Patents by Inventor David J. Seagle

David J. Seagle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8804287
    Abstract: Structures and methods for fabrication servo and data heads of tape modules are provided. The servo head may have two shield layers spaced apart by a plurality of gap layers and a sensor. Similarly, the data head may have two shield layers spaced apart by a plurality of gap layers and a sensor. The distance between the shield layers of the servo head may be greater than the distance between the shield layers of the data head. The material of the gap layers may include tantalum or an alloy of nickel and chromium. The material for the gap layers permits deposition of gap layers with sufficiently small surface roughness to prevent distortion of the tape module and increase the stability of the tape module operation.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: August 12, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Satoru Araki, Diane L. Brown, Hiroaki Chihaya, Dustin W. Erickson, David J. Seagle
  • Patent number: 8797694
    Abstract: A magnetic read sensor having a hard bias structure that extends beyond the back edge of the sensor stack by a controlled, distance that is chosen to maximize both hard bias field and hard bias magnetic coercivity and anisotropy. The hard bias structure has a back edge that is well defined and that has a square corner at its innermost end adjacent to the sensor stack. The magnetic sensor can be constructed by a process that includes a separate making an milling process that is dedicated to defining the back edge of the hard bias structure.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: August 5, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Quang Le, David J. Seagle, Guangli Liu, Yongchul Ahn, Simon H. Liao
  • Publication number: 20140175048
    Abstract: A method of manufacturing a magnetic sensor having a hard bias structure located at a back edge of the sensor. The method forms an electrical lapping guide that is compatible for use with such a sensor having a back edge hard bias structure and which can accurately determine a termination point for a lapping operation that forms an air bearing surface of the slider and determines the sensor stripe height.
    Type: Application
    Filed: December 21, 2012
    Publication date: June 26, 2014
    Applicant: HGST NETHERLANDS B.V.
    Inventors: David P. Druist, Quang Le, Yang Li, David J. Seagle, Petrus A. Van Der Heijden
  • Patent number: 8749926
    Abstract: A magnetic scissor type magnetic read head having magnetic side shielding for reduced effective track width and having side biasing for improved stability. The read head includes first and magnetic side shields that each include first and second magnetic layers and an anti-parallel exchange coupling layer sandwiched there-between. The magnetic layers of the side shields are anti-parallel coupled with one another such that one of the magnetic layers has its magnetization oriented in a first direction parallel with the air bearing surface and the second magnetic layer has its magnetization oriented in a second direction that is opposite to the first direction and also parallel with the air bearing surface. These magnetizations of the first and second magnetic layers provide a bias field that stabilizes the magnetization of the free magnetic layers of the sensor stack to prevent flipping of the magnetizations of these layers.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: June 10, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Quang Le, Simon H. Liao, Guangli Liu, Stefan Maat, Xiaozhong Dang, David J. Seagle, Petrus A. Van Der Heijden
  • Publication number: 20140154953
    Abstract: Embodiments described herein generally relate to connecting electronic lapping guides (ELGs) to a lapping controller to prevent the effects of current crowding while reducing connections to the ELGs in single pad lapping. Devices and systems can include a row of sliders including a magnetoresistive (MR) element, a plurality of high resistance ELGs connected to both the wafer and to at least one bonding pad and at least two peripheral grounding vias connected to the wafer. Methods and systems include a wafer comprising a plurality of sliders wherein each slider is connected to a lapping controller and the delivery of current to the ELGs is sequential to groups of sliders such that only one group of ELGs is being measured at any time.
    Type: Application
    Filed: November 30, 2012
    Publication date: June 5, 2014
    Applicant: HGST NETHERLANDS B.V.
    Inventors: David P. DRUIST, Glenn P. GEE, Edward H. LEE, David J. SEAGLE, Darrick T. SMITH
  • Publication number: 20140154951
    Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller such that the number of wire bonds from the controller to a row of read heads is minimized. When lapping the air bearing surface of the read heads, the electrical resistances of the ELGs are monitored to adjust the lapping process and set the stripe height for read sensors in the read heads. Once the resistance corresponds to the desired stripe height, the lapping process is stopped. To measure the resistance, each ELG may be electrically coupled to the same substrate—i.e., share the same common ground. The lapping controller applies a voltage potential across the ELGs using a wire bonded to a pad in the respective read head and one or more connections to the grounded substrate. This configuration avoids having to bond two wires onto each read head.
    Type: Application
    Filed: November 30, 2012
    Publication date: June 5, 2014
    Applicant: HGST NETHERLANDS B.V.
    Inventors: Glen P. Gee, Edward H.P. Lee, David J. Seagle, Darrick T. Smith
  • Publication number: 20140153138
    Abstract: A magnetic scissor type magnetic read head having magnetic side shielding for reduced effective track width and having side biasing for improved stability. The read head includes first and magnetic side shields that each include first and second magnetic layers and an anti-parallel exchange coupling layer sandwiched there-between. The magnetic layers of the side shields are anti-parallel coupled with one another such that one of the magnetic layers has its magnetization oriented in a first direction parallel with the air bearing surface and the second magnetic layer has its magnetization oriented in a second direction that is opposite to the first direction and also parallel with the air bearing surface. These magnetizations of the first and second magnetic layers provide a bias field that stabilizes the magnetization of the free magnetic layers of the sensor stack to prevent flipping of the magnetizations of these layers.
    Type: Application
    Filed: November 30, 2012
    Publication date: June 5, 2014
    Applicant: HGST Netherlands B.V.
    Inventors: Quang Le, Simon H. Liao, Guangli Liu, Stefan Maat, Xiaozhong Dang, David J. Seagle, Petrus A. Van Der Heijden
  • Publication number: 20140154952
    Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 ?m, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.
    Type: Application
    Filed: November 30, 2012
    Publication date: June 5, 2014
    Applicant: HGST NETHERLANDS B.V.
    Inventors: David P. DRUIST, Glenn P. GEE, Unal M. GURUZ, Edward H. LEE, David J. SEAGLE, Darrick T. SMITH
  • Patent number: 8531800
    Abstract: In one embodiment, a magnetic head includes a write pole; a write coil adapted for causing the write pole to emit a magnetic field upon excitation of the write coil; and a first capacitor and a second capacitor electrically connected in parallel with the write coil, each capacitor including a planar bottom plate, a top plate positioned parallel to the bottom plate, and at least one dielectric layer positioned between the top plate and the bottom plate, wherein a parasitic capacitance between the bottom plate of each capacitor and a substrate positioned below the bottom plate exists during writing operations of the magnetic head, and wherein the parasitic capacitances of the capacitors are about balanced.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: September 10, 2013
    Assignee: HGST Netherlands B.V.
    Inventors: John T. Contreras, David J. Seagle
  • Publication number: 20130163121
    Abstract: A magnetic read sensor having a hard bias structure that extends beyond the back edge of the sensor stack by a controlled, distance that is chosen to maximize both hard bias field and hard bias magnetic coercivity and anisotropy. The hard bias structure has a back edge that is well defined and that has a square corner at its innermost end adjacent to the sensor stack. The magnetic sensor can be constructed by a process that includes a separate making an milling process that is dedicated to defining the back edge of the hard bias structure.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 27, 2013
    Applicant: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Quang Le, David J. Seagle, Guangli Liu, Yongchul Ahn, Simon H. Liao
  • Patent number: 8472146
    Abstract: A perpendicular magnetic read head having a balanced capacitive coupling with the substrate. The read head includes a magnetoresistive sensor with first and second magnetic, electrically conductive shields separated from a substrate by a layer of non-magnetic, electrically insulating material. A dummy magnetic shield is formed on the non-magnetic electrically insulating layer and is electrically connected with the second magnetic, electrically conductive shield. The dummy shield is formed to have a capacitive coupling with the substrate that matches the capacitive coupling of the first magnetic, electrically conductive shield with the substrate.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: June 25, 2013
    Assignee: HGST Netherlands B.V.
    Inventors: Diane L. Brown, David J. Seagle
  • Publication number: 20130083430
    Abstract: Techniques of the present invention include detecting a touchdown between a read/write head of a disk drive and a surface of a magnetic disk using multiple touchdown sensors located at an air-bearing surface (ABS). The multiple sensors increase the likelihood that a touchdown event—i.e., a portion of the ABS of the head contacting the underlying magnetic disk surface—will be detected. During touchdown, the portion of the head contacting the magnetic disk generates frictional heat which changes a characteristic (e.g., the electrical resistance) of at least one of the sensors located at the ABS. When the sensors are connected to a detection circuit, the changing characteristic may be monitored to identify a touchdown event. The touchdown sensors may be, for example, electrically connected in either series or parallel to the detection circuit. Thus, as long as the electrical resistance of one of the sensors is changed, a touchdown event may be detected.
    Type: Application
    Filed: September 30, 2011
    Publication date: April 4, 2013
    Inventors: Andrew Chiu, Sujit Kirpekar, Katalin Pentek, Oscar J. Ruiz, David J. Seagle
  • Patent number: 8333898
    Abstract: A method for manufacturing a magnetic tape head having a data sensor and a servo sensor. The data sensor and servo sensor are each separated from first and second magnetic shields by a non-magnetic gap layer, and the gap thickness for the servo sensor is larger than the gap thickness for the data sensor. The method involves depositing a first gap layer over shield structures, then depositing a second gap layer using a liftoff process to remove the second gap layer over the data sensor region. A plurality of sensor layers are then deposited, and a stripe height defining mask structure is formed over the data and servo sensor regions, the mask having a back edge that is configured to define a stripe height of the data and servo sensors. An ion milling is then performed to define the stripe height and to remove gap material from the field.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: December 18, 2012
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Diane L. Brown, Quang Le, Chang-Man Park, David J. Seagle, Eileen Yan
  • Patent number: 8335053
    Abstract: In one general embodiment, a magnetic head includes a touch-down pad, comprising at least one shielding element positioned between a leading edge of a main magnetic pole and a trailing edge of a lower return pole; an embedded contact sensor (ECS) in an electrically isolating layer, the ECS positioned near an ABS side of the magnetic head and between the leading edge of the main magnetic pole and the trailing edge of the lower return pole; and a first thermal fly-height control (TFC) element positioned away from the ABS side of the magnetic head. Additional systems and methods are also presented.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: December 18, 2012
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Yingjian Chen, David J. Seagle, Samuel W. Yuan
  • Publication number: 20120152891
    Abstract: A method for manufacturing a magnetic tape head having a data sensor and a servo sensor. The data sensor and servo sensor are each separated from first and second magnetic shields by a non-magnetic gap layer, and the gap thickness for the servo sensor is larger than the gap thickness for the data sensor. The method involves depositing a first gap layer over shield structures, then depositing a second gap layer using a liftoff process to remove the second gap layer over the data sensor region. A plurality of sensor layers are then deposited, and a stripe height defining mask structure is formed over the data and servo sensor regions, the mask having a back edge that is configured to define a stripe height of the data and servo sensors. An ion milling is then performed to define the stripe height and to remove gap material from the field.
    Type: Application
    Filed: December 20, 2010
    Publication date: June 21, 2012
    Applicant: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Diane L. Brown, Quang Le, Chang-Man Park, David J. Seagle, Eileen Yan
  • Publication number: 20120105999
    Abstract: In one general embodiment, a magnetic head includes a touch-down pad, comprising at least one shielding element positioned between a leading edge of a main magnetic pole and a trailing edge of a lower return pole; an embedded contact sensor (ECS) in an electrically isolating layer, the ECS positioned near an ABS side of the magnetic head and between the leading edge of the main magnetic pole and the trailing edge of the lower return pole; and a first thermal fly-height control (TFC) element positioned away from the ABS side of the magnetic head. Additional systems and methods are also presented.
    Type: Application
    Filed: October 28, 2010
    Publication date: May 3, 2012
    Applicant: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Yingjian Chen, David J. Seagle, Samuel W. Yuan
  • Patent number: 8169754
    Abstract: A disk drive head slider for a magnetic disk drive is provided. The head slider includes a tunnel magnetic resistance device for reading data on a magnetic disk and a dedicated noncorrosive smear detector for measuring resistance wherein the resistance corresponds to a level of smear associated with the head slider.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: May 1, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands, B.V.
    Inventors: David P. Druist, David J. Seagle, Jila Tabib
  • Publication number: 20120050919
    Abstract: A perpendicular magnetic read head having a balanced capacitive coupling with the substrate. The read head includes a magnetoresistive sensor with first and second magnetic, electrically conductive shields separated from a substrate by a layer of non-magnetic, electrically insulating material. A dummy magnetic shield is formed on the non-magnetic electrically insulating layer and is electrically connected with the second magnetic, electrically conductive shield. The dummy shield is formed to have a capacitive coupling with the substrate that matches the capacitive coupling of the first magnetic, electrically conductive shield with the substrate.
    Type: Application
    Filed: August 27, 2010
    Publication date: March 1, 2012
    Applicant: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Diane L. Brown, David J. Seagle
  • Publication number: 20110261487
    Abstract: Structures and methods for fabrication servo and data heads of tape modules are provided. The servo head may have two shield layers spaced apart by a plurality of gap layers and a sensor. Similarly, the data head may have two shield layers spaced apart by a plurality of gap layers and a sensor. The distance between the shield layers of the servo head may be greater than the distance between the shield layers of the data head. The material of the gap layers may include tantalum or an alloy of nickel and chromium. The material for the gap layers permits deposition of gap layers with sufficiently small surface roughness to prevent distortion of the tape module and increase the stability of the tape module operation.
    Type: Application
    Filed: October 29, 2010
    Publication date: October 27, 2011
    Inventors: SATORU ARAKI, Diane L. Brown, Hiroaki Chihaya, Dustin W. Erickson, David J. Seagle
  • Patent number: 7999566
    Abstract: A wafer comprises a kerf region and a test chip. The kerf is a region in a wafer designated to be destroyed by chip dicing. The test chip is located within the kerf region and is configured to provide parametric data for a wafer fabrication process of a head. The test chip comprises a shield portion of a first shield layer electrically coupled to an element, a first pad within a second shield layer electrically coupled to the element, and a second pad within the second shield layer electrically coupled to the shield portion.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: August 16, 2011
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Robert S. Beach, Arley C. Marley, David J. Seagle