Patents by Inventor David L. Feldman

David L. Feldman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8183295
    Abstract: The invention relates to a pharmaceutical composition comprising (i) a renin inhibitor, (ii) a calcium channel blocker (CCB), and a diuretic and to a method of using such composition for the treatment of cardiovascular disease.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: May 22, 2012
    Assignee: Novartis Pharmaceuticals Corporation
    Inventors: David L Feldman, Randy L Webb
  • Patent number: 6711666
    Abstract: A multi-chip module and a chip set that comprises a plurality of the multi-chip modules. The multi-chip module includes a plurality of functional circuits provided on a substrate, the circuits defining a plurality of signal inputs and outputs. A plurality of pins are secured in a single row along the periphery of the substrate and are connected to the inputs and outputs. The pins include a set of 91 signal pins, two ground pins, and a power pin, the signal pins having a configuration complying in number and signal type with the IEEE-Prequirements to define an ISA bus. The multi-hip module includes a rectangular housing wherein the pins, in the form of gull wing pins, extend laterally from a peripherally extending wall. The ISA bus pins extend along one side and partially along adjacent sides of the rectangular module.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: March 23, 2004
    Assignee: ZF Micro Solutions, Inc.
    Inventor: David L. Feldman
  • Patent number: 6101593
    Abstract: A multi-chip module and a chip set that comprises a plurality of the multi-chip modules. The multi-chip module includes a plurality of functional circuits provided on a substrate, the circuits defining a plurality of signal inputs and outputs. A plurality of pins are secured in a single row along the periphery of the substrate and are connected to the inputs and outputs. The pins include a set of 91 signal pins, two ground pins, and a power pin, the signal pins having a configuration complying in number and signal type with the IEEE-P996 Requirements to define an ISA bus. The multi-chip module includes a rectangular housing wherein the pins, in the form of gull wing pins, extend laterally from a peripherally extending wall. The ISA bus pins extend along one side and partially along adjacent sides of the rectangular module.
    Type: Grant
    Filed: November 27, 1996
    Date of Patent: August 8, 2000
    Assignee: ZF Linux Devices, Inc.
    Inventor: David L. Feldman
  • Patent number: 6038663
    Abstract: Multi-chip computer module with a CPU and other functional circuits such as serial and parallel interfaces, a hard drive interface, a floppy disk interface, a keyboard interface, and flash memory. During initialization, the module can check the wiring of a connector coupled to a serial port to determine the mode in which the module should operate, and in an operational mode, normal serial communications can be carried on through the serial port. Fail safe BIOS operation is provided by storing a BIOS program both in a read only memory (ROM) and in a flash memory, with the flash memory serving as the source of the BIOS program under normal operating conditions. If the flash memory should become erased or otherwise corrupted, the ROM can serve as the source of the BIOS program and allow the flash memory to be reprogrammed.
    Type: Grant
    Filed: January 16, 1998
    Date of Patent: March 14, 2000
    Assignee: ZF Microsystems, Inc.
    Inventor: David L. Feldman
  • Patent number: 5742844
    Abstract: A multi-chip module and a chip set that comprises a plurality of the multi-chip modules. The multi-chip module includes a plurality of functional circuits provided on a substrate, the circuits defining a plurality of signal inputs and outputs. A plurality of pins are secured in a single row along the periphery of the substrate and are connected to the inputs and outputs. The pins include a set of 91 signal pins, two ground pins, and a power pin, the signal pins having a configuration complying in number and signal type with the IEEE-Prequirements to define an ISA bus. The multi-chip module includes a rectangular housing wherein the pins, in the form of gull wing pins, extend laterally from a peripherally extending wall. The ISA bus pins extend along one side and partially along adjacent sides of the rectangular module.
    Type: Grant
    Filed: November 29, 1995
    Date of Patent: April 21, 1998
    Assignee: ZF Microsystems, Inc.
    Inventor: David L. Feldman