Patents by Inventor David L. Angst

David L. Angst has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Kinetically controlled solder
    Patent number: 7009299
    Abstract: An improved method and solder composition for kinetically controlled part bonding. The method involves applying at least a first chemical element layer of an intermetallic compound to a first part and applying at least a second chemical element layer of the intermetallic compound to a second part. The first and second parts are placed together so that the chemical element layers contact each other. The parts are heated from a storage temperature to a bonding temperature which is slightly above a first melting temperature that melts the chemical element layer of one of the first and second parts into a liquid mixture. The composition of liquid mixture varies with time during heating due to the formation of the intermetallic compound therein by progressive incorporation of the other one of the first and second chemical element layers into the mixture.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: March 7, 2006
    Assignee: Agere Systems, Inc.
    Inventors: David L. Angst, David Gerald Coult, John William Osenbach, Gustav Edward Derkits, Jr., Brian Stauffer Auker
  • Kinetically controlled solder bonding
    Publication number: 20020045330
    Abstract: An improved method and solder composition for kinetically controlled part bonding. The method involves applying at least a first chemical element layer of an intermetallic compound to a first part and applying at least a second chemical element layer of the intermetallic compound to a second part. The first and second parts are placed together so that the chemical element layers contact each other. The parts are heated from a storage temperature to a bonding temperature which is slightly above a first melting temperature that melts the chemical element layer of one of the first and second parts into a liquid mixture. The composition of liquid mixture varies with time during heating due to the formation of the intermetallic compound therein by progressive incorporation of the other one of the first and second chemical element layers into the mixture.
    Type: Application
    Filed: October 29, 2001
    Publication date: April 18, 2002
    Inventors: David L. Angst, David Gerald Coult, John William Osenbach, Gustav Edward Derkits, Brian Stauffer Auker
  • Kinetically controlled solder bonding
    Patent number: 6342442
    Abstract: An improved method and solder composition for kinetically controlled part bonding. The method involves applying at least a first chemical element layer of an intermetallic compound to a first part and applying at least a second chemical element layer of the intermetallic compound to a second part. The first and second parts are placed together so that the chemical element layers contact each other. The parts are heated from a storage temperature to a bonding temperature which is slightly above a first melting temperature that melts the chemical element layer of one of the first and second parts into a liquid mixture. The composition of liquid mixture varies with time during heating due to the formation of the intermetallic compound therein by progressive incorporation of the other one of the first and second chemical element layers into the mixture.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: January 29, 2002
    Assignee: Agere Systems Guardian Corp.
    Inventors: David L. Angst, David Gerald Coult, John William Osenbach, Gustav Edward Derkits, Jr., Brian Stauffer Auker