Abstract: The invention relates to an apparatus for storing electronic devices. In one embodiment, the apparatus comprises a base member attachable to an enclosure and a carrier rotatably coupled to the base member. The base member includes a pivotal member. The carrier includes a mounting mechanism coupled to the pivotal member to facilitate the rotational movement of the carrier with respect to the base member. The carrier is also adapted to attach to at least one peripheral device.

Abstract: The present invention discloses methods and apparatus for installing printed circuit boards within an electronic assembly. One embodiment is a riser card bracket assembly for an electronic system. The riser card bracket comprises an adjustable card retainer disposed within the riser card bracket assembly; the retainer is capable of movement within the riser card bracket assembly to secure cards of various lengths. Another embodiment of the invention is a method for installing cards within a computer housing having a motherboard. The method comprises providing a riser card bracket assembly having an adjustable card retainer. At least one card is inserted within the riser card bracket assembly. The riser card bracket assembly is inserted within the computer housing whereby the at least one card is positioned parallel to the motherboard.

Abstract: An apparatus is disclosed for storing electronic devices. The apparatus includes an enclosure, a carrier adapted to contain a peripheral device, and a rotatable attachment between the carrier and the enclosure. The carrier may be rotated from an installed position to an open position. When in the installed position, a long axis of the carrier is substantially parallel to a front of the enclosure. When in the open position, the long axis of the carrier is substantially perpendicular to the front of the enclosure.

Abstract: The present invention discloses improved cooling designs and methods for the cooling of heat sources. One embodiment of the present invention is a cooling system comprising a housing and at least one divider disposed within the housing. The at least one divider creates a plurality of airflow channels through the housing. Another embodiment of the invention is a method for dissipating heat from heat sources within an electrical assembly comprising at least partially separating the heat sources with a divider. Separate airflow channels are created whereby the separated heat sources are disposed within the separated airflow channels. Forced airflow streams are generated through the separated airflow channels, thereby dissipating heat from the heat sources into the forced airflow streams.

Abstract: An electronic system may include a mounting structure that allows a switch to be firmly attached to the electronic system. The switch may have one or more snap lock mechanisms attached to a body of the switch. The mounting structure may have an opening sized to allow the switch and the snap lock mechanisms to be inserted into the mounting structure. The mounting structure may include an undercut portion in a wall of the mounting structure. The mounting panel may also include a channel configured to accept a width of the snap lock mechanism. The undercut portion of the wall may be located in a channel wall. When the switch is inserted into the mounting structure, the snap lock mechanism may engage the undercut portion of the mounting structure to securely hold the switch to the mounting structure.

Abstract: A module consists of a shroud or enclosure attached to a card containing heat-emitting electronic components or to a stack of two or more vertically spaced cards; one or all of which have heat sinks in thermal contact with at least some of the electronic components. The shroud is apertured to control air flow in many directions over the components and heatsinks. A hinge member extends along one edge of the module shaped to be inserted in a slot in a panel to establish a hinge. As the shroud is pivoted about the hinge, horizontal electrical contacts on the panel and at least one card interengage and vertical contacts on one of the cards remote from the hinge simultaneously interengage. The contour of the shroud aids in installing or removing the module.

Abstract: A heat transmitting slug is attached to a chip or other heat emitting electronic component by an adhesive. A heat sink is mounted on the slug by one or more screws or other fasteners, preferably with thermal grease between the bottom of the heat sink base and the top of the slug. The top of the slug is formed with a longitudinal tongue and the base of the heat sink with a mating groove. Preferably the base of the heat sink is offset upwardly above the groove to resist tendency to fracture under stress.

Abstract: A heatsink is pressure compliantly mounted against a substrate-mounted packaged electronic device such that the heatsink is not readily dislodged from the device package. A layer of pressure-compliant elastomeric foam material is sandwiched between the upper surface of the heatsink and an overlying shroud, which biases the heatsink downward toward the packaged device, which may be a BGA-packaged device. The lower heatsink surface is attached to the upper device package surface with double-sided thermal tape, and the shroud is attached to the substrate and compressively but compliantly urges each heatsink into more intimate thermal contact with an underlying device. The pressure-compliant material compensates for dimensional vertical tolerances associated with the substrate-mounted devices and heatsinks, while dampening vibrations and minimizing stress and torque that could otherwise damage the devices and/or the integrity of their electrical connections to the substrate.