Patents by Inventor David J. Quirke

David J. Quirke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stable center wavelength performance in non-rectilinearly shaped optical integrated circuit chip
    Patent number: 7447394
    Abstract: An optical device with a non-rectilinearly shaped optical integrated circuit over a substantially flat portion of a riser, the riser also equipped with a relief structure that is in thermal contact with a stabilizing brace that is in turn connected to two portions of the non-rectilinearly shaped optical integrated circuit. The non-rectilinearly shaped optical integrated circuit exhibits reduced center wavelength drift.
    Type: Grant
    Filed: May 24, 2007
    Date of Patent: November 4, 2008
    Assignee: Neophotonics Corporation
    Inventors: Calvin Ho, Brian McGinnis, Wilson Long, Ed Fontecha, David J. Quirke, Thomas S. Tarter, Sam Seto, Liang Zhao
  • Wet injecting fine abrasives for water jet curved cutting of very brittle materials
    Patent number: 6676485
    Abstract: The present invention relates to methods and systems for isolating non-rectangular shaped optical integrated circuits formed on a brittle substrate. For example, a brittle substrate comprising a plurality of non-rectangular shaped optical integrated circuits is provided on a water jet cutting system. In the cutting head of the water jet cutting system, a mixture of water and abrasive particles is wet injected into a supply of a high pressure water stream. The non-rectangular shaped optical integrated circuits are isolated by water jet cutting in a curvilinear manner without fatally damaging adjacent optical integrated circuits.
    Type: Grant
    Filed: June 20, 2001
    Date of Patent: January 13, 2004
    Assignee: Lightwave Microsystems Corporation
    Inventors: David J. Quirke, Robert Cole
  • Polymeric chemical injection into a water jet to improve cut quality while cutting very brittle materials
    Patent number: 6676486
    Abstract: The present invention relates to methods and systems for isolating non-rectangular shaped optical integrated circuits formed on a brittle substrate. For example, a brittle substrate comprising a plurality of non-rectangular shaped optical integrated circuits is provided on a water jet cutting system. In the water jet cutting system a mixture of water and at least one water soluble polymer is wet injected into a water stream and then a high pressure polymer water jet is used to cut the brittle substrate. The non-rectangular shaped optical integrated circuits are isolated by water jet cutting in a curvilinear manner without fatally damaging adjacent optical integrated circuits.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: January 13, 2004
    Assignee: Lightwave Microsystems Corporation
    Inventor: David J. Quirke