Patents by Inventor David Keating
David Keating has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240127367Abstract: A crop prediction system performs various machine learning operations to predict crop production and to identify a set of farming operations that, if performed, optimize crop production. The crop prediction system uses crop prediction models trained using various machine learning operations based on geographic and agronomic information. Responsive to receiving a request from a grower, the crop prediction system can access information representation of a portion of land corresponding to the request, such as the location of the land and corresponding weather conditions and soil composition. The crop prediction system applies one or more crop prediction models to the access information to predict a crop production and identify an optimized set of farming operations for the grower to perform.Type: ApplicationFiled: August 25, 2023Publication date: April 18, 2024Inventors: David Patrick Perry, Geoffrey Albert von Maltzahn, Robert Berendes, Eric Michael Jeck, Barry Loyd Knight, Rachel Ariel Raymond, Ponsi Trivisvavet, Justin Y H Wong, Neal Hitesh Rajdev, Marc-Cedric Joseph Meunier, Casey James Leist, Pranav Ram Tadi, Andrea Lee Flaherty, Charles David Brummitt, Naveen Neil Sinha, Jordan Lambert, Jonathan Hennek, Carlos Becco, Mark Allen, Daniel Bachner, Fernando Derossi, Ewan Lamont, Rob Lowenthal, Dan Creagh, Steve Abramson, Ben Allen, Jyoti Shankar, Chris Moscardini, Jeremy Crane, David Weisman, Gerard Keating, Lauren Moores, William Pate
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Patent number: 11944327Abstract: A system has an outer catheter and an inner aspirating clot retrieval catheter having an expansile distal tip for flow restriction, improved aspiration efficiency, and a large mouth into which a clot or other obstructions can be retrieved. The clot retrieval catheter can have a support tube proximal of the tip. The expansile tip can be a strut framework, and a flexible, low-modulus cover is disposed around at least a portion of the tip strut framework and the proximal support tube. The distal end of the tip can be encapsulated by a low-friction elastomeric lip for atraumatic contact with the walls of a blood vessel. The tip has a collapsed delivery configuration and expands radially into a deployed configuration. The tip strut framework, support tube, and cover can all have characteristics which enhance the deliverability of the clot retrieval catheter to the target.Type: GrantFiled: March 5, 2020Date of Patent: April 2, 2024Assignee: NEURAVI LIMITEDInventors: David Vale, Ronald Kelly, Brendan Casey, Karl Keating
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Publication number: 20240100298Abstract: A clot retrieval catheter may have a tailored, highly flexible body section capable of navigating tortuous routes and an expandable tip for local flow restriction/arrest. The catheter may contain one or more spines extending the length of the elongate shaft which may be interwoven with the shaft braid. The distal portion of the spine may be formed into a spine hoop as part of the distal hoops of the tip section. Alternatively, the spine may form a loop around the shaft braid. Spines can be made from metal, polymer, or fiber strands. Polymer spines can be formed using a lamination or coextrusion manufacturing method. The support tube can also have a polymer jacket or membrane disposed around at least a portion of the structure.Type: ApplicationFiled: September 26, 2022Publication date: March 28, 2024Applicant: Neuravi LimitedInventors: Karl KEATING, David VALE
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Patent number: 8268675Abstract: Methods of protecting a surface of a copper layer or a copper bonding pad on a semiconductor device against oxidation. A surface of the layer or bonding pad is cleaned by removing an oxidation layer with a plasma. A polymer layer is formed on the cleaned surface of the layer using a plasma-enhanced deposition process to protect the cleaned surface of the layer against exposure to an oxidizing gas.Type: GrantFiled: February 11, 2011Date of Patent: September 18, 2012Assignee: Nordson CorporationInventors: David Keating Foote, James Donald Getty
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Publication number: 20120208321Abstract: Methods of protecting a surface of a copper layer or a copper bonding pad on a semiconductor device against oxidation. A surface of the layer or bonding pad is cleaned by removing an oxidation layer with a plasma. A polymer layer is formed on the cleaned surface of the layer using a plasma-enhanced deposition process to protect the cleaned surface of the layer against exposure to an oxidizing gas.Type: ApplicationFiled: February 11, 2011Publication date: August 16, 2012Applicant: NORDSON CORPORATIONInventors: David Keating Foote, James Donald Getty
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Patent number: 7980694Abstract: An apparatus and a method for obtaining, in vivo, a measurement of retinal response to an optical stimuli. Light sources provide optical stimuli to the retina in accordance with predetermined stimulation sequences, and images of the retina are obtained and correlated with the predetermined stimulation sequences so as to determine responses of the retina to the optical stimuli. In one particular embodiment, optical stimuli are provided according to m-sequences and correlated with corresponding optical coherence tomography images to determine a functional response of the retina.Type: GrantFiled: June 19, 2007Date of Patent: July 19, 2011Assignee: Greater Glasgow Health BoardInventors: David Keating, Stuart Parks
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Publication number: 20090128776Abstract: An apparatus and a method for obtaining, in vivo, a measurement of retinal response to an optical stimuli. Light sources provide optical stimuli to the retina in accordance with predetermined stimulation sequences, and images of the retina are obtained and correlated with the predetermined stimulation sequences so as to determine responses of the retina to the optical stimuli. In one particular embodiment, optical stimuli are provided according to m-sequences and correlated with corresponding optical coherence tomography images to determine a functional response of the retina.Type: ApplicationFiled: June 19, 2007Publication date: May 21, 2009Applicant: Greater Glasgow Health BoardInventors: David Keating, Stuart Parks
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Patent number: 7253506Abstract: The present invention comprises a lead frame substrate adapted to receive semiconductor die and multiple passive components. The lead frame substrate is preferably formed from a single piece of electrically conductive material, such as copper, and may be mounted within a lead frame package or directly onto a circuit board. The lead frame substrate includes mounting surfaces adapted to receive the semiconductor dice and passive components. The mounting surfaces are linked together by temporary and/or permanent connection bars. A method to manufacture the lead frame package includes, among other steps, forming a lead frame substrate, applying a molding compound to the lead frame substrate to fix each mounting surface and connection bar in place, removing the temporary connection bars, mounting the semiconductor components on the lead frame substrate, and applying a packaging material over the lead frame substrate to encapsulate the semiconductor components.Type: GrantFiled: June 23, 2003Date of Patent: August 7, 2007Assignee: Power-One, Inc.Inventor: David Keating
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Patent number: 7145085Abstract: The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. Edge metallization of the subassembly board can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs.Type: GrantFiled: October 21, 2004Date of Patent: December 5, 2006Assignee: Power One, Inc.Inventors: David Keating, Antoin Russell, Thomas H. Templeton, Jr., Mysore Purushotham Divakar
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Publication number: 20060086522Abstract: The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. Edge metallization of the subassembly board can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs.Type: ApplicationFiled: October 21, 2004Publication date: April 27, 2006Inventors: David Keating, Antoin Russell, Thomas Templeton, Mysore Purushotham Divakar
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Patent number: 7027305Abstract: The invention provides arrangements to facilitate surface mounting of subassembly boards on a motherboard with reliable, high conductivity interconnection. In accordance with the invention, the subassembly interconnection arrangement is composed of separate power and sense connector arms formed on one or more base headers. The arrangement interconnects and supports the subassembly board on the motherboard surface. Each power arm advantageously comprises a plurality of split-based mounting lugs secured to the arm in a coplanar configuration. Each sense connector arm preferably comprises a plurality of connector pins secured to the arm in a coplanar configuration. Embodiments are disclosed for vertical and horizontal surface mounting.Type: GrantFiled: November 18, 2003Date of Patent: April 11, 2006Assignee: Power-One, Inc.Inventors: David Keating, Antoin Russell, Mysore P. Divakar, Thomas H. Templeton, John Alan Maxwell
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Patent number: 7026664Abstract: A semiconductor chip package that includes a DC—DC converter implemented with a land grid array for interconnection and surface mounting to a printed circuit board. The package includes a two layer substrate comprising a top surface and a bottom surface. At least one via array extends through the substrate. Each via in a via array includes a first end that is proximate to the top surface of the substrate and a second end that is proximate to the bottom surface of the substrate. At least one die attach pad is mounted on the top surface of the substrate and is electrically and thermally coupled to the via array. The DC—DC converter includes at least one power semiconductor die having a bottom surface that forms an electrode. The power semiconductor die is mounted on a die attach pad such that the bottom surface of the die is in electrical contact with the die attach pad. The bottom of the package forms a land grid array.Type: GrantFiled: April 24, 2003Date of Patent: April 11, 2006Assignee: Power-One, Inc.Inventors: Mysore Purushotham Divakar, David Keating, Antoin Russell
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Patent number: 6984156Abstract: In accordance with the invention a surface mount connector is provided for vertically mounting one circuit device on another. By “vertically mounting” is meant that a circuit device with a major surface is mounted perpendicular to the major surface of another circuit device. The connector is a conductive body comprising a base section and a transverse section, the base section having a width greater than the transverse section and a length which extends beyond the transverse section. Advantageously, the base section extends beyond the transverse section in front, behind and on both sides. In typical use, a major surface of a subassembly can be connected to the transverse section and an edge of the subassembly can be connected to the base extensions. The base can then be connected to the mother board.Type: GrantFiled: November 18, 2003Date of Patent: January 10, 2006Assignee: Power-One LimitedInventors: David Keating, Antoin Russell
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Patent number: 6940724Abstract: A semiconductor chip package that includes a DC—DC converter implemented with a land grid array (LGA) package for interconnection and surface mounting to a printed circuit board. The LGA package integrates all required active components of the DC—DC power converter, including a synchronous buck PWM controller, driver circuits, and MOSFET devices. In particular, the LGA package comprises a substrate having a top surface and a bottom surface, with a DC—DC converter provided on the substrate. The DC—DC converter including at least one power silicon die disposed on the top surface of the substrate. A plurality of electrically and thermally conductive pads are provided on the bottom surface of the substrate in electrical communication with the DC—DC converter through respective conductive vias. The plurality of pads include first pads having a first surface area and second pads having a second surface area, the second surface area being substantially larger than the first surface area.Type: GrantFiled: October 22, 2003Date of Patent: September 6, 2005Assignee: Power-One LimitedInventors: Mysore Purushotham Divakar, David Keating, Antoin Russell
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Publication number: 20050052849Abstract: The invention provides arrangements to facilitate surface mounting of subassembly boards on a motherboard with reliable, high conductivity interconnection. In accordance with the invention, the subassembly interconnection arrangement is composed of separate power and sense connector arms formed on one or more base headers. The arrangement interconnects and supports the subassembly board on the motherboard surface. Each power arm advantageously comprises a plurality of split-based mounting lugs secured to the arm in a coplanar configuration. Each sense connector arm preferably comprises a plurality of connector pins secured to the arm in a coplanar configuration. Embodiments are disclosed for vertical and horizontal surface mounting.Type: ApplicationFiled: November 18, 2003Publication date: March 10, 2005Inventors: David Keating, Antoin Russell, Mysore Divakar, Thomas Templeton, John Maxwell
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Publication number: 20050042941Abstract: In accordance with the invention a surface mount connector is provided for vertically mounting one circuit device on another. By “vertically mounting” is meant that a circuit device with a major surface is mounted perpendicular to the major surface of another circuit device. The connector is a conductive body comprising a base section and a transverse section, the base section having a width greater than the transverse section and a length which extends beyond the transverse section. Advantageously, the base section extends beyond the transverse section in front, behind and on both sides. In typical use, a major surface of a subassembly can be connected to the transverse section and an edge of the subassembly can be connected to the base extensions. The base can then be connected to the mother board.Type: ApplicationFiled: November 18, 2003Publication date: February 24, 2005Inventors: David Keating, Antoin Russell
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Publication number: 20050003583Abstract: The present invention comprises a lead frame substrate adapted to receive semiconductor die and multiple passive components. The lead frame substrate is preferably formed from a single piece of electrically conductive material, such as copper, and may be mounted within a lead frame package or directly onto a circuit board. The lead frame substrate includes mounting surfaces adapted to receive the semiconductor dice and passive components. The mounting surfaces are linked together by temporary and/or permanent connection bars. A method to manufacture the lead frame package includes, among other steps, forming a lead frame substrate, applying a molding compound to the lead frame substrate to fix each mounting surface and connection bar in place, removing the temporary connection bars, mounting the semiconductor components on the lead frame substrate, and applying a packaging material over the lead frame substrate to encapsulate the semiconductor components.Type: ApplicationFiled: June 23, 2003Publication date: January 6, 2005Inventor: David Keating
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Patent number: 6815614Abstract: The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. A pickup cap attached at the board edge opposite the base permits pick-and-place positioning of the subassembly by conventional equipment without the need for special grippers.Type: GrantFiled: November 18, 2003Date of Patent: November 9, 2004Assignee: Power-One LimitedInventors: David Keating, Antoin Russell
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Patent number: D895285Type: GrantFiled: April 2, 2019Date of Patent: September 8, 2020Assignee: RHA Technologies LimitedInventors: Kyle Hutchison, Jo-Yun Wang, Sam Prentice, David Keating, Heather Rebecca Guyan
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Patent number: D911315Type: GrantFiled: April 2, 2019Date of Patent: February 23, 2021Assignee: RHA Technologies LimitedInventors: Kyle Hutchison, Jo-Yun Wang, Sam Prentice, David Keating, Heather Rebecca Guyan