Abstract: Apparatus for removing and replacing dual in-line solid state circuit chip devices and/or receptacles or sockets from printed wiring or circuit (PC) boards comprising means for positioning a printed wiring board adjacent to a source of radiant energy capable of soldering and desoldering said devices, means for automatically, cyclically extracting a device from said board and replacing said device with another similar device, means forceably removing the excess solder residue retained by the board when the device is extracted, means for automatically timing both the device extraction and insertion and the soldering and desoldering operation, and means preventing device extraction should the desoldering operation fail to release the device from the PC board.

Abstract: The present invention relates to semi-automatic apparatus for aligning and inserting a solid state electrical circuit chip or solid state chip receiving socket assembly into a printed circuit board or panel and automatically clinching a portion of the leads thereof so as to retain the chip and/or socket against accidental dislodgement from the circuit board prior to dip or wave soldering of the board.