Patents by Inventor David Kyaw

David Kyaw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMAL INTERFACE MATERIAL AND SOLDER PREFORMS
    Publication number: 20070145546
    Abstract: A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
    Type: Application
    Filed: March 6, 2007
    Publication date: June 28, 2007
    Applicant: FRY'S METALS, INC.
    Inventors: Brian Lewis, Bawa Singh, John Laughlin, David Kyaw, Anthony Ingham, Attiganal Sreeram, Leszek Hozer, Michael Liberatore, Gerard Minogue