base includes a heat transfer surface to couple to a component to be cooled, and a plurality of thermally-conductive fins extending into the coolant-carrying compartment from a surface of the heat transfer base opposite to the heat transfer surface. One or more grooves are provided in an interface surface of the cover and fins, and wicking element(s) are positioned within, at least in part, the groove(s). A joining material is provided between the cover and fins to join the plurality of thermally-conductive fins to the cover. The wicking element(s) within, at least in part, the groove(s) facilitate retaining the joining material over the plurality of thermally-conductive fins during joining of the cover and fins.

Abstract: An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.

Abstract: An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.

Abstract: An electronic apparatus that includes a semiconductor device; an electronic packaging substrate for receiving the semiconductor device; a thermal interface material on the semiconductor device; and a lid in contact with the thermal interface material and having a zone of targeted flexibility spaced from the semiconductor device.

Abstract: Coolant-cooled heat sinks and methods of fabrication are provided with a coolant-carrying compartment between a cover and a heat transfer base. The heat transfer base includes a heat transfer surface to couple to a component to be cooled, and a plurality of thermally-conductive fins extending into the coolant-carrying compartment from a surface of the heat transfer base opposite to the heat transfer surface. One or more grooves are provided in an interface surface of the cover and fins, and wicking element(s) are positioned within, at least in part, the groove(s). A joining material is provided between the cover and fins to join the plurality of thermally-conductive fins to the cover. The wicking element(s) within, at least in part, the groove(s) facilitate retaining the joining material over the plurality of thermally-conductive fins during joining of the cover and fins.

Abstract: Aspects of the invention include a non-destructive bond line thickness measurement of thermal interface material on silicon packages. A non-limiting example computer-implemented method includes receiving a chip mounted on a laminate and depositing a high-density material on the chip. The computer-implemented method deposits a thermal interface material on the chip and lids the chip, and the laminate with a lid. The computer-implemented method X-rays the lid, the chip, and the laminate to produce an X-ray and measures, using a processor, from the X-ray a bond line thickness of the TIM as a distance from a bottom of the lid to a top surface of the high-density material.

Abstract: Methods of producing coolant-cooled heat sinks with a coolant-carrying compartment between a cover and a heat transfer base are provided. The heat transfer base includes a heat transfer surface to couple to a component to be cooled, and a plurality of thermally-conductive fins extending into the coolant-carrying compartment from a surface of the heat transfer base opposite to the heat transfer surface. The method includes positioning a screen with openings over the plurality of thermally-conductive fins, between the plurality of thermally-conductive fins and the cover, and providing a joining material over the screen, between the screen and the cover. The method also includes joining the plurality of thermally-conductive fins to the cover across the screen using the joining material, where the screen facilitates retaining the joining material over the plurality of thermally-conductive fins during the joining.

Abstract: A technique relates to forming a chip assembly. Top and bottom chip stack elements containing solder pads and a solder material are provided. Soluble standoffs are applied to the bottom chip stack element. The chip stack elements are aligned to bring the top solder pad in proximity to the bottom solder pad and the temperature is raised to a temperature above the melting temperature of the solder material to form a connected chip assembly. The connected chip assembly is cooled to re-solidify the solder material and soluble standoffs are removed from the connected chip assembly.

Abstract: A technique relates to forming a chip assembly. Top and bottom chip stack elements containing solder pads and a solder material are provided. Soluble standoffs are applied to the bottom chip stack element. The chip stack elements are aligned to bring the top solder pad in proximity to the bottom solder pad and the temperature is raised to a temperature above the melting temperature of the solder material to form a connected chip assembly. The connected chip assembly is cooled to re-solidify the solder material and soluble standoffs are removed from the connected chip assembly.