Abstract: A semiconductor optical emitting device comprises an at least partially transparent substrate, an active semiconductor structure, a dielectric layer and a metal layer. The substrate comprises a first surface, a second surface and at least one sidewall. The active semiconductor structure comprises a first surface, a second surface and at least one sidewall, the first surface of the active semiconductor structure facing the second surface of the substrate. The dielectric layer surrounds at least a portion of the at least one sidewall of the active semiconductor structure. The metal layer surrounds at least a portion of the dielectric layer. The at least one sidewall of the active semiconductor structure is tapered and a first portion of the at least one sidewall of the active semiconductor structure has a different tapering than a second portion of the at least one sidewall of the active semiconductor structure.

Abstract: An anonymous non-emergency help system matches capabilities of potential helpers to a requestor's needs. Helpers identify the type of assistance they are willing to provide and then agree to become available anonymously. The helpers are contacted sequentially for assistance based on proximity to the requestor. The nearest helper may choose to respond or decline the request. This anonymous location process occurs sequentially, awaiting a requestor-defined timeout, until one of the identified individuals agrees to fulfill the request or until there are no other proximate individuals that meet the specific request criteria. A call for help is not broadcast, but helpers are chosen based on their disclosed skills/capabilities, attributes, and their proximity to the requestor. The attributes are related to at least one of speed and trajectory relative to the requestor, time the helper is in a particular location, and altitude difference between the requestor and the helper.

Abstract: The disclosure is directed to illumination-based charging of one or more portable devices. According to an embodiment of the disclosure, an illumination-based charging pad includes a platform, a plurality of illumination sources, a plurality of photosensitive detectors, and a controller. The controller performs a scan by activating the illumination sources and detecting reflected illumination from an illuminated surface of at least one portable device disposed upon the platform. The controller determines a set of one or more illumination sources that are at least partially overlaid by the portable device based upon the detected illumination. The controller selects one or more illumination sources for charging the portable device at least partially based upon the set of one or more illumination sources determined to be overlaid by the portable device.

Abstract: A semiconductor optical emitting device comprises an at least partially transparent substrate, an active semiconductor structure, a dielectric layer and a metal layer. The substrate comprises a first surface, a second surface and at least one sidewall. The active semiconductor structure comprises a first surface, a second surface and at least one sidewall, the first surface of the active semiconductor structure facing the second surface of the substrate. The dielectric layer surrounds at least a portion of the at least one sidewall of the active semiconductor structure. The metal layer surrounds at least a portion of the dielectric layer. The at least one sidewall of the active semiconductor structure is tapered and a first portion of the at least one sidewall of the active semiconductor structure has a different tapering than a second portion of the at least one sidewall of the active semiconductor structure.

Abstract: Various embodiments of the present invention provide systems and methods for managing solid state drives. As an example, a storage system is described that include at least a first flash memory block and a second flash memory block, and a control circuit. The first flash memory block and the second flash memory block are addressable in the storage system. The control circuit is operable to identify the first flash memory block as partially failed, receive a write request directed to the first flash memory block; and direct the write request to the second flash memory block.

Abstract: A method includes associating a spatially separate audio sensor and/or a vibration sensor with an audio processing system having one or more audio sensor(s) associated therewith. The spatially separate audio sensor is on a remote location distinct from that of the one or more audio sensor(s). The method also includes capturing information uniquely associated with an external environment of the audio processing system through the spatially separate audio sensor and/or the vibration sensor and the one or more audio sensor(s), and adapting an audio output of the audio processing system based on the captured information uniquely associated with the external environment thereof.

Abstract: A method includes associating a spatially separate audio sensor and/or a vibration sensor with an audio processing system having one or more audio sensor(s) associated therewith. The spatially separate audio sensor is on a remote location distinct from that of the one or more audio sensor(s). The method also includes capturing information uniquely associated with an external environment of the audio processing system through the spatially separate audio sensor and/or the vibration sensor and the one or more audio sensor(s), and adapting an audio output of the audio processing system based on the captured information uniquely associated with the external environment thereof.

Abstract: Various embodiments of the present invention provide systems and methods for managing solid state drives. As an example, a storage system is described that include at least a first flash memory block and a second flash memory block, and a control circuit. The first flash memory block and the second flash memory block are addressable in the storage system. The control circuit is operable to identify the first flash memory block as partially failed, receive a write request directed to the first flash memory block; and direct the write request to the second flash memory block.

Abstract: Various embodiments of the present invention provide systems and methods for managing solid state drives. As an example, a storage system is described that include at least a first flash memory block and a second flash memory block, and a control circuit. The first flash memory block and the second flash memory block are addressable in the storage system. The control circuit is operable to identify the first flash memory block as partially failed, receive a write request directed to the first flash memory block; and direct the write request to the second flash memory block.

Abstract: Various embodiments of the present invention provide systems and methods for data storage. As an example, storage devices are disclosed that include a plurality of memory blocks, an unreliable block identification circuit, and a partial failure indication circuit. Each of the plurality of memory blocks includes a plurality of memory cells that decrease in reliability over time as they are accessed. The unreliable block identification circuit is operable to determine that one or more of the plurality of memory blocks is unreliable, and the partial failure indication circuit is operable to disallow write access to the plurality of memory blocks upon determination that an insufficient number of the plurality of memory blocks remain reliable.

Abstract: Various embodiments of the present invention provide systems, methods and circuits for memories and utilization thereof. As one example, a memory system is disclosed that includes a non-volatile memory, a flash memory, and a read/write controller circuit. The read/write controller circuit is coupled to both the flash memory and the non-volatile memory, and is operable to receive a data set directed to the flash memory and to direct the data set to the random access memory.

Abstract: Various embodiments of the present invention provide systems and methods for data storage. As an example, storage devices are disclosed that include a plurality of memory blocks, an unreliable block identification circuit, and a partial failure indication circuit. Each of the plurality of memory blocks includes a plurality of memory cells that decrease in reliability over time as they are accessed. The unreliable block identification circuit is operable to determine that one or more of the plurality of memory blocks is unreliable, and the partial failure indication circuit is operable to disallow write access to the plurality of memory blocks upon determination that an insufficient number of the plurality of memory blocks remain reliable.

Abstract: Various embodiments of the present invention provide systems and methods for managing solid state drives. As an example, a storage system is described that include at least a first flash memory block and a second flash memory block, and a control circuit. The first flash memory block and the second flash memory block are addressable in the storage system. The control circuit is operable to identify the first flash memory block as partially failed, receive a write request directed to the first flash memory block; and direct the write request to the second flash memory block.

Abstract: The SAW device comprises a diamond or quartz substrate as a wave propagation layer, a piezoelectric layer on the wave propagation layer and at least one interdigitated electrode on the piezoelectric layer.

Abstract: A method for fabricating a microelectronic structure includes the steps of forming a semiconductor island on a substrate and forming a filler material on the substrate and surrounding the semiconductor island. The semiconductor island includes a first semiconductor material and has a planar island surface opposite the substrate. The filler material includes a second semiconductor material and has a planar single crystal surface adjacent the planar island surface opposite the substrate so that the planar island surface and the planar single crystal surface together define a smooth planar surface. The first semiconductor material can be diamond, and the second semiconductor material can be silicon. In addition, a microelectronic circuit can be formed on the filler material.

Abstract: A microelectronic structure includes a substrate, a semiconductor island on the substrate, and a filler material on the substrate and surrounding the semiconductor island. The semiconductor island includes a first semiconductor material and has a planar island surface opposite the substrate. The filler material includes a layer of a second semiconductor material having a planar single crystal surface adjacent the planar island surface opposite the substrate so that the planar island surface and the planar single crystal surface together define a smooth planar surface. The first semiconductor material can be diamond, and the second semiconductor material can be silicon. In addition, a microelectronic circuit can be provided on the filler material.

Abstract: Embedded IDT electrodes are provided in a multilayer structure consisting of a diamond layer on a substrate with IDT electrodes formed on the diamond and a very thin interlayer covering the interdigitated transducer structure and the diamond, thus embedding the IDT electrodes between the diamond layer and the interlayer, with a piezoelectric layer on the interlayer so that an acoustic surface wave propagates in the diamond layer. The very thin interlayer between the diamond and the piezoelectric layer greatly increases the uniformity of the piezoelectric layer but does not interfere with the acoustic properties of a SAW device.

Abstract: A diamond-based structure includes a substrate, an adhesive material on a face of the substrate, and an array of spaced apart diamond mesas bonded to the substrate by the adhesive material. In particular, each of the diamond mesas can have a growth surface adjacent the substrate and an interfacial surface opposite the substrate, and the interfacial surface can be smooth relative to the growth surface. This structure can be fabricated by providing a sacrificial substrate, forming a plurality of diamond mesas on a face of the sacrificial substrate, bonding the diamond mesas to a transfer substrate, and removing the sacrificial substrate. Accordingly, the interfacial surfaces of the diamond, which are formed adjacent the sacrificial substrate and then exposed by removing the substrate are smooth.

Abstract: A diamond-based structure includes a substrate, an adhesive material on a face of the substrate, and an array of spaced apart diamond mesas bonded to the substrate by the adhesive material. In particular, each of the diamond mesas can have a growth surface adjacent the substrate and an interfacial surface opposite the substrate, and the interfacial surface can be smooth relative to the growth surface. This structure can be fabricated by providing a sacrificial substrate, forming a plurality of diamond mesas on a face of the sacrificial substrate, bonding the diamond mesas to a transfer substrate, and removing the sacrificial substrate. Accordingly, the interfacial surfaces of the diamond, which are formed adjacent the sacrificial substrate and then exposed by removing the substrate are smooth.

Abstract: A high frequency Surface Acoustic Wave (SAW) device includes a highly oriented diamond layer adjacent a piezoelectric layer. In one embodiment, laterally spaced apart piezoelectric layers or portions confine propagation of the wave within the diamond layer. Interdigitated electrodes may be provided by electrically conductive metal lines and/or by heavily doped surface portions of the diamond layer. Undesirable reflections may be reduced by providing the piezoelectric layer with opposing ends canted at an angle from orthogonal to the axis of surface acoustic wave propagation. The surface acoustic wave device may be used as a filter, amplifier, convolver, and phase shifter. Methods for making the surface acoustic wave device are also disclosed.