Abstract: A drape for an input control console of an elongate device may comprise a main drape section configured to fit over the input control console via a main opening at one end of the main drape section. The drape may also comprise a plurality of pockets. Each of the plurality of pockets may include a pocket opening that is attached to a respective secondary opening in the main drape section. Each of the plurality of pockets may be configured to be anchored, at the pocket opening, to a side surface of a respective raised ring or bezel on the input control console using a respective tightening element.

Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Abstract: Roughly described, a submount has a standoff structure protruding from its surface. An optical component is pressed against the standoff structure until tilt and planar non-uniformities are removed, and then bonded to the submount using an adhesive placed in the wells between the protrusions of the standoff structure. The standoff structure preferably has a total surface area contacting the optical component which is much smaller than the area by which the optical components overlap the submount. The optical component mounted in this manner can be an optical array component (including an optical fiber array), or a component having only a single optical port. A second optical component can be attached to the submount in the same manner, greatly simplifying the vertical alignment problems between the two components.

Abstract: The present invention is directed to systems and methods for transferring storage data and network data using the same interface circuit. Storage data is transferred from an upper layer storage driver to a lower layer storage driver. Network data is transferred from a network driver to the lower layer storage drive. The storage data and the network data are transferred to a communications link interface circuit, wherein the storage data is transferred using a storage protocol and the network data is transferred using a network protocol.

Abstract: Roughly described, a submount has a standoff structure protruding from its surface. An optical component is pressed against the standoff structure until tilt and planar non-uniformities are removed, and then bonded to the submount using an adhesive placed in the wells between the protrusions of the standoff structure. The standoff structure preferably has a total surface area contacting the optical component which is much smaller than the area by which the optical components overlap the submount. The optical component mounted in this manner can be an optical array component (including an optical fiber array), or a component having only a single optical port. A second optical component can be attached to the submount in the same manner, greatly simplifying the vertical alignment problems between the two components.

Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Abstract: An integrated optical microstructure includes a substrate carrying an optical waveguide and supporting a medium disposed to receive optical energy from the waveguide. The medium includes an optical re-radiator such as a phosphor, which re-radiates optical energy in response to optical energy received from the waveguide. The structure further includes a reflector disposed to redirect some of the input optical energy emanating from the medium back into the medium, to achieve spatial confinement of the input light delivered by the input waveguide. The structure can thereby increase the efficiency of the light conversion processes of re-radiating materials. An aperture in the reflector permits optical energy emitted by the re-radiator to emerge from the structure and to propagate in a preferred direction, such as toward a viewer or sensor.

Abstract: An integrated optical microstructure includes a substrate carrying an optical waveguide and supporting a medium disposed to receive optical energy from the waveguide. The medium includes an optical re-radiator such as a phosphor, which reradiates optical energy in response to optical energy received from the waveguide. The structure further includes a reflector disposed to redirect some of the input optical energy emanating from the medium back into the medium, to achieve spatial confinement of the input light delivered by the input waveguide. The structure can thereby increase the efficiency of the light conversion processes of re-radiating materials. An aperture in the reflector permits optical energy emitted by the re-radiator to emerge from the structure and to propagate in a preferred direction, such as toward a viewer or sensor.

Abstract: A laser bar structure is mounted on a submount which includes first and second side surfaces. The first side surface has an electrically-conducting elongated mesa adjacent to the rear surface defining a placement space for a laser bar. A conducting foil connects the laser bar to the mesa. A plurality of such submounts are stacked such that the rise of the mesas provide room for the lasers and the connections to them. Each submount has a through conduit which align when stacked to form a coolant manifold. The rear surface of the stack is mounted on a microchannel cooler. A single array or a plurality of arrays are assembled electrically in series between heat conducting end blocks with fittings for connection to a coolant supply.

Abstract: A mounting module for a laser diode array has a microchannel heat sink assembly and a circulation means for flowing a cooling fluid to and from the microchannel heat sink so as to dissipate heat. The microchannel heat sink has a plurality of internal microchannels, and has an external planar surface to affix laser diode submounts which facilitate attachment of laser emitting bars. The circulation mans comprises a housing having canals which circulate the cooling fluid. The housing has an external surface to which an electrical distribution means is placed, the distribution means providing electrical power to the laser diode array.